Abstract: A flame-retardant compound, a process for forming a flame-retardant polymer, and an article of manufacture are disclosed. The flame-retardant compound includes at least one muconic acid moiety and at least one phosphorus-based moiety. The process for forming the flame-retardant polymer includes obtaining a muconic acid compound, obtaining a muconic acid compound, reacting the muconic acid compound with the phosphorus compound to form a flame-retardant compound, and incorporating the flame-retardant compound into a polymer. The article of manufacture comprises a material that contains a flame-retardant compound derived from muconic acid.

Abstract: A process of forming a flame retardant polylactide includes forming a flame retardant lactide monomer. The process also includes forming a lactide feedstock that includes at least the flame retardant lactide monomer. The process further includes polymerizing the lactide feedstock to form a flame retardant polylactide.

Abstract: A fusible via is disclosed. The fusible via includes an upper contact. The fusible via further includes a handle portion having a first end and a second end. The upper contact is disposed on the first end of the handle portion. The handle portion comprises an alloy and a blowing agent. The alloy melts above a predefined solder reflow temperature but below a thermal degradation temperature of the blowing agent. The fusible via further includes a lower contact disposed on the second end of the handle portion.

Abstract: According to one aspect, a process of forming a diisocyanate compound from limonene is disclosed. The process includes performing an oxidation reaction to form a limonene-ketone from limonene having a ketone group at a first position. The process includes performing a conjugate addition reaction on the limonene-ketone to form a limonene-nitrile having a nitrile group bonded at a second position. The process also includes performing a reductive amination reaction on the limonene-nitrile to form a limonene-diamine by reducing the nitrile group to form a first amine group and converting the ketone group to a second amine group. The process further includes forming the diisocyanate compound by converting the first amine group of the limonene-diamine to a first isocyanate group and the second amine group of the limonene-diamine to a second isocyanate group.

Abstract: A method and circuit for implementing transient electronic circuits for security applications, and a design structure on which the subject circuit resides are provided. Silver nanowire traces are fabricated forming a protection circuit in a soluble material. A frangible material is provided separating the soluble material from a solvent layer proximately located. During a tampering event the frangible material is ruptured releasing the solvent which contacts and dissolves the soluble material and disperses the silver nanowire traces creating an electrical open in the protection circuit. The electrical open enables enhanced tampering detection.

Abstract: Embodiments described herein provide a precursor for synthesizing a number of molecules for use in organic photovoltaics. The precursor is diiodo-furopyran (DFP), such as dibromo-DFP (DBDFP), to be used to synthesize a number of different molecules for use in organic photovoltaics. DFP possesses numerous reactive sites that can be used to simultaneously modify the backbone structure (which can be used to tune electronic and crystalline properties) and the side-chains (affecting the solubility and the solubility of any subsequent copolymers). Each of the molecules has either a biisocoumarin or biisoquinoline core structure and can be easily varied to yield a different functional backbone or different substituents. The molecules can be used in copolymers or small molecules for use in OPVs.

Abstract: In an embodiment, a method of forming a stub-less via is provided. The method includes depositing a plurality of microcapsules containing a metal material in a via of a printed circuit board (PCB); rupturing the microcapsules and releasing the metal material; and sintering the metal material. In another embodiment, a method of forming a stub-less via is provided. The method includes forming a via in a printed circuit board (PCB); installing a plug in a portion of the via; depositing in the via a plurality of nanoparticles containing a metal material; and sintering the metal material.

Abstract: A process of utilizing a heat-activated conductive spinel material for PCB via overcurrent protection includes forming a PCB laminate structure that includes a spinel-doped insulator layer having a heat-activated conductive spinel material incorporated into a dielectric material as a spinel-based electrically non-conductive metal oxide. A sensing via is formed in the PCB laminate structure at a location that is proximate to a power via in the PCB laminate structure. The sensing via is electrically isolated from the power via by a region of the spinel-doped insulator layer and is electrically connected to a monitoring component configured to detect current flow through the sensing via that results from an overcurrent event in the power via that generates sufficient heat to cause the spinel-based electrically conductive metal oxide to release metal nuclei into the region to provide a conductive pathway through the region from the power via to the sensing via.

Abstract: A photo-absorbing composition having a structure from the group consisting of wherein DASM is a small molecule comprising one or more electron donor portions and one or more electron acceptor portions and NG is a nanographene structure, and m, n, and o are integers greater than or equal to 1.

Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.

Abstract: A process of providing a coating having a hydrophobic, electrically conductive porous metallic surface on a substrate includes forming a metal-infused plastic lattice that includes a plastic lattice infused with metal particles, and then removing the plastic lattice from the metal-infused plastic lattice. A surface of at least some of the metal particles is textured to increase hydrophobicity by exposing the surface to laser light. In some embodiments, the metal particles are exposed to laser light from a femtosecond pulse laser to produce hydrophobic metal particles before the metal-infused plastic lattice is formed. In other embodiments, the surface of at least some of the metal particles is exposed to laser light from a femtosecond pulse laser after the metal-infused plastic lattice is formed.

Abstract: A flame retardant sugar-derived molecule, a process for forming a flame retardant sugar-derived molecule, and an article of manufacture comprising a flame retardant sugar-derived molecule are disclosed. The flame retardant sugar-derived molecule can be synthesized from arabitol, xylitol, arabic acid, or xylonic acid obtained from a bio-based source, and can have at least one phosphoryl or phosphonyl moiety. The process for forming the flame retardant sugar-derived molecule can include reacting arabitol, xylitol, arabic acid, or xylonic acid and a flame retardant phosphorus-based molecule to form the flame retardant sugar-derived molecule.

Abstract: A method and circuit for implementing transient electronic circuits for security applications, and a design structure on which the subject circuit resides are provided. Silver nanowire traces are fabricated forming a protection circuit in a soluble material. A frangible material is provided separating the soluble material from a solvent layer proximately located. During a tampering event the frangible material is ruptured releasing the solvent which contacts and dissolves the soluble material and disperses the silver nanowire traces creating an electrical open in the protection circuit. The electrical open enables enhanced tampering detection.

Abstract: A process of forming a hydrophobic, conductive barrier on a metallic surface includes coating the metallic surface with an organic, conductive material. The organic, conductive material includes a conductive group having two or more alkyne groups and a dithiocarbamate group to bind the organic, conductive material to the metallic surface.

Abstract: A process includes providing furan-2,5-dicarboxylic dimethyl ester (FDME), reacting the FDME with a Grignard reagent to form a bis-alkylketone furan having R groups selected from the group consisting of a C1-C20 linear alkyl chain, a C2-C24 branched alkyl chain, and a hydrogen atom. An additional process includes mixing a 3,4-dibrominated bis-alkylketone furan with potassium carbonate, and adding ethyl-mercaptoacetate to the mixture. This process also includes stirring the mixture to form a bis-alkyl-DTF diester fused ring structure, which is then brominated to form a dibromo-DTF compound.

Abstract: According to one aspect, a process of forming a diisocyanate compound from limonene is disclosed. The process includes performing an oxidation reaction to form a limonene-ketone from limonene having a ketone group at a first position. The process includes performing a conjugate addition reaction on the limonene-ketone to form a limonene-nitrile having a nitrile group bonded at a second position. The process also includes performing a reductive amination reaction on the limonene-nitrile to form a limonene-diamine by reducing the nitrile group to form a first amine group and converting the ketone group to a second amine group. The process further includes forming the diisocyanate compound by converting the first amine group of the limonene-diamine to a first isocyanate group and the second amine group of the limonene-diamine to a second isocyanate group.

Abstract: An impact resistant polyhexahydrotriazine polymer, processes of forming an impact resistant polyhexahydrotriazine polymer, and an article of manufacture comprising an impact resistant polyhexahydrotriazine polymer are disclosed. The impact resistant polyhexahydrotriazine polymer includes at least one hexahydrotriazine group and at least one chain comprising an allylic portion and a styrenic portion. Variations in the chain control properties of the impact resistant polymer. The process of forming the impact resistant polyhexahydrotriazine polymer includes reactions between formaldehyde and at least two classes of monomer that form hexahydrotriazine groups and impact resistant chains. Adjusting relative monomer concentrations controls properties of the impact resistant polyhexahydrotriazine polymer. The article of manufacture contains a material that has an impact resistant polymer.

Abstract: An enhanced substrate includes a carbine-coated metal foil laminated to a substrate that includes glass fiber impregnated with a base polymer. The carbine-coated foil metal includes a conductive surface treated with an N-heterocyclic carbene (NHC) compound containing a matrix-reactive pendant group that includes at least one of a vinyl-, allyl-, acrylic-, methacrylic-, styrenic-, amine-, amide- and epoxy-containing moiety capable of reacting with the base polymer.

Abstract: A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.

Abstract: An apparatus, method, and article of manufacture for transferring fluid contained in a syringe. The apparatus includes an airlock component having a cylindrical body with a first end, a second end, and a hollow tube disposed between the first end and the second end. An annular opening is located at the first end of the cylindrical body. The hollow tube includes a gas inlet aperture and a gas outlet aperture. The hollow tube also includes an inwardly-facing airtight material coupled to the interior surface of the hollow tube, and a septum coupled to the second end of the cylindrical body. The method includes transferring fluid from one container to a second container using the apparatus. The article of manufacture includes the apparatus, a syringe, and a needle.