Abstract: A heat sink assembly includes an upper heat sink element having upper plates each having sides between front and rear ends and each having inner and outer ends and a lower heat sink element having lower plates each having sides between front and rear ends and each having inner and outer ends. The lower plates include lower spacer plates and lower interface plates with the outer ends thereof thermally coupled to an electronic module. The lower interface plates include interface fins interfacing with the upper plates. The heat sink assembly includes a spring element having an upper spring member engaging the inner ends of the upper plates to bias the upper plates in a first biasing direction away from the lower plates and having a lower spring member engaging the inner ends of the lower plates to bias the lower plates in a second biasing direction away from the upper plates.

Abstract: A running tool (87) having an annulus seal assembly (86) and casing hanger (89) attached thereto may be sent into to the wellhead (1) to lock and preload the casing hanger (89) in a single trip. The running tool (87) may be rotated a first time to drop the annulus seal assembly on the casing hanger (89), a first pressure may be applied axially above the annulus seal assembly to set the annulus seal assembly, the running tool may be rotated a second time to close a gap between the annulus seal assembly and the wellhead, and a second pressure may be applied axially above the annulus seal assembly to preload the casing hanger.

Abstract: A running tool (87) having an annulus seal assembly (86) and casing hanger (89) attached thereto may be sent into to the wellhead (1) to lock and preload the casing hanger (89) in a single trip. The running tool (87) may be rotated a first time to drop the annulus seal assembly on the casing hanger (89), a first pressure may be applied axially above the annulus seal assembly to set the annulus seal assembly, the running tool may be rotated a second time to close a gap between the annulus seal assembly and the wellhead, and a second pressure may be applied axially above the annulus seal assembly to preload the casing hanger.

Abstract: A cable connector module includes a housing having a cavity and a cable connector module received in the cavity. The cable connector module includes a circuit card having rows of signal contact pads on a mounting surface. The cable connector module includes cable assemblies terminated to the circuit card arranged in rows each having a cable and a ground clip coupled to an end of the cable. The cable connector module includes a cable holder coupled to the housing that holds the cables assemblies relative to each other within the cavity of the housing.

Abstract: A diffuser for a heating, ventilation, and air conditioning (HVAC) system includes a housing defining a plenum chamber, where the housing comprises a diffusion plate configured to direct a first air flow into the plenum chamber and to discharge a second air flow from the plenum chamber and a plenum plate disposed within the housing, where the plenum plate extends from a first side of the housing to a second side of the housing opposite the first side, and the plenum plate divides the plenum chamber into a first chamber and a second chamber. The diffuser includes a plurality of apertures disposed along the plenum plate, where the plurality of apertures is configured to direct a third air flow from the first chamber into the second chamber to draw the first air flow into the plenum chamber and to force the second air flow out of the plenum chamber.

Abstract: A running tool having an annulus seal assembly and casing hanger attached thereto may be sent into to the wellhead to lock and preload the casing hanger in a single trip. The running tool may be rotated a first time to drop the annulus seal assembly on the casing hanger, a first pressure may be applied axially above the annulus seal assembly to set the annulus seal assembly, the running tool may be rotated a second time to close a gap between the annulus seal assembly and the wellhead, and a second pressure may be applied axially above the annulus seal assembly to preload the casing hanger.

Abstract: A running tool having an annulus seal assembly and casing hanger attached thereto may be sent into to the wellhead to lock and preload the casing hanger in a single trip. The running tool may be rotated a first time to drop the annulus seal assembly on the casing hanger, a first pressure may be applied axially above the annulus seal assembly to set the annulus seal assembly, the running tool may be rotated a second time to close a gap between the annulus seal assembly and the wellhead, and a second pressure may be applied axially above the annulus seal assembly to preload the casing hanger.

Abstract: A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. The thermal bridge includes upper spring elements extending from upper plates having upper mating interfaces engaging lower plates to bias the upper plates in a first biasing direction generally away from the lower bridge assembly. The thermal bridge includes lower spring elements extending from lower plates having lower mating interfaces engaging upper plates to bias the lower plates in a second biasing direction generally away from the upper bridge assembly. A bridge frame having connecting elements extends through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.

Abstract: A heat sink assembly includes a plate stack including fin plates and spacer plates with bottom edges forming a compliant thermal interface configured to interface with an electrical component. Upper edges of the fin plates are located above the spacer plates to form airflow channels between the fin plates. The heat sink assembly includes a support frame supporting the fin plates and the spacer plates in the plate stack. The support frame includes a spring support member engaging a spring element to locate the spring element relative to the support frame. The spring element engages the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component to press the bottom edges of the fin plates and the spacer plates against the electrical component.

Abstract: A thermal bridge includes upper and lower bridge assemblies including upper and lower plates arranged in stacks. Sides of the plates face each other to thermally interface the lower plates with the upper plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The thermal bridge includes an internal bridge frame having connecting elements that extend internally through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.

Abstract: A thermal bridge includes upper and lower bridge assemblies including upper and lower plates arranged in stacks. Sides of the plates face each other to thermally interface the lower plates with the upper plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The thermal bridge includes an internal bridge frame having connecting elements that extend internally through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.

Abstract: A heat sink assembly includes a plate stack including fin plates and spacer plates with bottom edges forming a compliant thermal interface configured to interface with an electrical component. Upper edges of the fin plates are located above the spacer plates to form airflow channels between the fin plates. The heat sink assembly includes a support frame supporting the fin plates and the spacer plates in the plate stack. The support frame includes a spring support member engaging a spring element to locate the spring element relative to the support frame. The spring element engages the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component to press the bottom edges of the fin plates and the spacer plates against the electrical component.

Abstract: A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. The thermal bridge includes upper spring elements extending from upper plates having upper mating interfaces engaging lower plates to bias the upper plates in a first biasing direction generally away from the lower bridge assembly. The thermal bridge includes lower spring elements extending from lower plates having lower mating interfaces engaging upper plates to bias the lower plates in a second biasing direction generally away from the upper bridge assembly. A bridge frame having connecting elements extends through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.

Abstract: A heat sink assembly includes an upper heat sink element having upper plates each having sides between front and rear ends and each having inner and outer ends and a lower heat sink element having lower plates each having sides between front and rear ends and each having inner and outer ends. The lower plates include lower spacer plates and lower interface plates with the outer ends thereof thermally coupled to an electronic module. The lower interface plates include interface fins interfacing with the upper plates. The heat sink assembly includes a spring element having an upper spring member engaging the inner ends of the upper plates to bias the upper plates in a first biasing direction away from the lower plates and having a lower spring member engaging the inner ends of the lower plates to bias the lower plates in a second biasing direction away from the upper plates.

Abstract: A connector assembly includes a cage member having a plurality of walls defining a module cavity for a pluggable module. The walls include a top wall, a bottom wall and side walls extending between the top and bottom walls. The side walls extend to a bottom edge at the bottom wall and include mounting pins extending from the bottom edge that each have a press-fit portion configured to be press fit in a plated via of a circuit board. The bottom wall has a generally planar bottom surface facing the circuit board and a generally planar top surface facing the module cavity. The bottom wall includes a locating feature extending below the bottom surface and having a datum surface configured to engage the circuit board. The datum surface is a predetermined distance from the top surface to set a position of the top surface relative to the circuit board.

Abstract: The invention relates to an engineered outer domain (eOD) of HIV gp120 and mutants thereof and methods of making and using the same. The mutant eODs may be advantageous for the elicitation of CD4-binding site (CD4bs)-directed broadly-neutralizing antibodies (bnAbs) and/or improve binding to mature VRC01 and/or improve binding to germline VRC01 and the germlines of other VH1-2 derived broadly-neutralizing antibodies. The mutant eODs may also include glycan-masking mutations on eOD. The present invention also includes fusions of eOD to various protein multimers to enhance immunogenicity as well as the design of cocktails of different eODs that represent the full diversity of HIV sequences within the VRC01 epitope and surroundings.

Abstract: The invention relates to an engineered outer domain (eOD) of HIV gp120 and mutants thereof and methods of making and using the same. The mutant eODs may be advantageous for the elicitation of CD4-binding site (CD4bs)-directed broadly-neutralizing antibodies (bnAbs) and/or improve binding to mature VRC01 and/or improve binding to germline VRC01 and the germlines of other VH1-2 derived broadly-neutralizing antibodies. The mutant eODs may also include glycan-masking mutations on eOD. The present invention also includes fusions of eOD to various protein multimers to enhance immunogenicity as well as the design of cocktails of different eODs that represent the full diversity of HIV sequences within the VRC01 epitope and surroundings.

Abstract: The invention relates to an engineered outer domain (eOD) of HIV gp120 and mutants thereof and methods of making and using the same. The mutant eODs may be advantageous for the elicitation of CD4-binding site (CD4bs)-directed broadly-neutralizing antibodies (bnAbs) and/or improve binding to mature VRC01 and/or improve binding to germline VRC01 and the germlines of other VH1-2 derived broadly-neutralizing antibodies. The mutant eODs may also include glycan-masking mutations on eOD. The present invention also includes fusions of eOD to various protein multimers to enhance immunogenicity as well as the design of cocktails of different eODs that represent the full diversity of HIV sequences within the VRC01 epitope and surroundings.

Abstract: An electrical connector module assembly is provided and includes a first shell and a second shell configured to mate together with the first shell along an interface that extends along a portion of the shells. The first and second shells form a cavity therebetween that extends along the length of the shells. The cavity is configured to hold an electrical component therein. The module assembly also includes a plurality of shielding elements positioned along the portion of the shells. The shielding elements are configured to form a seal along the interface that shields the electrical component from electromagnetic interference.

Abstract: A connector assembly includes a cage member having a plurality of walls defining a module cavity for a pluggable module. The walls include a top wall, a bottom wall and side walls extending between the top and bottom walls. The side walls extend to a bottom edge at the bottom wall and include mounting pins extending from the bottom edge that each have a press-fit portion configured to be press fit in a plated via of a circuit board. The bottom wall has a generally planar bottom surface facing the circuit board and a generally planar top surface facing the module cavity. The bottom wall includes a locating feature extending below the bottom surface and having a datum surface configured to engage the circuit board. The datum surface is a predetermined distance from the top surface to set a position of the top surface relative to the circuit board.