Abstract: A printhead assembly includes a substrate having a first side and a second side opposite the first side, at least one electrical component mounted on the second side of the substrate, a substructure having a fluid manifold and at least one well isolated from the fluid manifold defined therein, and a plurality of printhead dies each mounted on the first side of the substrate. The substructure is disposed on the second side of the substrate such that the at least one electrical component is confined within the at least one well.

Abstract: Methods and systems of protecting substrates that are intended for use in fluidic devices are described. In accordance with one embodiment, sealant material is applied over one or more edges of at least one multi-chip module substrate that is intended for use in a fluidic device. At least one edge has an exposed electrical interconnect and the sealant material is applied over less than an entirety of the substrate and sufficiently to cover the exposed electrical interconnect. The sealant material is exposed to conditions effective to seal the one or more edges.

Abstract: A printhead assembly includes a carrier having a fluid manifold defined therein, a plurality of printhead dies each mounted on the carrier and communicating with the fluid manifold, and a fluid delivery assembly coupled with the carrier and communicating with the fluid manifold.

Abstract: A carrier adapted to receive a plurality of printhead dies includes a substructure having a fluid manifold defined therein and a substrate mounted on the substructure, wherein the substrate is adapted to support the printhead dies. The substructure includes a fluid port communicating with the fluid manifold and at least one flush port communicating with the fluid manifold separate from the fluid port, and the substrate has a plurality of fluid passages defined therein with each of the fluid passages communicating with the fluid manifold.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: This present invention is embodied in a printing system with thermally efficient heat transfer capabilities for reducing dimpling of a nozzle member during fabrication of the printhead portion of an inkjet printer. The printing system of the present invention includes a printhead assembly and an ink supply for printing ink on print media. The printhead assembly includes a printhead body having a heat transfer device, ink channels and a nozzle member having plural nozzles coupled to respective ink channels. The nozzle member is secured to the printhead body with a suitable adhesive layer. The heat transfer device can be defined by a portion of or the entire printhead body for reducing thermal expansion of the printhead body during exposure to heat.

Abstract: A fluid ejection assembly includes a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, with each of the fluid passages having a support extending between opposite sides thereof, and a plurality of fluid ejection devices each mounted on the substrate and communicating with a respective one of the fluid passages.

Abstract: A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.

Abstract: A carrier for a plurality of fluid ejection devices includes a substrate and a substructure. The substrate includes a first material and has a first side adapted to receive the fluid ejection devices and a second side opposite the first side, and the substructure is formed of a second material and joined to the second side of the substrate with a lap joint. The lap joint includes a first portion formed by a portion of one of the substrate and the substructure, a second portion formed by a portion of the other of the substrate and the substructure, and a third material interposed between the first portion and the second portion.

Abstract: A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: A printhead assembly includes a carrier including a substrate and a substructure, and a plurality of printhead dies each mounted on the substrate of the carrier. The substrate includes a first material and the substructure is formed of a second material. As such, the substrate and the substructure are joined by a lap joint.

Abstract: A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.

Abstract: A printhead assembly includes a carrier having a fluid manifold defined therein, and a plurality of printhead dies each mounted on the carrier and including a first nozzle set and a second nozzle set. The fluid manifold includes a first chamber and a second chamber such that the first nozzle set of each of the printhead dies communicates with the first chamber of the fluid manifold and the second nozzle set of each of the printhead dies communicates with the second chamber of the fluid manifold.

Abstract: A printhead assembly includes a substrate having a first side and a second side opposite the first side, at least one electrical component mounted on the second side of the substrate, a substructure having a fluid manifold and at least one well isolated from the fluid manifold defined therein, and a plurality of printhead dies each mounted on the first side of the substrate. The substructure is disposed on the second side of the substrate such that the at least one electrical component is confined within the at least one well.

Abstract: A fluid ejection assembly includes a carrier including a substrate and an electrical circuit with the substrate having a first side and a second side opposite the first side and the electrical circuit being disposed on the second side of the substrate, a fluid ejection device mounted on the first side of the substrate, and at least one electrical connector electrically coupled to the electrical circuit and the fluid ejection device, wherein the electrical circuit includes a printed circuit board such that the printed circuit board and the substrate both have at least one fluid passage extending therethrough with the at least one fluid passage communicating with the first side of the substrate and the fluid ejection device.

Abstract: A fluid ejection assembly includes a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, with each of the fluid passages having a support extending between opposite sides thereof, and a plurality of fluid ejection devices each mounted on the substrate and communicating with a respective one of the fluid passages.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Abstract: An inkjet printhead assembly includes a carrier and a plurality of printhead dies. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead dies are each mounted on the first side of the substrate and electrically coupled to the electrical circuit Thus, the substrate provides support for the printhead dies while the substrate and the electrical circuit together accommodate fluidic and electrical routing to the printhead dies.