Abstract: A method of recovering a solvent including: supplying polymerization reactants including one or more monomers and a solvent to a reactor to obtain a polymer solution; supplying a stream including the polymer solution to a separator to separate an upper discharge stream including the solvent, wherein the solvent is in a gaseous phase, and a lower discharge stream including the polymer solution; heating a divergence stream including a part of the lower discharge stream from the separator by a heating device and refluxing the divergence stream to the separator; supplying a residue stream including a remainder of the lower discharge stream from the separator to a steam stripping process unit; and adjusting a vapor mass fraction of the divergence stream which is refluxed to the separator with a pressure adjustment valve after being heated by the heating device.

Abstract: The present invention relates to a method for treating inflammation, arthritis or disc diseases using a pharmaceutically effective amount of a mixed extract of Cibotii Rhizoma, Ledebouriellae Radix, Achyranthis Radix, Paeonia lactiflora Pall, and Glycyrrhizae Radix according to the present invention, and since the mixed extract of Cibotii Rhizoma, Ledebouriellae Radix, Achyranthis Radix, Paeonia lactiflora Pall, and Glycyrrhizae Radix increased the survival rate of macrophages in vitro, decreased the production of NO, which is involved in anti-inflammation, inhibited all of COX-2, iNOS and MMP expressions, showed nerve cell regenerative and protective effects, exhibited pain-inhibitory effect and arthritis edema-inhibitory effects in vivo, and showed disc volume decrease and absorption effect in patients of disc diseases, the mixed extract of Cibotii Rhizoma, Ledebouriellae Radix, Achyranthis Radix, Paeonia lactiflora Pall, and Glycyrrhizae Radix could be used effectively for methods for treating inflammat

Abstract: An apparatus for preventing discharge of a battery for an automobile includes a cleaner driven using the battery for an automobile, a rotation sensing unit sensing a rotation speed of the cleaner, and a controlling unit receiving information on the rotation speed of the cleaner from the rotation sensing unit and transmitting a signal externally. Whether or not the cleaner is driven is controlled in response to a driving signal of the controlling unit.

Abstract: The present invention relates to a method for treating inflammation, arthritis or disc diseases using a pharmaceutically effective amount of a mixed extract of Cibotii Rhizoma, Ledebouriellae Radix, Achyranthis Radix, Paeonia lactiflora Pall, and Glycyrrhizae Radix according to the present invention, and since the mixed extract of Cibotii Rhizoma, Ledebouriellae Radix, Achyranthis Radix, Paeonia lactiflora Pall, and Glycyrrhizae Radix increased the survival rate of macrophages in vitro, decreased the production of NO, which is involved in anti-inflammation, inhibited all of COX-2, iNOS and MMP expressions, showed nerve cell regenerative and protective effects, exhibited pain-inhibitory effect and arthritis edema-inhibitory effects in vivo, and showed disc volume decrease and absorption effect in patients of disc diseases, the mixed extract of Cibotii Rhizoma, Ledebouriellae Radix, Achyranthis Radix, Paeonia lactiflora Pall, and Glycyrrhizae Radix could be used effectively for methods for treating inflammat

Abstract: A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.

Abstract: Disclosed herein is a switched reluctance motor comprising: a rotor having a shaft disposed at a central portion thereof and having salient poles formed at an outer circumference thereof; a stator having the rotor rotatably installed therein while forming a gap and having salient poles facing the salient poles of the rotor; and an extraction pressure decreasing unit separating the rotor and the stator from a mold, wherein the rotor and the stator are made of a soft magnet composite (SMC).

Abstract: A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.

Abstract: A method of manufacturing a printed circuit board includes stacking a solder resist layer on one side of a carrier; forming a first circuit pattern, which includes a first electrode pad, on the solder resist layer; forming a conductive post on the first electrode pad; stacking and pressing the carrier onto an insulation layer stacked in an inner substrate, such that the conductive post faces the insulation layer; and removing the carrier. As the conductive posts are pressed into the insulation layers to implement interlayer connections, certain drilling processes for forming via holes may be omitted, so that the degree of freedom can be increased in designing the circuits, and the circuits can be made to have greater densities. As the circuit patterns are buried in the insulation layers, the board can be made thinner, and the attachment areas can be increased, to allow greater adhesion.

Abstract: A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.

Abstract: A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.

Abstract: A method of fabricating a multilayered printed circuit board, the method including: providing a core substrate having an outer circuit, the core substrate having a thermal expansion coefficient of 10 to 20 ppm/° C. at ?60 to 150° C.; stacking a stress-relieving insulation layer on either side of the core substrate, the stress-relieving insulation layer having a thermal expansion coefficient of ?20 to 6 ppm/° C.; and forming a metal layer on the insulation layer and forming at least one pad by removing at least one portion of the metal layer and electrically connecting the pad with the outer circuit.

Abstract: A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist.

Abstract: A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist.

Abstract: A printed circuit board including: an insulation layer; a first pattern buried in one surface of the insulation layer; a first resin layer laminated on one surface of the insulation layer to cover the first pattern; a second pattern buried in the other surface of the insulation layer; a via electrically connecting the first pattern with the second pattern; and a second resin layer laminated on the other surface of the insulation layer to cover the second pattern.

Abstract: A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.

Abstract: A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.

Abstract: A printed circuit board the includes: an insulation layer; a first circuit pattern including a first electrode pad buried in the insulation layer such that a portion of the first circuit pattern is exposed at a surface of the insulation layer; an inner substrate having the insulation layer stacked therein and having a second circuit pattern including a second electrode pad formed thereon; a conductive post buried in the insulation layer such that one end thereof is connected to the first electrode pad and the other end thereof is connected to the second electrode pad; and a solder resist layer stacked on the insulation layer.

Abstract: A semiconductor plastic package and a method of fabricating the semiconductor plastic package are disclosed. A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.

Abstract: A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.

Abstract: A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.