Abstract: The device has a semiconductor chip having active circuitry in the face thereof. The circuitry has busing over it containing two conductive layers having a plurality of contacts and vias with spacings between them that alternate with respect to one another to provide current ballasting and improved switching uniformity. The spacings between the alternating contacts and vias provide regions of maximum conductor thickness and therefore reduces the busing resistance. Staggering the rows of alternating contacts and vias provides further current ballasting. A first conducting layer is used to contact and provide electrically isolated low resistive conducting paths to the various semiconductor regions while the second conducting region is used to provide selective contact to the first conductive layer, thus providing a means of busing large currents over active semiconductor area without sacrificing performance parameters.

Abstract: A switch mode regulator circuit is provided to facilitate the conversion from one voltage level to another in a substantially power lossless manner. The circuit is particularly advantageous in instances where the power supply can be operable in a discontinuous mode, as inductor-capacitor oscillatory transients ("ringing"), along with its associated voltage spikes at the associated output transistor source, can be avoided. Such transients and their associated voltages are avoided by clamping the gate-source voltage on the circuit's output NMOS transistor over the entire positive operation voltage range.

Abstract: A testable temperature warning circuit (120) in an integrated circuit substrate (124) provides a warning if the substrate temperature exceeds a critical temperature. A programming circuit (140) controls a selection, circuit (128) to establish a programmably selectable temperature at either the critical temperature or a second predetermined temperature lower than the critical temperature to enable the warning circuit operation to be tested at a temperature lower than the critical temperature. In one embodiment, the selection circuit 128 comprises a current source that produces a voltage drop across the resistor 121 and base-emitter of the transistor 122 produces a substrate temperature indicating current of magnitude related to the temperature of the substrate. The substrate temperature indicating current at the second temperature is extrapolatingly related to the substrate temperature indicating current at the critical temperature.

Abstract: A circuit and method for providing a low drop out voltage regulator. A source follower circuit is provided having a transistor (MD1) with an output terminal for driving a load at its source terminal and a voltage supply coupled to the drain terminal. At least one diode (D1) is coupled between the gate terminal and a ground reference to provide a predetermined voltage at the gate of the transistor (MD1). A voltage multiplier circuit is provided having an input (IN) for receiving an oscillating input voltage and a charge storage device (39) coupled between the oscillating input and a voltage reference (Vref), and being further coupled in series with the voltage reference and then to the gate terminal of the transistor (MD1). The oscillating input voltage is used to charge the charge storage device (39) to a voltage approximately equal to the voltage reference.

Abstract: The device has a semiconductor chip having active circuitry in the face thereof. The circuitry has busing over it containing two conductive layers having a plurality of contacts and vias with spacings between them that alternate with respect to one another to provide current ballasting and improved switching uniformity. The spacings between the alternating contacts and vias provide regions of maximum conductor thickness and therefore reduces the busing resistance. Staggering the rows of alternating contacts and vias provides further current ballasting. A first conducting layer is used to contact and provide electrically isolated low resistive conducting paths to the various semiconductor regions while the second conducting region is used to provide selective contact to the first conductive layer, thus providing a means of busing large currents over active semiconductor area without sacrificing performance parameters.

Abstract: In accordance with the present invention, an output current limit circuit for protecting a power MOS output device of an integrated circuit from an excessive drain current comprises a power MOS device 110, sensing circuitry 30 to sense a predetermined trigger current, and limitation circuitry 20 to reduce a gate-source voltage on MOS output device 110 to a predetermined approximately fixed value. A drain current I.sub.D flows through power MOS device 110 from output terminal 102 in response to the gate-source voltage. A short circuit condition may allow an excessive amount of drain current I.sub.D to flow through output terminal 102. The gate-source voltage is reduced in response to sensing the trigger current. Reducing the gate-source voltage raises a drain-source resistance of MOS device 110 and reduces drain current I.sub.D so that MOS device 110 is not damaged by the short circuit condition.

Abstract: In accordance with the present invention, an output current limit circuit for protecting a power MOS output device of an integrated circuit from an excessive drain current comprises a power MOS device 110, a means 30 to sense a predetermined trigger current, and a means 20 to reduce a gate-source voltage on MOS output device 110 to a predetermined approximately fixed value. A drain current I.sub.D flows through power MOS device 110 from output terminal 102 in response to the gate-source voltage. A short circuit condition may allow an excessive amount of drain current I.sub.D to flow through output terminal 102. The gate-source voltage is reduced in response to sensing the trigger current. Reducing the gate-source voltage raises a drain-source resistance of MOS device 110 and reduces drain current I.sub.D so that MOS device 110 is not damaged by the short circuit condition.

Abstract: An integrated power device comprises a power transistor (26) and a plurality of sense transistors (38), (40), (42), (44), and (46). Sense transistors (38), (40), (42), and (44) are constructed around the periphery of the active area occupied by power transistor (26). Sense transistor (46) is located within the interior of the active area occupied by power transistor (26) and contact is made to the necessary source region (64) of transistor (46) using a second level of metal interconnect to form a source contact (74).