Patents by Inventor Josef Lang
Josef Lang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12248088Abstract: A radar semiconductor chip includes a radar circuit component configured to generate at least part of a frequency-modulated ramp signal or process at least part of a reflected frequency-modulated ramp signal according to a control parameter; a memory configured to store a sequencing program associated with regulating the control parameter, wherein the sequencing program specifies a first data source, external to the sequencing program, that is configured to provide a first data value corresponding to the control parameter; and a decoder configured to read the sequencing program, access the first data value from the first data source specified by the sequencing program, derive a first control value for the control parameter from the first data value, and provide the first control value to the radar circuit component. The radar circuit component regulates a controlled circuit function in accordance with the control parameter based on the first control value.Type: GrantFiled: December 3, 2021Date of Patent: March 11, 2025Assignee: Infineon Technologies AGInventors: Rainer Findenig, Bernhard Greslehner-Nimmervoll, Grigory Itkin, Markus Josef Lang, Ulrich Moeller, Martin Wiessflecker
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Publication number: 20240402324Abstract: A radar apparatus includes a transmitter circuit. The transmitter circuit is configured to transmit, via a first transmit channel, a first sequence of FMCW radar chirps, and to transmit, via at least a second transmit channel, a second sequence of FMCW radar chirps concurrently with the first sequence of FMCW radar chirps. The radar apparatus includes a control circuit configured to control the first and second transmit channels to set phases of the FMCW radar chirps of the first and second sequences in accordance with a phase modulation scheme that includes a first unique phase code sequence assigned to the first sequence of FMCW radar chirps, and a second unique phase code sequence assigned to the second sequence of FMCW radar chirps. The first unique phase code sequence is combined with a scrambling phase code sequence. The second unique phase code sequence is combined with the scrambling phase code sequence.Type: ApplicationFiled: May 20, 2024Publication date: December 5, 2024Inventors: Philipp SCHERZ, Markus Josef LANG, Ulrich MOELLER, Clemens PFEFFER
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Patent number: 12014998Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.Type: GrantFiled: May 5, 2023Date of Patent: June 18, 2024Assignee: Infineon Technologies AGInventors: Ernst Seler, Markus Josef Lang, Maciej Wojnowski
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Publication number: 20230275046Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.Type: ApplicationFiled: May 5, 2023Publication date: August 31, 2023Inventors: Ernst SELER, Markus Josef LANG, Maciej WOJNOWSKI
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Publication number: 20230268630Abstract: A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.Type: ApplicationFiled: May 1, 2023Publication date: August 24, 2023Inventor: Markus Josef LANG
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Publication number: 20230176180Abstract: A radar semiconductor chip includes a radar circuit component configured to generate at least part of a frequency-modulated ramp signal or process at least part of a reflected frequency-modulated ramp signal according to a control parameter; a memory configured to store a sequencing program associated with regulating the control parameter, wherein the sequencing program specifies a first data source, external to the sequencing program, that is configured to provide a first data value corresponding to the control parameter; and a decoder configured to read the sequencing program, access the first data value from the first data source specified by the sequencing program, derive a first control value for the control parameter from the first data value, and provide the first control value to the radar circuit component. The radar circuit component regulates a controlled circuit function in accordance with the control parameter based on the first control value.Type: ApplicationFiled: December 3, 2021Publication date: June 8, 2023Applicant: Infineon Technologies AGInventors: Rainer FINDENIG, Bernhard GRESLEHNER-NIMMERVOLL, Grigory ITKIN, Markus Josef LANG, Ulrich MOELLER, Martin WIESSFLECKER
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Patent number: 11668796Abstract: A method is proposed for determining at least one calibration parameter for a radar system having a first radar transceiver and a second radar transceiver. The method includes performing a first calibration measurement and a second calibration measurement. The first calibration measurement and the second calibration measurement both include generating a first frequency-modulated oscillation signal and a second frequency-modulated oscillation signal, and combining the first oscillation signal received via the second terminal with the second oscillation signal, in order to generate a first difference signal for the first calibration measurement and a second difference signal for the second calibration measurement, both having a frequency difference between the first oscillation signal and the second oscillation signal.Type: GrantFiled: November 17, 2020Date of Patent: June 6, 2023Assignee: Infineon Technologies AGInventors: Philipp Scherz, Markus Josef Lang, Roland Vuketich
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Patent number: 11658135Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.Type: GrantFiled: January 21, 2020Date of Patent: May 23, 2023Assignee: Infineon Technologies AGInventors: Ernst Seler, Markus Josef Lang, Maciej Wojnowski
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Patent number: 11646479Abstract: A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.Type: GrantFiled: January 15, 2020Date of Patent: May 9, 2023Assignee: Infineon Technologies AGInventor: Markus Josef Lang
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Patent number: 11482771Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.Type: GrantFiled: January 12, 2021Date of Patent: October 25, 2022Assignee: Infineon Technologies AGInventors: Thomas Lampersberger, Reinhard Feger, Markus Josef Lang, Juergen Minichshofer, Ernst Seler, Andreas Stelzer
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Patent number: 11435437Abstract: The present disclosure relates to a transmission apparatus, including at least one first RF signal connection for an RF signal having a first phase, a ring coupler having a plurality of antenna connections for coupling a plurality of antennas in the first RF signal connection, wherein the ring coupler is configured to cause, at each of different antenna connections of the ring coupler, a constructive superposition of components of the RF signal that propagate from the first RF signal connection to the respective antenna connections in different directions in the ring coupler, wherein RF signals having different phases are obtained at the different antenna connections.Type: GrantFiled: December 18, 2019Date of Patent: September 6, 2022Inventors: Philipp Scherz, Markus Josef Lang, Roland Vuketich
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Publication number: 20210218127Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.Type: ApplicationFiled: January 12, 2021Publication date: July 15, 2021Inventors: Thomas LAMPERSBERGER, Reinhard FEGER, Markus Josef LANG, Juergen MINICHSHOFER, Ernst SELER, Andreas STELZER
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Publication number: 20210156959Abstract: A method is proposed for determining at least one calibration parameter for a radar system having a first radar transceiver and a second radar transceiver. The method includes performing a first calibration measurement and a second calibration measurement. The first calibration measurement and the second calibration measurement both include generating a first frequency-modulated oscillation signal and a second frequency-modulated oscillation signal, and combining the first oscillation signal received via the second terminal with the second oscillation signal, in order to generate a first difference signal for the first calibration measurement and a second difference signal for the second calibration measurement, both having a frequency difference between the first oscillation signal and the second oscillation signal.Type: ApplicationFiled: November 17, 2020Publication date: May 27, 2021Applicant: Infineon Technologies AGInventors: Philipp SCHERZ, Markus Josef LANG, Roland VUKETICH
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Publication number: 20200251430Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.Type: ApplicationFiled: January 21, 2020Publication date: August 6, 2020Inventors: Ernst SELER, Markus Josef LANG, Maciej WOJNOWSKI
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Publication number: 20200235453Abstract: A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.Type: ApplicationFiled: January 15, 2020Publication date: July 23, 2020Inventor: Markus Josef LANG
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Publication number: 20200217923Abstract: The present disclosure relates to a transmission apparatus, including at least one first RF signal connection for an RF signal having a first phase, a ring coupler having a plurality of antenna connections for coupling a plurality of antennas in the first RF signal connection, wherein the ring coupler is configured to cause, at each of different antenna connections of the ring coupler, a constructive superposition of components of the RF signal that propagate from the first RF signal connection to the respective antenna connections in different directions in the ring coupler, wherein RF signals having different phases are obtained at the different antenna connections.Type: ApplicationFiled: December 18, 2019Publication date: July 9, 2020Applicant: Infineon Technologies AGInventors: Philipp SCHERZ, Markus Josef LANG, Roland VUKETICH
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Patent number: 10501013Abstract: The present disclosure describes a lighting system for vehicle interiors, comprising a light source that emits visible light and a component arranged relative to the light source in such a manner that light emitted from the light source passes through it. The lighting system further comprises a transparent substrate with a surface area through which light emitted from the light source passes, and a lenticular screen structure having a plurality of regularly arranged lens elements and being formed on the surface area of the transparent substrate. The present disclosure also describes using the lighting system and its component to illuminate the interior of vehicles, wherein generated three-dimensional lighting effects can be perceived differently by a viewer/occupant in the interior space, depending on the angle of viewing.Type: GrantFiled: October 7, 2015Date of Patent: December 10, 2019Assignee: Lisa Draexlmaier GmbHInventors: Markus Wimmer, Josef Lang, Alexandr Zaviyalov
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Patent number: 9891369Abstract: An equipment part may comprise a carrier, a composite film, and a light source. The composite film may be disposed on the carrier and may form a visible side of the equipment part. The composite film may comprise a light-conducting layer into which the light rays emitted by the light source are coupled. A scatter layer may be disposed on a side of the light-conducting layer facing the carrier, with the light rays coupled into the light-conducting layer emitting through said scatter layer. The composite film may comprise a first and a second paint layer, where the first paint layer may be disposed on a side of the scatter layer facing the carrier, and the second paint layer may be disposed on a side of the light-conducting layer facing away from the carrier. The equipment part may be produced via a method for production of such an equipment part.Type: GrantFiled: August 28, 2015Date of Patent: February 13, 2018Assignee: Lisa DraexlmaierInventors: Markus Wimmer, Manfred Winklbauer, Elena Justus-Bischler, Josef Lang, Bernhard Bayersdorfer, Josef Lurz
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Publication number: 20170349095Abstract: The present disclosure describes a lighting system for vehicle interiors, comprising a light source that emits visible light and a component arranged relative to the light source in such a manner that light emitted from the light source passes through it. The lighting system further comprises a transparent substrate with a surface area through which light emitted from the light source passes, and a lenticular screen structure having a plurality of regularly arranged lens elements and being formed on the surface area of the transparent substrate. The invention present disclosure also describes using the lighting system and its component to illuminate the interior of vehicles, wherein generated three-dimensional lighting effects can be perceived differently by a viewer/occupant in the interior space, depending on the angle of viewing.Type: ApplicationFiled: October 7, 2015Publication date: December 7, 2017Applicant: Lisa Draexlmaier GmbHInventors: Markus WIMMER, Josef LANG, Alexandr ZAVIYALOV
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Publication number: 20160062022Abstract: The present invention relates to an equipment part, in particular for a motor vehicle, comprising a carrier (1), a composite film (2), and a light source (3). The composite film (2) is disposed on the carrier (1) and forms the visible side (4) of the equipment part. The composite film (2) comprises a light-conducting layer (5), a scatter layer (6), and two paint layers (7, 8), so that light rays (9) generated by the light source (3) can be coupled into the composite film, and the visible side (4) of the equipment part is extensively illuminated with the aid of the composite film (2). The present invention further comprises a method for the production of such an equipment part.Type: ApplicationFiled: August 28, 2015Publication date: March 3, 2016Inventors: Markus WIMMER, Manfred WINKLBAUER, Elena JUSTUS-BISCHLER, Josef LANG, Bernhard BAYERSDORFER, Josef LURZ