Chipcard module
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Description
FIG. 1 is a top-plan view of a chipcard module showing our new design;
FIG. 2 is a bottom-plan view thereof;
FIG. 3 is a right-side elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a cross-sectional view thereof taken along the line VII--VII of FIGS. 1 and 2; and,
FIG. 8 is a cross-sectional view thereof taken along the line VIII--VIII of FIGS. 1 and 2.
Referenced Cited
Patent History
Patent number: D365092
Type: Grant
Filed: Feb 14, 1994
Date of Patent: Dec 12, 1995
Assignee: Siemens Aktiengesellschaft (Munich)
Inventors: Josef Mundigl (Nittendorf), Josef Kirschbauer (Blaibach)
Primary Examiner: A. Hugo Word
Assistant Examiner: M. H. Tung
Attorneys: Herbert L. Lerner, Laurence A. Greenberg
Application Number: 0/18,711
Type: Grant
Filed: Feb 14, 1994
Date of Patent: Dec 12, 1995
Assignee: Siemens Aktiengesellschaft (Munich)
Inventors: Josef Mundigl (Nittendorf), Josef Kirschbauer (Blaibach)
Primary Examiner: A. Hugo Word
Assistant Examiner: M. H. Tung
Attorneys: Herbert L. Lerner, Laurence A. Greenberg
Application Number: 0/18,711
Classifications
Current U.S. Class:
D14/117