Patents by Inventor Joseph Kuczynski

Joseph Kuczynski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10414913
    Abstract: An article of manufacture includes a macromolecular block copolymer. The macromolecular block copolymer includes a first extruded high molecular weight polymer and a second extruded high molecular weight polymer bonded to the first extruded high molecular weight polymer. The first extruded high molecular weight polymer has a first characteristic rigidity value along a first length, and the second extruded high molecular weight polymer has a second characteristic rigidity value along a second length that is different from the first characteristic rigidity value.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: September 17, 2019
    Assignee: International Business Machines Corporation
    Inventors: Suraush Q. Khambati, Joseph Kuczynski, Jason T. Wertz
  • Patent number: 10413495
    Abstract: A method for forming a photosensitizer product that is resistant to absorption by living tissue that may include binding a photosensitizer compound with an oxide-containing particle to provide the photosensitizer derivative having a microscale size, and mixing the photosensitizer derivative into a lotion. The microscale size of the photosensitizer derivative obstructs absorption by cell tissue.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: September 17, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Scott B. King, Brandon M. Kobilka, Joseph Kuczynski, Jacob T. Porter, Jason T. Wertz
  • Patent number: 10405542
    Abstract: In an example, a polymeric material includes a fibrous substrate, a cyclic compound chemically bonded to the fibrous substrate, and a microcapsule. The microcapsule has an encapsulated payload and is reversibly bonded to the fibrous substrate via the cyclic compound.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: September 10, 2019
    Assignee: International Busines Machines Corporation
    Inventors: Joseph Kuczynski, Jason T. Wertz, Jing Zhang
  • Patent number: 10405541
    Abstract: In an example, a process for bonding a microcapsule having an encapsulating payload to a polymeric material. The process includes applying a microcapsule (having the encapsulated payload) that includes a dienophile functional group to a polymeric material that includes a diene functional group. The process further includes bonding the microcapsule having the encapsulated payload to the polymeric material via a chemical reaction of the dienophile functional group with the diene functional group.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: September 10, 2019
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Jason T. Wertz, Jing Zhang
  • Publication number: 20190270935
    Abstract: A flame-retardant sugar derivative, a process for forming a flame-retardant sugar derivative, and an article of manufacture comprising a flame-retardant sugar derivative are disclosed. The flame-retardant sugar derivative can be synthesized from sorbitol, gluconic acid, or glucaric acid obtained from a bio-based source, and can have at least one phosphoryl or phosphonyl moiety. The process for forming the flame-retardant sugar derivative can include reacting sorbitol, gluconic acid, or glucaric acid and a flame-retardant phosphorus-based molecule to form the flame-retardant sugar derivative.
    Type: Application
    Filed: May 16, 2019
    Publication date: September 5, 2019
    Inventors: Scott B. King, Brandon M. Kobilka, Joseph Kuczynski, Jason T. Wertz
  • Patent number: 10405421
    Abstract: A layup for multiple-layer printed circuit board manufacturing is formed according to a process that includes selectively applying a dielectric resin to a high resin demand region of a circuitized core layer without applying the dielectric resin to another region of the circuitized core layer. The process also includes partially curing the dielectric resin within the high resin demand region. The process further includes forming a layup that includes a layer of pre-impregnated (prepreg) material adjacent to the partially cured dielectric resin within the high resin demand region of the circuitized core layer.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 3, 2019
    Assignee: International Business Machines Corporation
    Inventors: Bruce J. Chamberlin, Matthew S. Kelly, Scott B. King, Joseph Kuczynski
  • Patent number: 10390531
    Abstract: Embodiments of the disclosure generally provide compositions and methods involving textiles that repel insects by vibrations and oscillations. The random and chaotic oscillations are caused by molecular bond isomerizations in the textile material driven by visible light, such as sunlight.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: August 27, 2019
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Jeffrey N. Judd, Joseph Kuczynski, Scott D. Strand, Timothy J. Tofil
  • Patent number: 10392452
    Abstract: A self-healing polymeric material includes a polymeric matrix material, a plurality of monomer mixture microcapsules dispersed in the polymeric matrix material, and a plurality of light generating microcapsules dispersed in the polymeric matrix material. Each monomer mixture microcapsule encapsulates a mixture of materials that includes monomers and a photoinitiator. Each light generating microcapsule encapsulates multiple reactants that undergo a chemiluminescent reaction. The chemiluminescent reaction generates a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photoinitiator.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: August 27, 2019
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Sarah K. Czaplewski, Joseph Kuczynski, Timothy J. Tofil
  • Patent number: 10396050
    Abstract: Certain embodiments of the present disclosure provide a method for soldering a chip onto a surface. The method generally includes forming a bonding pad on the surface on which the chip is to be soldered, wherein the bonding pad is surrounded, at least in part, by dielectric material. The method may also include treating the dielectric material to render the dielectric material superomniphobic, and soldering the chip onto the bonding pad.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: August 27, 2019
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Sarah K. Czaplewski, Joseph Kuczynski, Timothy J. Tofil
  • Patent number: 10391226
    Abstract: A process includes removing air bubbles from extracorporeal blood via chemical entrapment of nitrogen (N2) gas.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: August 27, 2019
    Assignee: International Business Machines Corporation
    Inventors: Sarah K. Czaplewski, Joseph Kuczynski, Jason T. Wertz, Jing Zhang
  • Publication number: 20190256665
    Abstract: In an embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material. The thermal interface material is disposed between the first component and the second component and includes a polymeric phase-change material. In another embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material disposed between the first component and the second component, the thermal interface material including a polymeric phase-change material, the polymeric phase-change material including a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer having a chemical formula C2H4—R—C(O)OH and an ethylene glycol monomer having a chemical formula C2nH4n+2On+1.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 22, 2019
    Inventors: Dylan J. BODAY, Joseph KUCZYNSKI, Timothy C. MAULDIN
  • Publication number: 20190255518
    Abstract: An article of manufacture includes a three-dimensional (3D) printed object for chemical reaction control. The 3D printed object includes a chemical reactant to be released to control a chemical reaction according to a chemical reactant release profile. The chemical reactant release profile is determined based on a shape of the 3D printed object.
    Type: Application
    Filed: May 7, 2019
    Publication date: August 22, 2019
    Inventors: Scott B. King, Brandon M. Kobilka, Joseph Kuczynski, Jason T. Wertz
  • Publication number: 20190257464
    Abstract: In an embodiment, a plug formulation includes a mixture of a first part of a two-part epoxy system and artificial platelets formed from a polymeric material that expands upon exposure to ultraviolet (UV) light, moisture, or heat, wherein a portion of the first part of the two-part epoxy system is covalently bonded to a portion of the artificial platelets. In another embodiment, a plug formulation includes a mixture of a first part of a two-part epoxy system, an acrylate monomer, and artificial platelets formed from a polymeric material that expands upon exposure to ultraviolet (UV) light, moisture, or heat, wherein a portion of the first part of the two-part epoxy system is covalently bonded to a portion of the artificial platelets.
    Type: Application
    Filed: May 7, 2019
    Publication date: August 22, 2019
    Inventors: Sarah K. CZAPLEWSKI, Joseph KUCZYNSKI, Melissa K. MILLER, Jing ZHANG
  • Publication number: 20190254177
    Abstract: A method and structure are provided for implementing stub-less printed circuit board (PCB) vias and custom interconnect through laser-excitation conductive track structures. Stub-less printed PCB vias are formed which terminate at desired signal layers by controlled laser excitation without stubs or the need to back-drill to remove such stubs.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Inventors: Layne A. Berge, John R. Dangler, Matthew S. Doyle, Joseph Kuczynski, Thomas W. Liang, Manuel Orozco
  • Publication number: 20190248970
    Abstract: According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.
    Type: Application
    Filed: February 13, 2018
    Publication date: August 15, 2019
    Inventors: JOSEPH KUCZYNSKI, JASON T. WERTZ, BRUCE J. CHAMBERLIN, SARAH K. CZAPLEWSKI-CAMPBELL, JING ZHANG
  • Patent number: 10377877
    Abstract: A self-healing thermal interface material includes a reactive silicone-based material and a thermally conductive filler material. The reactive silicone-based material is modified to include one or more hydrogen bonding functional groups.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: August 13, 2019
    Assignee: International Business Machines Corporation
    Inventors: Sarah K. Czaplewski, Joseph Kuczynski, Jason T. Wertz, Jing Zhang
  • Patent number: 10383216
    Abstract: In an example, a process includes forming a patterned layer on a polymer substrate. The process also includes depositing a graphene-containing material on the patterned layer to form a plurality of graphene traces of a tamper detection circuit.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: August 13, 2019
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 10377799
    Abstract: A process of forming a gluten-derived flame retardant material includes forming an amine-functionalized flame retardant molecule that includes an aryl halide group and a phosphorus moiety. The process also includes chemically reacting the amine-functionalized flame retardant molecule with a gluten protein under transamidation conditions to bind the phosphorus moiety to a first portion of the gluten protein. The process further includes initiating a cross-coupling reaction between the aryl halide group and amine group of a second portion of the gluten protein to form a gluten-derived flame retardant material.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: August 13, 2019
    Assignee: International Business Machines Corporation
    Inventors: Scott B. King, Brandon M. Kobilka, Joseph Kuczynski, Jason T. Wertz
  • Publication number: 20190242821
    Abstract: A process of utilizing a water-sensitive fluorophore for moisture content evaluation in a hygroscopic polymer includes forming a blend that includes a hygroscopic polymer resin and a water-sensitive fluorophore. The process includes forming pellets having a particular geometry from the blend, determining fluorescence properties of at least one of the pellets, and determining moisture content of at least one of the pellets. The process also includes generating a calibration curve for the particular pellet geometry by correlating the fluorescence properties with the moisture content. The process further includes providing the calibration curve for non-destructive moisture content evaluation of a material derived from the pellets.
    Type: Application
    Filed: April 18, 2019
    Publication date: August 8, 2019
    Inventors: Eric J. Campbell, Sarah K. Czaplewski-Campbell, Joseph Kuczynski, Timothy J. Tofil
  • Publication number: 20190245145
    Abstract: An organic semiconducting donor-acceptor (D-A) small molecule, as well as a semiconductor device that can incorporate the D-A small molecule, are disclosed. The D-A small molecule can have electron deficient substituents and R group substituents that can be C1-C20 linear alkyl chains, C2-C24 branched alkyl chains, hydrogen atoms, etc. The D-A small molecule can be can be synthesized in a reaction between a dithienofuran (DTF) core monomer and an electron deficient monomer. Additionally, the D-A small molecule can be part of an organic semiconducting copolymer. A semiconductor device that can incorporate the D-A small molecule in a photoactive layer is also disclosed herein. Additionally, 3,4-dibrominated furan compound that can, in some embodiments, be a precursor for the D-A small molecule is disclosed. The 3,4-dibrominated furan compound can be synthesized in a reaction involving a furan-2,5-dicarboxylic dimethyl ester (FDME), which can have a bio-renewable precursor.
    Type: Application
    Filed: April 11, 2019
    Publication date: August 8, 2019
    Inventors: Scott B. King, Brandon M. Kobilka, Joseph Kuczynski, Jason T. Wertz