Abstract: An ink cartridge for an ink jet printer includes a substratum and a cover attached to the substratum and having an aperture provided therein. A printhead is attached to the substratum and provided at least partially within the aperture. At least one connector extends from the printhead into the aperture, and an adhesive material covers at least a portion of the at least one connector. At least one barrier is provided for preventing the adhesive material from flowing to locations away from the at least one connector.

Abstract: An ink cartridge for an ink jet printer includes a substratum and a cover attached to the substratum and having an aperture provided therein. A printhead is attached to the substratum and provided at least partially within the aperture. At least one connector extends from the printhead into the aperture, and an adhesive material covers at least a portion of the at least one connector. At least one barrier is provided for preventing the adhesive material from flowing to locations away from the at least one connector.

Abstract: One embodiment of a vent seal includes a vent that defines a vent channel and a seal positioned within the channel in both a closed vent condition and in an open vent condition.

Abstract: A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.

Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

Abstract: An ink cartridge for an ink jet printer includes a substratum and a cover attached to the substratum and having an aperture provided therein. A printhead is attached to the substratum and provided at least partially within the aperture. At least one connector extends from the printhead into the aperture, and an adhesive material covers at least a portion of the at least one connector. At least one barrier is provided for preventing the adhesive material from flowing to locations away from the at least one connector.

Abstract: In one embodiment, a fluid ejection device is configured to receive a signal and ejecting fluid in response thereto, including an ink ejecting nozzle layer having a substrate with first and second surfaces joined along an edge, an insulating feature located on the first surface adjacent the edge and a flexible lead that bends around the edge and lies flush against the insulating feature.

Abstract: A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Abstract: Methods and systems of protecting substrates that are intended for use in fluidic devices are described. In accordance with one embodiment, sealant material is applied over one or more edges of at least one multi-chip module substrate that is intended for use in a fluidic device. At least one edge has an exposed electrical interconnect and the sealant material is applied over less than an entirety of the substrate and sufficiently to cover the exposed electrical interconnect. The sealant material is exposed to conditions effective to seal the one or more edges.

Abstract: A printhead assembly includes a carrier having a fluid manifold defined therein, a plurality of printhead dies each mounted on the carrier and communicating with the fluid manifold, and a fluid delivery assembly coupled with the carrier and communicating with the fluid manifold.

Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

Abstract: A method of forming a fluid ejection assembly includes providing a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, extending a support between opposite sides of each of the fluid passages, and mounting a plurality of fluid ejection devices on the substrate, including communicating each of the fluid ejection devices with one of the fluid passages.

Abstract: A printhead assembly includes a carrier having a first side and a second side contiguous with the first side, a plurality of printhead dies each mounted on the first side of the carrier, an electrical circuit including a first portion disposed on the first side of the carrier and a second portion disposed on the second side of the carrier, and a plurality of electrical connectors each electrically coupled to the first portion of the electrical circuit and one of the printhead dies. The electrical circuit has a plurality of openings defined in the first portion thereof such that each of the openings are sized to accommodate one of the printhead dies, and has a first side facing the carrier and a second side opposite the first side thereof such that each of the electrical connectors are electrically coupled to the second side of the electrical circuit and one of the printhead dies.

Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

Abstract: A carrier adapted to receive a plurality of printhead dies includes a substructure having a fluid manifold defined therein and a substrate mounted on the substructure, wherein the substrate is adapted to support the printhead dies. The substructure includes a fluid port communicating with the fluid manifold and at least one flush port communicating with the fluid manifold separate from the fluid port, and the substrate has a plurality of fluid passages defined therein with each of the fluid passages communicating with the fluid manifold.

Abstract: A printhead assembly includes a carrier having a fluid manifold defined therein, and a plurality of printhead dies each mounted on the carrier and including a first nozzle set and a second nozzle set. The fluid manifold includes a first chamber and a second chamber such that the first nozzle set of each of the printhead dies communicates with the first chamber of the fluid manifold and the second nozzle set of each of the printhead dies communicates with the second chamber of the fluid manifold.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.