Patents by Inventor Joseph C. Fjelstad

Joseph C. Fjelstad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090277677
    Abstract: A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into which production components 810 are placed and secured. Component leads 820 or packages are encapsulated with electrically insulating material 910 with vias 1030a exposing the leads. Traces 1040 connect appropriate leads forming a circuit sub-assembly 1000 which can serve as a basis for a circuit assembly formed through a reverse-interconnection process.
    Type: Application
    Filed: April 24, 2009
    Publication date: November 12, 2009
    Applicant: OCCAM Portfolio LLC
    Inventors: Joseph C. Fjelstad, Nader Gamini, David Tichane
  • Publication number: 20090278139
    Abstract: An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of a LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections.
    Type: Application
    Filed: August 12, 2008
    Publication date: November 12, 2009
    Applicant: OCCAM PORTFOLIO LLC
    Inventor: Joseph C. Fjelstad
  • Patent number: 7613011
    Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.
    Type: Grant
    Filed: May 14, 2007
    Date of Patent: November 3, 2009
    Assignee: Interconnect Portfolio LLC
    Inventors: Kevin P. Grundy, Gary Yasumura, Joseph C. Fjelstad, William F. Wiedemann, Para K. Segaram
  • Publication number: 20090237901
    Abstract: A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.
    Type: Application
    Filed: March 17, 2009
    Publication date: September 24, 2009
    Applicant: Occam Portfolio LLC
    Inventor: Joseph C. Fjelstad
  • Publication number: 20090167334
    Abstract: An interconnection structure suitable for use as an IC package, probe head or other electrical termination of high density where uninterrupted controlled impedance is desired is described.
    Type: Application
    Filed: January 2, 2009
    Publication date: July 2, 2009
    Applicant: Interconnect Portfolio LLC
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy
  • Publication number: 20090120668
    Abstract: An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.
    Type: Application
    Filed: November 14, 2007
    Publication date: May 14, 2009
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas Obenhuber, William F. Wiedemann
  • Publication number: 20090108416
    Abstract: A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.
    Type: Application
    Filed: October 31, 2007
    Publication date: April 30, 2009
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Belgacem Haba
  • Publication number: 20090091017
    Abstract: Disclosed are IC partitioned packaging and interconnection constructions that provide for improved distribution of power, ground, cross chip interconnections and clocks.
    Type: Application
    Filed: October 9, 2007
    Publication date: April 9, 2009
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, Thomas J. Obenhuber, Inessa Obenhuber
  • Publication number: 20090093173
    Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.
    Type: Application
    Filed: October 8, 2007
    Publication date: April 9, 2009
    Inventors: Gary Yasumura, Joseph C. Fjelstad, William F. Wiedemann, Para K. Segaram, Kevin P. Grundy
  • Publication number: 20090056997
    Abstract: A frame 100 containing aperture(s) 102, 103, 104 is positioned on and joined to a permanent substrate 206a or temporary substrate 206b. Electrical component(s) 202, 203, 204 are placed into respective aperture(s) 102, 103, 104 with the leads 504, 1002 of the component(s) 202, 203, 204 positioned on and attached to the permanent substrate 206a or the temporary substrate 206b. Then an encapsulant 402, electrically insulating, but preferably thermally conductive, envelops the component(s) 102, 103, 104. At this point, temporary substrate 206b may be removed exposing component leads 1002. Or, if component(s) 102, 103, 104 are mounted on permanent substrate 206a, vias 502 extend from the surface of substrate 206a to leads 504. With leads 504, 1002 exposed, the completed subassembly 500, 1000 may be incorporated into various forms of reverse-interconnection process (RIP) assemblies as detailed in related applications.
    Type: Application
    Filed: August 28, 2008
    Publication date: March 5, 2009
    Applicant: OCCAM PORTFOLIO LLC
    Inventor: Joseph C. Fjelstad
  • Publication number: 20090041977
    Abstract: The present invention provides an electronic assembly 400 and a machine 800 for its manufacture. The assembly 400 has no solder. Components 406, or component packages 402, with I/O leads 412 sit on a planar substrate. The machine 800 encapsulates the components 406 or component packages, with electrically insulating material with vias 420 extending through the substrate to the components' leads 412. Then the machine 800 plates the components' leads and forms traces. Next, the machine 800 covers the plated material with electrically insulating material. Additional vias may extend through the material covering the plated material and in turn be plated and covered. The machine 800 repeats the formation of vias, plating, and coverings of the assembly as desired.
    Type: Application
    Filed: August 6, 2008
    Publication date: February 12, 2009
    Applicant: OCCAM PORTFOLIO LLC
    Inventor: Joseph C. Fjelstad
  • Publication number: 20090035454
    Abstract: Electrical components 402, 504, 506 are placed on a carrier 508. Then the components are encapsulated in an electrically insulating material 404. The carrier 508 is removed and the leads 414 of the encapsulated components are registered to intermediate connectors 412 in a central bonding, or joining, material 406 and to respective leads 410 of a printed circuit board 408. The components, central bonding material, and printed circuit board are then joined and interconnected.
    Type: Application
    Filed: July 29, 2008
    Publication date: February 5, 2009
    Applicant: Occam Portfolio LLC
    Inventor: Joseph C. Fjelstad
  • Publication number: 20090034219
    Abstract: An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 202, 204 are stacked so that they overlap each other and are encapsulated in an electronic insulating material 104. The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 5, 2009
    Applicant: OCCAM PORTFOLIO LLC
    Inventors: Nader Gamini, Joseph C. Fjelstad
  • Publication number: 20090027137
    Abstract: Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.
    Type: Application
    Filed: May 29, 2008
    Publication date: January 29, 2009
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, Gary Yasumura
  • Publication number: 20090017264
    Abstract: A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.
    Type: Application
    Filed: July 9, 2008
    Publication date: January 15, 2009
    Applicant: OCCAM PORTFOLIO LLC
    Inventor: Joseph C. Fjelstad
  • Publication number: 20090008140
    Abstract: An electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with IPO leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.
    Type: Application
    Filed: June 27, 2008
    Publication date: January 8, 2009
    Applicant: OCCAM PORTFOLIO LLC
    Inventor: Joseph C. Fjelstad
  • Publication number: 20080297985
    Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.
    Type: Application
    Filed: August 14, 2008
    Publication date: December 4, 2008
    Applicant: OCCAM PORTFOLIO LLC
    Inventor: Joseph C. Fjelstad
  • Publication number: 20080288908
    Abstract: A printed circuit board (PCB) circuit assembly is designed utilizing software to create the best performing “total design” by selecting component layout locations, optimizing the circuit routing of the PCB copper (or other metallic) traces, and simultaneously optimizing the interconnections between a “standard” die inside an integrated circuit (IC) package and an interposer substrate of the IC package.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 20, 2008
    Applicant: Mirror Semiconductor, Inc.
    Inventors: Martin Hart, Joseph C. Fjelstad
  • Publication number: 20080277151
    Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.
    Type: Application
    Filed: May 12, 2008
    Publication date: November 13, 2008
    Applicant: OCCAM PORTFOLIO LLC
    Inventor: Joseph C. Fjelstad
  • Publication number: 20080277675
    Abstract: An electrical device in the form of a light emitting diode (LED) assembly. A plurality of LEDs are provided, wherein each has an anode and a cathode. A base holds this plurality of LEDs in a substantially fixed relationship. One or more anode conductors then each connect electrically to one or more of the LED anodes in a manner characterized by not including any solder material. Similarly, one or more cathode conductors each connect electrically to one or more of the LED cathodes in a manner characterized by not including any solder material.
    Type: Application
    Filed: May 12, 2008
    Publication date: November 13, 2008
    Applicant: OCCAM PORTFOLIO LLC
    Inventor: Joseph C. Fjelstad