Chipcard module

Description

FIG. 1 is a top-plan view of a chipcard module showing our new design;

FIG. 2 is a bottom-plan view thereof;

FIG. 3 is a right-side elevational view thereof;

FIG. 4 is a left-side elevational view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a cross-sectional view thereof taken along the line VII--VII of FIGS. 1 and 2; and,

FIG. 8 is a cross-sectional view thereof taken along the line VIII--VIII of FIGS. 1 and 2.

Referenced Cited
U.S. Patent Documents
D342728 December 28, 1993 Gloton
D344502 February 22, 1994 Gloton
D353135 December 6, 1994 Gloton
D353136 December 6, 1994 Gloton
5003520 March 26, 1991 Grieu et al.
5055662 October 8, 1991 Hasegawa
Patent History
Patent number: D365092
Type: Grant
Filed: Feb 14, 1994
Date of Patent: Dec 12, 1995
Assignee: Siemens Aktiengesellschaft (Munich)
Inventors: Josef Mundigl (Nittendorf), Josef Kirschbauer (Blaibach)
Primary Examiner: A. Hugo Word
Assistant Examiner: M. H. Tung
Attorneys: Herbert L. Lerner, Laurence A. Greenberg
Application Number: 0/18,711
Classifications
Current U.S. Class: D14/117