Patents by Inventor Josef E. Jedlicka
Josef E. Jedlicka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8368002Abstract: A photosensitive apparatus including a full width array of photosensors and a first photosensor chip. The first photosensor chip including a linear array of photosensors having a plurality of pixels arranged in a long direction and a linear variable filter adapted to transmit at least ten unique bandwidths of wavelengths of light along a length of the linear variable filter where the linear variable filter is fixedly secured to the linear array. Each respective pixel receives a unique bandwidth of wavelengths of light as a light passes through the linear variable filter and the length is aligned with the long direction. The full width array of photosensors is arranged perpendicular to a process direction of a printing device.Type: GrantFiled: October 15, 2009Date of Patent: February 5, 2013Assignee: Xerox CorporationInventors: Paul A. Hosier, Jagdish C. Tandon, Josef E. Jedlicka, Paul S. Bonino
-
Publication number: 20110089316Abstract: A photosensitive apparatus including a full width array of photosensors and a first photosensor chip. The first photosensor chip including a linear array of photosensors having a plurality of pixels arranged in a long direction and a linear variable filter adapted to transmit at least ten unique bandwidths of wavelengths of light along a length of the linear variable filter where the linear variable filter is fixedly secured to the linear array. Each respective pixel receives a unique bandwidth of wavelengths of light as a light passes through the linear variable filter and the length is aligned with the long direction. The full width array of photosensors is arranged perpendicular to a process direction of a printing device.Type: ApplicationFiled: October 15, 2009Publication date: April 21, 2011Applicant: XEROX CORPORATIONInventors: Paul A. HOSIER, Jagdish C. TANDON, Josef E. JEDLICKA, Paul S. BONINO
-
Patent number: 6998595Abstract: An architecture and manufacturing method for photosensitive chips, such as used in office equipment and digital cameras, involves creating grooves between chip areas in a wafer, and then placing a light-transmissive planar layer over the main surface of the wafer. The planar layer, which may be acrylic-based, creates a substantially planar surface over both the photosites in the chip areas and the grooves. The planar layer in turn supports one or more light-transmissive filtering layers. The arrangement avoids damage to the filtering layers when the wafer is diced along the grooves.Type: GrantFiled: March 8, 2001Date of Patent: February 14, 2006Assignee: Xerox CorporationInventors: Paul A. Hosier, Thomas Grimsley, Josef E. Jedlicka
-
Patent number: 6955989Abstract: The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.Type: GrantFiled: November 30, 2001Date of Patent: October 18, 2005Assignee: Xerox CorporationInventors: Alain E. Perregaux, Paul A. Hosier, Josef E. Jedlicka, Nicholas J. Salatino, Jagdish C. Tandon
-
Patent number: 6927381Abstract: A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.Type: GrantFiled: September 5, 2003Date of Patent: August 9, 2005Assignee: Xerox CorporationInventors: Paul A. Hosier, Jagdish C. Tandon, Josef E. Jedlicka, Gaurav Sharma, Alain E. Perregaux, Robert P. Herloski
-
Publication number: 20040164229Abstract: An architecture and manufacturing method for photosensitive chips, such as used in office equipment and digital cameras, involves creating grooves between chip areas in a wafer, and then placing a light-transmissive planar layer over the main surface of the wafer. The planar layer, which may be acrylic-based, creates a substantially planar surface over both the photosites in the chip areas and the grooves. The planar layer in turn supports one or more light-transmissive filtering layers. The arrangement avoids damage to the filtering layers when the wafer is diced along the grooves.Type: ApplicationFiled: February 23, 2004Publication date: August 26, 2004Applicant: Xerox CorporationInventors: Paul A. Hosier, Thomas Grimsley, Josef E. Jedlicka
-
Patent number: 6768565Abstract: The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.Type: GrantFiled: September 7, 2000Date of Patent: July 27, 2004Assignee: Xerox CorporationInventors: Alain E. Perregaux, Josef E. Jedlicka
-
Publication number: 20040046105Abstract: A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.Type: ApplicationFiled: September 5, 2003Publication date: March 11, 2004Applicant: Xerox CorporationInventors: Paul A. Hosier, Jagdish C. Tando, Josef E. Jedlicka, Gaurav Sharma, Alain E. Perregaux, Robert P. Herloski
-
Patent number: 6646248Abstract: A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.Type: GrantFiled: April 24, 2001Date of Patent: November 11, 2003Assignee: Xerox CorporationInventors: Paul A. Hosier, Jagdish C. Tandon, Josef E. Jedlicka, Gaurav Sharma, Alain E. Perregaux, Robert P. Herloski
-
Publication number: 20030194864Abstract: The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.Type: ApplicationFiled: November 30, 2001Publication date: October 16, 2003Applicant: Xerox Corporation.Inventors: Alain E. Perregaux, Paul A. Hosier, Josef E. Jedlicka, Nicholas J. Salatino, Jagdish C. Tandon
-
Publication number: 20020153471Abstract: A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.Type: ApplicationFiled: April 24, 2001Publication date: October 24, 2002Applicant: Xerox CorporationInventors: Paul A. Hosier, Jagdish C. Tandon, Josef E. Jedlicka, Gauray Sharma, Alain E. Perregaux, Robert P. Herloski
-
Publication number: 20020125408Abstract: An architecture and manufacturing method for photosensitive chips, such as used in office equipment and digital cameras, involves creating grooves between chip areas in a wafer, and then placing a light-transmissive planar layer over the main surface of the wafer. The planar layer, which may be acrylic-based, creates a substantially planar surface over both the photosites in the chip areas and the grooves. The planar layer in turn supports one or more light-transmissive filtering layers. The arrangement avoids damage to the filtering layers when the wafer is diced along the grooves.Type: ApplicationFiled: March 8, 2001Publication date: September 12, 2002Applicant: Xerox CorporationInventors: Paul A. Hosier, Thomas Grimsley, Josef E. Jedlicka
-
Patent number: 6316284Abstract: The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.Type: GrantFiled: September 7, 2000Date of Patent: November 13, 2001Assignee: Xerox CorporationInventors: Alain E. Perregaux, Josef E. Jedlicka
-
Patent number: 6266438Abstract: A color space transformation device includes a sensor bar. The sensor bar includes a plurality of sensor chips. Each sensor chip scans a unique section of an original image to produce first data in a first color space. A memory means stores groups of coefficients. Each group of coefficients corresponds to one of the sensor chips. A processor independently transforms each of the sections of the first data to a respective section of a second data. The transformation is performed as a function of one of the groups of coefficients corresponding to the sensor chip which produced the first data.Type: GrantFiled: September 28, 1998Date of Patent: July 24, 2001Assignee: Xerox CorporationInventors: David J. Metcalfe, Dawn M. Williams-Fuller, Joseph P. Taillie, Josef E. Jedlicka
-
Patent number: 6255133Abstract: The present invention relates to electro optical devices with a reduced filter thinning on the edge pixels and a method for reducing the thinning of filter layers on the pixels closest to the edge of an electro optical device such as a photosensitive chip, as would be used, for example, in a full-color digital copier or scanner. A semiconductor wafer includes a main surface defining a plurality of chip areas and tab regions separated by grooves, wherein the chip areas include inner photosites, outer photosites and bonding pads. A plurality of dams are deposited over the main surface in the tab regions, and a clear layer is deposited over the main surface exclusive of the bonding pads. Alternatively, a clear layer is deposited over the main surface exclusive of the bonding pads, and a plurality of tabs is then deposited in the tab regions on the main surface.Type: GrantFiled: August 18, 2000Date of Patent: July 3, 2001Assignee: Xerox CorporationInventors: Brian T. Ormond, Josef E. Jedlicka, Thomas Grimsley, Paul A. Hosier
-
Patent number: 6252220Abstract: The present invention relates to a sensor cover glass for covering photosensitive chips for generating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other digital imaging device or system. More specifically, the present invention relates to providing a sensor cover glass with an infrared filter material for blocking infrared light from reaching the photosensitive chips. This system is particularly applicable to color input imaging devices or systems.Type: GrantFiled: April 26, 1999Date of Patent: June 26, 2001Assignee: Xerox CorporationInventors: Josef E. Jedlicka, Debra S. Vent
-
Patent number: 6222180Abstract: The present invention relates to semiconductor devices with a reduced filter thinning of outer photosites and a method for reducing the thinning of filter layers of the outer photosites. A semiconductor device includes a main surface including a plurality of photosites and bonding pads defined in the main surface, wherein the photosites include inner photosites and outer photosites. The semiconductor device further includes a clear layer deposited over the main surface exclusive of the bonding pads and outer photosites, and a first primary color filter layer deposited over at least first inner photosite and first outer photosite, the first primary color filter transmitting a primary color.Type: GrantFiled: September 25, 2000Date of Patent: April 24, 2001Assignee: Xerox CorporationInventors: Brian T. Ormond, Josef E. Jedlicka, Thomas Grimsley
-
Patent number: 6201293Abstract: The present invention relates to electro optical devices with a reduced filter thinning on the edge pixels and a method for reducing the thinning of filter layers on the pixels closest to the edge of an electro optical device such as a photosensitive chip, as would be used, for example, in a full-color digital copier or scanner. A semiconductor wafer includes a main surface defining a plurality of chip areas and tab regions separated by grooves, wherein the chip areas include inner photosites, outer photosites and bonding pads. A plurality of dams are deposited over the main surface in the tab regions, and a clear layer is deposited over the main surface exclusive of the bonding pads. Alternatively, a clear layer is deposited over the main surface exclusive of the bonding pads, and a plurality of tabs is then deposited in the tab regions on the main surface.Type: GrantFiled: November 19, 1998Date of Patent: March 13, 2001Assignee: Xerox CorporationInventors: Brian T. Ormond, Josef E. Jedlicka, Thomas Grimsley, Paul A. Hosier
-
Patent number: 6198093Abstract: The present invention relates to semiconductor devices with a reduced filter thinning of outer photosites and a method for reducing the thinning of filter layers of the outer photosites. A semiconductor device includes a main surface including a plurality of photosites and bonding pads defined in the main surface, wherein the photosites include inner photosites and outer photosites. The semiconductor device further includes a clear layer deposited over the main surface exclusive of the bonding pads and outer photosites, and a first primary color filter layer deposited over at least first inner photosite and first outer photosite, the first primary color filter transmitting a primary color.Type: GrantFiled: November 19, 1998Date of Patent: March 6, 2001Assignee: Xerox CorporationInventors: Brian T. Ormond, Josef E. Jedlicka, Thomas Grimsley
-
Patent number: 6165813Abstract: Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips.Type: GrantFiled: April 3, 1995Date of Patent: December 26, 2000Assignee: Xerox CorporationInventors: Kraig A. Quinn, Brian T. Ormond, Josef E. Jedlicka