Abstract: Systems, methods and circuits for regulator minimum load control. In one particular case, a system is provided that includes a load control circuit and a switched load. The load control circuit includes a reference current, and a sense current representative of a load current. In addition, the load control circuit includes a comparator circuit that drives a control signal in response to a comparison between the reference current and the sense current. The switched load is electrically coupled to a load voltage signal to provide loading to the load voltage signal. The switched load is operable to switch between a first loading factor and a second loading factor in response to the control signal.

Abstract: The present invention includes a MOS device (100) that has a P-type substrate (102) and an N-type drain region (104) formed within the substrate (102). An annular N-type source region (106) generally surrounds the drain region (104). The source region (106) serves as both the source for the MOS device (100) and a sacrificial collector guard ring for an electrostatic discharge protection circuit. An annular gate region (110) generally surrounds the drain region (104) and is electrically insulated from the drain region (104) and electrically connected to the source region (106). An annular P-type bulk region (108) generally surrounds the source region (106) and is electrically connected to the source region (106).

Abstract: An EEPROM cell (10) formed on a substrate (18) using conventional process steps is provided. The cell (10) includes first (12) and second (14) conductive regions in the substrate (18) below the substrate's outer surface (28), and the first (12) and second (14) conductive regions are laterally displaced from one another by a predetermined distance (32). The cell (10) also includes an insulating layer (20) outwardly from the outer surface (28) of the substrate (18) positioned so that its edges are substantially in alignment between the first (12) and second (14) conductive regions. The cell (10) further includes a floating gate layer (22) outwardly from the insulating layer (20) and in substantially the same shape as the insulating layer (20). The cell (10) also includes a diffusion region (24 or 26) that extends laterally from at least one of the first (12) and second (14) conductive regions so as to overlap with the insulating layer (20).

Abstract: A high-breakdown voltage transistor (30; 30′) is disclosed. The transistor (30; 30′) is formed into a well arrangement in which a shallow, heavily doped, well (44) is disposed at least partially within a deeper, more lightly-doped well (50), both formed into an epitaxial layer (43) of the substrate (42). The deep well (50) is also used, by itself, for the formation of high-voltage transistors, while the shallower well (44) is used by itself in low-voltage, high-performance transistors. This construction permits the use of high-performance, and precisely matching, transistors in high bias voltage applications, without fear of body-to-substrate (or “back-gate-to-substrate”) junction breakdown.

Abstract: One aspect of the invention is an integrated circuit (10 or 110) comprising an amplifier (11 or 111) having at least two poles in its frequency response and an output impedance compensation circuit (M1A, M2, M3, AC1 or M1A, M2, M3, M4, AC1) coupled to an output node (30) of the amplifier (11 or 111). The output impedance compensation circuit (M1A, M2, M3, AC1 or M1A, M2, M3, M4, AC1) is operable to create a feedback signal proportional to the impedance of an output load (50) coupled to the output node (30), and create a zero in the frequency response of the amplifier (11 or 111) in response to the feedback signal between the at least two poles.

Abstract: An integrated circuit (10) having at least one programmable fuse (F1) and ESD circuitry (MN3, MN1) preventing the fuse (F1) from being unintentionally blown when a voltage transient exists on a main voltage potential (Vmain). The ESD circuitry preferably comprises of MOSFET switches which are coupled to turn on quicker than a main fuse programming switch (MNmain) due to the voltage transient, thereby insuring that the main switch remains off during the voltage transient to prevent the unintentional blowing of the fuse F1. The circuit is well suited for programmable logic device (PLDs), allowing for read voltages as low as 6 volts, and allowing for programming voltages as high as 40 volts.

Abstract: A high-breakdown voltage transistor (30; 30′) is disclosed. The transistor (30; 30′) is formed into a well arrangement in which a shallow, heavily doped, well (44) is disposed at least partially within a deeper, more lightly-doped well (50), both formed into an epitaxial layer (43) of the substrate (42). The deep well (50) is also used, by itself, for the formation of high-voltage transistors, while the shallower well (44) is used by itself in low-voltage, high-performance transistors. This construction permits the use of high-performance, and precisely matching, transistors in high bias voltage applications, without fear of body-to-substrate (or “back-gate-to-substrate”) junction breakdown.

Abstract: Provided is a symmetrical filter that uses a single comparator. In addition to a voltage divider, a current regulator, and a comparator, the filter of the invention provides control logic that turns on or off a pull up switch and/or pull down switch in order to fully charge or fully discharge a capacitor. Accordingly, in one aspect, the invention is a control logic for a symmetrical filter. Furthermore, timing logic is provided to provide for a more rigorous symmetrical filter performance.

Abstract: A high-breakdown voltage transistor (30; 30′) is disclosed. The transistor (30; 30′) is formed into a well arrangement in which a shallow, heavily doped, well (44) is disposed at least partially within a deeper, more lightly-doped well (50), both formed into an epitaxial layer (43) of the substrate (42). The deep well (50) is also used, by itself, for the formation of high-voltage transistors, while the shallower well (44) is used by itself in low-voltage, high-performance transistors. This construction permits the use of high-performance, and precisely matching, transistors in high bias voltage applications, without fear of body-to-substrate (or “back-gate-to-substrate”) junction breakdown.

Abstract: An integrated circuit (10) is disclosed comprising a fundamental frequency oscillator comprising a reference node (32) whose voltage varies between a high threshold and a low threshold. The fundamental frequency oscillator is operable to generate a first output at the fundamental frequency on a first output node (36). The integrated circuit (10) also comprises a circuit (C2) coupled to the reference node. The circuit (C2) is operable to sense the voltage at the reference node (32), to determine when the voltage exceeds an intermediate threshold between the high threshold and the low threshold, and to generate a second output in response to the determination. The integrated circuit (10) also comprises logic (40) coupled to the circuit (C2) and load circuitry (50) coupled to the logic (40). The logic (40) is operable to generate an output signal at an output frequency greater than the fundamental frequency in response to the second output and the first output.

Abstract: An EEPROM cell (10) formed on a substrate (18) using conventional process steps is provided. The cell (10) includes first (12) and second (14) conductive regions in the substrate (18) below the substrate's outer surface (28), and the first (12) and second (14) conductive regions are laterally displaced from one another by a predetermined distance (32). The cell (10) also includes an insulating layer (20) outwardly from the outer surface (28) of the substrate (18) positioned so that its edges are substantially in alignment between the first (12) and second (14) conductive regions. The cell (10) further includes a floating gate layer (22) outwardly from the insulating layer (20) and in substantially the same shape as the insulating layer (20). The cell (10) also includes a diffusion region (24 or 26) that extends laterally from at least one of the first (12) and second (14) conductive regions so as to overlap with the insulating layer (20).

Abstract: A controlled area network (CAN) driver provides improved symmetry between its differential output signals CAN-H and CAN-L, and provides protection for its low voltage devices from voltage transients occurring on its output lines. A plurality of CAN drivers 80 are serially interconnected to form a driver system, wherein each downstream driver stage receives a time-delayed form of the digital input signal TxD, each stage providing a time-delayed contribution to the differential output signals of the overall driver system.

Abstract: An EEPROM cell (10) formed on a substrate (18) using conventional process steps is provided. The cell (10) includes first (12) and second (14) conductive regions in the substrate (18) below the substrate's outer surface (28), and the first (12) and second (14) conductive regions are laterally displaced from one another by a predetermined distance (32). The cell (10) also includes an insulating layer (20) outwardly from the outer surface (28) of the substrate (18) positioned so that its edges are substantially in alignment between the first (12) and second (14) conductive regions. The cell (10) further includes a floating gate layer (22) outwardly from the insulating layer (20) and in substantially the same shape as the insulating layer (20). The cell (10) also includes a diffusion region (24 or 26) that extends laterally from at least one of the first (12) and second (14) conductive regions so as to overlap with the insulating layer (20).

Abstract: A voltage level shifting circuit (60) and method for accomplishing a voltage level change includes a voltage level shifting circuit (65) to change an input voltage to a shifted voltage level. A second stage (67) is connected between a voltage source at the shifted voltage level (68) and the reference potential. The second stage (67) includes active devices (66,82) that are controlled by the voltage level shifting circuit (65). The second stage (67) also includes slope resistors (86,88) connected in series between the active devices (66,82) of the second stage (67).

Abstract: An integrated circuit chip (10, 50, 100) may comprise an integrated circuit (14, 54, 108, 110, 112) formed in a semiconductor layer (12, 52, 102). A thermal contact (16, 56, 116) may be formed at a high temperature region of the integrated circuit (14, 54, 108, 110, 112). A thick plated metal layer (40, 80, 140) may be generally isolated from the integrated circuit (14, 54, 108, 110, 112). The thick plated metal layer (40, 80, 140) may include a base (42, 82, 142) and an exposed surface (44, 84, 144) opposite the base (42, 82, 142). The base (42, 82, 142) may be coupled to the thermal contact (16, 56, 116) to receive thermal energy of the high temperature region. The exposed surface (44, 84, 144) may dissipate thermal energy received by the thick plated metal layer (40, 80, 140).

Abstract: A internal circuitry protection scheme which protects on-IC circuitry when an external pin is shorted to a higher than normal voltage. The disclosed solution eliminates cross-talk due to a parasitic NPN.

Abstract: A circuit for protecting a transistor against electrical transients. The circuit comprises a first diode coupled between a first terminal coupled to a power supply and a control terminal of the protected transistor. The circuit also comprises a second diode and a resistor coupling the control terminal of the protected transistor to a reference potential. A second transistor is coupled in shunt to the protected transistor. The voltage on the control terminal of the second transistor is determined by the current through the resistor. The embodiments may be implemented in an integrated circuit wherein the second, shunting transistor is formed from parasitic elements within the semiconductor body in which the protected transistor is formed. In one embodiment, the protected MOS transistor is formed in an n-well 504 and a shunting bipolar transistor is formed between the n-well 504 and an n-doped guard ring 500 formed adjacent to the n-well in the p-doped substrate 508.

Abstract: A transistor including a source region 506 in a semiconductor body 502; a bulk region 508 in the semiconductor body adjacent the source region; a drain region in the semiconductor body adjacent the bulk region but opposite the source region, the drain region including doped regions 504,514 of n and p dopant types; and a field plate 516 formed over the semiconductor body adjacent the drain region between the drain region and the bulk region.

Abstract: An internal circuitry protection scheme which protects on-IC circuitry when an external regulator voltage pin is shorted to a higher voltage. The circuit prevents damage to the on-die circuitry that is on the internal voltage rail, by clamping the received voltage, thereby eliminating the chance of damaging the on die circuitry. The circuit offers protection even if the voltage difference is large, but the difference remains small between the internal rail and the external regulated voltage under normal operation.

Abstract: An optimized power output clamping structure, includes a power output transistor having a first breakdown voltage and a breakdown structure having a second breakdown voltage coupled to the power output transistor. The second breakdown voltage is less than the first breakdown voltage and follows the first breakdown voltage across all temperature and semiconductor process variations. This feature allows a reduction in breakdown voltage guardbanding and increases output structure reliability. A method of protecting a circuit from inductive flyback is also disclosed. The method includes the steps of driving an inductive load with drive circuitry, turning off the inductive load, and clamping an inductive voltage at a voltage magnitude that protects the drive circuitry from breakdown across all temperature and processing variations.