Patents by Inventor Josef Kirschbauer

Josef Kirschbauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7931270
    Abstract: A method for personalizing a plurality of documents and a personalization installation which comprises a plurality of processing stations arranged one behind the other along a longitudinal axis of the personalization installation for carrying out individual personalization steps, wherein in order to carry out the personalization steps the documents or smart cards run through one processing station in a first direction running transversely to the longitudinal axis and the other processing station in a second direction which is opposite to the first direction and likewise runs transversely to the longitudinal axis, wherein all the processing stations are oriented with their run-through directions transverse to the longitudinal axis.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: April 26, 2011
    Assignee: Muehlbauer AG
    Inventors: Josef Kirschbauer, Gunnar Kamp, Axel Schwarzmeier
  • Publication number: 20090152790
    Abstract: The invention relates to a method for personalizing a large number of security documents, documents of value or smart cards within a personalization installation which comprises a plurality of processing stations arranged one behind the other along a longitudinal axis of the personalization installation for carrying out individual personalization steps, wherein in order to carry out the personalisation steps the documents or smart cards run through one processing station in a first direction running transversely to the longitudinal axis and the other processing station in a second direction which is opposite to the first direction and likewise runs transversely to the longitudinal axis, wherein all the processing stations are oriented with their run-through directions transverse to the longitudinal axis.
    Type: Application
    Filed: May 11, 2007
    Publication date: June 18, 2009
    Applicant: Muehibauer AG
    Inventors: Josef Kirschbauer, Gunnar Kamp, Axel Schwarzmeier
  • Patent number: 6209790
    Abstract: A data medium in card form has a least one semiconductor memory element with a storage capacity of at least one megabit and has electroplated contacts for transmission of data between a data processing system the semiconductor memory elements of the data medium. Electrical conductor paths on the data medium connect the semiconductor memory element to the electroplated contacts. The electrical conductor paths are a single leadframe on which at least parts of the electroplated contacts are integrally formed. The leadframe is formed of a resilient material.
    Type: Grant
    Filed: September 26, 1997
    Date of Patent: April 3, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Detlef Houdeau, Josef Kirschbauer, Christoph Filser
  • Patent number: 6072698
    Abstract: A heat flow which is introduced into a chip module from the outside is specifically controlled to avoid delaminations between a covering composition and a chip during a hot-melt incorporation process. This takes place either by a heat-insulating layer which is interposed between a flexible carrier tape of the chip module and a chip adhesively fixed thereon, or by clearances within an area or layer of metal contacts. As a result, a heat flow from a hollow punch brought down in an outer region of the metal contacts, in the direction of the centrally mounted chip, is prevented.
    Type: Grant
    Filed: March 27, 1998
    Date of Patent: June 6, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Detelf Houdeau, Josef Kirschbauer, Hans-Georg Mensch, Peter Stampka, Hans-Hinnerk Steckhan
  • Patent number: 6068191
    Abstract: The smart card has a semiconductor chip combined with a leadframe. The smart card is rendered operationally and functionally reliable with regard to bending and tensile stresses, in that the connecting tabs which form the electrical contacts of the leadframe are extended to the outside and embedded in the plastic card body. Beads are incorporated for the additional relief of mechanical stresses.
    Type: Grant
    Filed: February 1, 1999
    Date of Patent: May 30, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Dieter Dlugosch, Roland Prass, Josef Kirschbauer, Gunter Didschies
  • Patent number: 5917705
    Abstract: A chip card includes a plastic card. A plastic body is disposed in the plastic card and a semiconductor chip is surrounded by the plastic body. Contact strips are electrically connected with the semiconductor chip and are connected to the plastic card. The contact strips have a flexible region near and outside of the plastic body and are advantageously parts of a lead frame. An adhesive which joins the contact strips to the plastic card has at least three layers including a middle layer of flexible material.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: June 29, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Josef Kirschbauer, Erich Hopf, Gunther Gronninger, Jurgen Fischer, Gunter Didschies, Josef Mundigl, Michael Rogalli
  • Patent number: 5883429
    Abstract: A chip cover for complete or partial covering of electrical, electronic, optoelectronic and/or electromechanical components includes an activator capable of fully or partially destroying the electrical, electronic, optoelectronic and/or electromechanical components of the chip when activated. The activator can be activated by an attempt to remove the chip cover from the chip. In this way it is possible to reliably prevent reverse engineering and/or manipulation of the chip.
    Type: Grant
    Filed: October 27, 1997
    Date of Patent: March 16, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Detlef Houdeau, Josef Kirschbauer, Christl Niederle, Peter Stampka, Hans-Hinnerk Steckhan
  • Patent number: 5874354
    Abstract: A method for electrically connecting a semiconductor chip to at least one contact surface uses a thin wire having a first end welded to the at least one contact surface and a second end connected to a contact zone of the semiconductor chip. In order to produce a good connection between the wire and the contact zone of the semiconductor chip, the second end of the wire is welded to a metal piece in the form of a wedge which is disposed on the contact zone of the semiconductor chip and is connected in a conductive manner thereto. The metal piece is formed by a nailhead contact having a free end which is guided in a loop and is connected to the nailhead by a wedge contact. A smart card module and a smart card are produced by the method.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: February 23, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Josef Heitzer, Josef Kirschbauer, Peter Stampka
  • Patent number: D365092
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: December 12, 1995
    Assignee: Siemens Aktiengesellschaft
    Inventors: Josef Mundigl, Josef Kirschbauer