Abstract: A method includes obtaining a substrate having at least one exposed metal surface. The method also includes electro-depositing metal onto the at least one exposed metal surface of the substrate and around at least a portion of an optical fiber to secure the optical fiber to the substrate. The substrate and the electro-deposited metal are configured to remove heat from the optical fiber. The method could further include electro-depositing metal around a sacrificial material and removing the sacrificial material to form at least one cooling channel through the electro-deposited metal. The optical fiber could include a polymer coating, where a portion of the polymer coating is removed at an end of the optical fiber. The substrate and the electro-deposited metal could be faceted at an input of the optical fiber and at an output of the optical fiber. The optical fiber could have a coiled arrangement on the substrate.

Abstract: In one embodiment, a solder preform includes a solder matrix having microparticles secured with the solder matrix. The microparticles are constructed so as to be capable of arranging during a solder bonding process so as to provide a uniform separation between opposing soldered surfaces. The microparticles may be shaped to inhibit stacking of the microparticles while self arranging during the solder bonding. The solder preform may have an amount of microparticles with respect to the solder matrix to inhibit stacking of the microparticles during the solder bonding process. Microparticles may be spheres, powders, polyhedrons, crystalline particles, nanostructures, or the like, which may be capable of conducting electric current, or may be dielectric material; for example glass, plastic, metal, or semiconductor material.

Abstract: A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.

Abstract: A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.

Abstract: A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.

Abstract: A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.

Abstract: A diamond matrix metallic mesh suppresses RF energy, and particularly side lobe energy, in a phased array antenna, while passing main beam energy. The metal mesh emulates the structure of the bond segments joining the carbon atoms in a diamond structure. The wire diamond lattice structure is placed above an array of radiating elements to absorb side lobe energy. The wire lattice structure is fabricated through use of complementary forms which compress a wire into a required unit shape. Many unit shaped wires are placed in a form which hold the wires in the proper position. Other unit shaped wires are rotated 90 degrees and attached in place to the held wires. Additional unit shaped wires are added to form the basic interlocking cube structure of the diamond lattice.

Abstract: A diamond matrix metallic mesh suppresses RF energy, and particularly side lobe energy, in a phased array antenna, while passing main beam energy. The metal mesh emulates the structure of the bond segments joining the carbon atoms in a diamond structure. The wire diamond lattice structure is placed above an array of radiating elements to absorb side lobe energy. The wire lattice structure is fabricated through use of complementary forms which compress a wire into a required unit shape. Many unit shaped wires are placed in a form which hold the wires in the proper position. Other unit shaped wires are rotated 90 degrees and attached in place to the held wires. Additional unit shaped wires are added to form the basic interlocking cube structure of the diamond lattice.

Abstract: A diamond lattice structure is employed as a ground plane in an array antenna system. The ground plane structure reflects incident energy radiated by the antenna radiating elements. The structure is fabricated from a layer of dielectric photonic band gap material in which a periodic void structure is defined. The void diameter is selected to maximize the void volume within the structure. Methods of constructing the ground plane are described.

Abstract: An optical receiver with an enhanced power capability and wide bandwidth is implemented by distributing a number of photodetectors along an optical transmission channel to convert respective portions of an optical signal into electrical signals. An electrical transmission line receives and accumulates signal inputs from the photodetectors. A velocity matching is established between the optical and electrical signals, allowing the photodetector outputs to accumulate coherently along the electrical transmission line, by loading the transmission line with distributed capacitance elements. The loading capacitances are preferably inherent in the photodetectors, which are designed and spaced apart from each other to yield the desired velocity matching.

Abstract: A diffraction limited working beam at a given frequency is amplified without degrading its diffraction limited quality by diverting a minor portion of the beam as a probe beam, and amplifying the remaining portion of the working beam with a high power pump beam at a different wavelength. The amplification takes place in a host medium that has a rare earth dopant with an energy transition from the pump beam's wavelength to the wavelength of the working beam. The resulting amplified working beam is non-diffraction limited. The probe beam is frequency modulated and coupled with the amplified working beam in a second host medium that also has a rare earth dopant. Energy is transferred from the amplified working beam to the modulated probe beam through a resonant energy transfer in the second host medium, producing an amplified output beam at the working beam frequency that retains the diffraction limited quality of the probe beam.

Abstract: Two optical fiber segments are spliced in an end-to-end fashion by first axially aligning the optical fiber segments, and then fusing the optical fiber segments with a converging conical light beam convergently focused to an apex region along the optical fiber. The converging conical beam heats the optical fiber segments and the splice in a circumferentially uniform manner. The apex region at which the converging conical beam is focused can be moved progressively along the length of the optical fiber to effect the fusion, and also to directionally fire polish and stress relieve the optical fiber to minimize the presence of flaws in the optical fiber after fusion is complete. The converging conical light beam is achieved by creating a diverging conical beam using movable mirrors to deflect a collimated beam into a diverging conical beam. The diverging conical beam is reflected from a parabolic mirror to form the converging conical beam that is focused toward the optical fiber.

Abstract: A transparent elastomeric mold 30 capable of precisely reconstituting the buffer coating surrounding an optical fiber 54. The inventive elastomeric mold 30 is disposed to shape a buffer coating applied to an optical fiber in accordance with the dimensions of a master fiber 32. The mold 30 includes an elastomeric slab 38 for substantially confining the buffer coating within a channel 48 having a cross-sectional dimension substantially identical to that of the master fiber 32. The slab 38 includes an inner surface 50 which defines the channel 48 along a longitudinal axis L. The inventive mold 30 may also include an arrangement of arm members 34, 36 for flexing the elastomeric slab 38 in order to open the channel along the longitudinal axis L.

Abstract: Optical sensor has divergent light from a source, preferably from a single optical fiber, and a lens which collimates the light into a broad beam. The broad beam is acted upon and passes to another lens which focuses the beam onto a single optical fiber for detection. The beam is acted upon by reflecting off of a surface when the surface is dry or dissipating when the surface is wet, or is acted on in other ways to interrupt the beam to provide a water presence signal or the like.

Abstract: A fiber optic buffer defect detection system including a laser, for illuminating the fiber buffer with a collimated beam of light energy, and detectors for detecting any scattering of the beam, from a defect in the fiber buffer. The detectors are mounted to collect scattering out of a radial plane defined by the angular rotation of the beam about the fiber at the point of intersection of the beam with the fiber buffer.

Abstract: A fiber optic structure comprising an optical fiber having a body of material deposited upon the exterior surface such that the body of material is sufficiently strong and rigid to permit processing of the fiber for various fiber optics applications. The process for forming the fiber optic structure involves the electroplating of a body of material upon the exterior surface of the optical fiber which is to be processed. A built-up body of fiber allows coupling structures to be created. The built-up body enables the fiber to be used as liquid level sensors and other types of mode strippers.

Abstract: Fiber optic solderable bulkhead fitting has a plated-on built-up metal body of a material which minimizes local stresses thereby minimizing microbending losses in the optical fiber. The body is sealed by solder within an opening in a bulkhead to provide a sealed passthrough for the optical fiber. In another embodiment, two optical fibers have plated-on built-up bodies thereon which serve to align the optical fibers in a connector. The connector is then sealed in a bulkhead as was done in the first embodiment.

Abstract: An optical fiber waveguide resistant to ionizing radiation having a glass core of predetermined refractive index surrounded by glass cladding having a lower predetermined refractive index. The glass core and glass cladding are each composed of high purity silica incorporating gallium as a constituent. The gallium is present in the form of Ga.sub.2 O.sub.3 in a concentration of about 0.01 to 0.15 mole percent ratio to the silica. The glass of the optical waveguide can further include phosphorus in the form of P.sub.2 O.sub.5 as an additional constituent in the amount of from about 5 to 16 mole percent ratio to the total amount of all constituents.The waveguide of the invention is preferably manufactured by using GaCl.sub.3 in combination with an internal vapor phase process to produce a silica soot (16) containing Ga.sub.2 O.sub.3 on the interior surface of a high purity silica tube (10). The soot is then consolidated and the tube collapsed to form a substantially voidless solid rod preform of high purity SiO.