Abstract: An adjustable towel tree includes a post having a plurality of pins; a base configured for attachment of the post; a plurality of rods; a plurality of apertures formed on the post, each of the plurality of apertures being sized and configured for passage therethrough of a corresponding one of the plurality of rods, and wherein each of the rods is on a different axis relative to the other rods of the plurality of rods; each of the plurality of rods having a plurality of openings formed along its length; and wherein a user may selective adjust the placement of each of the plurality of rods along a corresponding axis by displacing the pin from the opening of a corresponding one of the plurality of rods, adjusting the position of the corresponding rod, and then inserting the pin into a selected one of the plurality of openings.

Abstract: A stencil assembly for placing conductive elements over conductive pads accessible at a first surface of a microelectronic element includes a main body having a top surface and a bottom surface and a plurality of openings extending between the top and bottom surfaces, the main body being adapted for overlying the first surface of the microelectronic element so that the openings are in substantial alignment with the pads of the microelectronic element. The stencil assembly also includes a spacer element under the bottom surface of the main body, the spacer element being adapted for maintaining the main body above the first surface of the microelectronic element and remote from the pads of the microelectronic element. The main body and the spacer element have a combined thickness that is substantially equivalent to the diameter of the conductive elements.

Abstract: An apparatus for processing flexible tape for microelectronic assemblies includes a base having a top surface, a bottom surface and an aperture extending between the top and bottom surfaces, and a platform having a top surface for engaging a flexible tape used for making microelectronic assemblies, such as semiconductor chip packages. The platform is sized to fit within the aperture extending between the top and bottom surfaces of the base. The base is pivotally secured at one end of the platform so that when the base pivots with respect to the platform, the flexible tape engaged by the platform remains on the platform. The assembly also includes a carrier frame having a slot and a clamp sized to pass through the slot and the carrier frame and the aperture in the base for securing the flexible tape to the top surface of the platform as the base pivots with respect to the platform.

Abstract: An assembly for processing a flexible tape comprises a carrier frame having a slot and a cut-out region contiguous with one end of the slot for selectively transferring the flexible tape from the top surface of the carrier frame to the bottom surface of the carrier frame. An apparatus for processing the flexible tape is also disclosed and includes the carrier frame, a base having an aperture and a platform sized to fit within the aperture of the base. The base is pivotable around one end of the platform.

Abstract: A method placing conductive elements, such as solder balls, over terminals on a microelectronic assembly includes providing a microelectronic element having a first surface and one or more terminals accessible at the first surface, and securing a spacer plate having a top surface, a bottom surface and at least one opening extending therethrough over the first surface of the microelectronic element so that the at least one opening is in substantial alignment with the terminals. After the spacer plate has been secured over the first surface of the microelectronic element, a stencil for placing conductive elements is then secured over the spacer plate. The stencil has a top surface and a bottom surface and a plurality of openings extending therethrough. When the stencil is secured over the spacer plate, the plurality of openings in the stencil are in substantial alignment with the terminals. As a result, the spacer plate maintains the stencil remote from the terminals.

Abstract: A method of making a microelectronic assembly includes providing a flexible tape having first and second surfaces with a plurality of connection components in a central region of the flexible tape, providing a carrier frame having top and bottom surfaces and a slot extending therebetween and placing the flexible tape in contact with the top surface of the carrier frame. Next a resilient element is provided on each connection component and the flexible tape is passed through the slot so that the flexible tape disengages from the top surface of the carrier frame, passes through the slot and engages the bottom surface of the carrier frame. The carrier frame includes one or more interior edges defining the slot and a cut-out region contiguous with one end of the slot.

Abstract: An integrated circuit, typically a random access memory, is housed in a package (14). In the application associated with the integrated circuit it is desired to maintain the data states stored in the memory even when the normal supply voltage is disconnected from the package (14). Batteries (24, 26) are secured in recesses (20, 22) within a structure (12) which is connected to the integrated circuit package (14). A top spring clip (100) is provided to securely hold the batteries (24, 26) within the recesses (20, 22) and forms a common conductor in contact with the upper terminal of both batteries. A bottom spring clip (74, 76) is provided for each of the recesses (20, 22) to form separate conductors in contact with the lower terminal of each battery. The batteries can be readily inserted and removed over lips (64, 70) in the recess (20, 22).

Abstract: An integrated circuit, typically a random access memory, is housed in a package (14). In the application associated with the integrated circuit it is desired to maintain the data states stored in the memory even when the normal supply voltage is disconnected from the package (14). Batteries (24, 26) are secured in recesses (20, 22) within a structure (12) which is connected to the integrated circuit package (14). A top spring clip (100) is provided to securely hold the batteries (24, 26) within the recesses (20, 22) and forms a common conductor in contact with the upper terminal of both batteries. A bottom spring clip (74, 76) is provided for each of the recesses (20, 22) to form separate conductors in contact with the lower terminal of each battery. The batteries can be readily inserted and removed over lips (64, 70) in the recess (20, 22).

Abstract: An integrated circuit, typically a random access memory, is housed in a package (14). In the application associated with the integrated circuit it is desired to maintain the data states stored in the memory even when the normal supply voltage is disconnected from the package (14). Batteries (24, 26) are secured in recesses (20, 22) within a structure (12) which is connected to the integrated circuit package (14). A top spring clip (100) is provided to securely hold the batteries (24, 26) within the recesses (20, 22) and forms a common conductor in contact with the upper terminal of both batteries. A bottom spring clip (74, 76) is provided for each of the recesses (20, 22) to form separate conductors in contact with the lower terminal of each battery. The batteries can be readily inserted and removed over lips (64, 70) in the recess (20, 22).

Abstract: An improved integrated circuit package (10) includes a cover (12), an intermediate subassembly (14) and a bottom subassembly (16). The intermediate and bottom subassemblies (14, 16) include lead frames (48, 22) respectively embedded therein, as well as openings which define a cavity for a semiconductor chip. The external lead pins (24) of the bottom subassembly (16) permit interconnection of the package with a circuit board or the like, while the external contacts (50) of the intermediate subassembly (14) cooperate with openings (62) in the cover to provide integral socket connections for other semiconductor packages or electrical components.

Abstract: An integrated semiconductor package containing circuitry capable of supporting separately packaged semiconductors to achieve greater circuit board density and to allow separate semiconductor packages which cooperate with the supporting semiconductor package and die to be interchanged. The supporting die is interconnected electrically to lead pins and socket contacts using conductive circuitry compatible with the other semiconductor die.In a first embodiment corresponding metallization patterns are used to electrically interconnect an integrated circuit package to a conventional printed wiring board or ceramic wiring board containing socket contacts to receive lead pins from another integrated circuit package. A second embodiment is a unitized package containing integral socket contacts within the unitized integrated package to receive lead pins from another integrated circuit package.

Abstract: The present invention is a module frame for use in a modular electronic assembly which includes a light emitting read out source and which also includes a substrate on which an integrated circuit chip is mounted and which is electrically coupled to a pair of batteries. The module frame is non-conductive and has a substrate cavity, a conducting member cavity which is disposed adjacent to the substrate cavity, and a first battery cavity and a second battery cavity both of which are disposed adjacent to the conducting member cavity. A first battery connector is disposed in the first battery cavity and is used for coupling the negative terminal of the battery in the first battery cavity to the casing of the battery in the second battery cavity. A second battery connector is disposed in the second battery cavity and is used for coupling the negative terminal of the battery in the second battery cavity to the substrate.

Abstract: The invention is a battery holder which is used to hold a pair of batteries in a modular electronic assembly having a substrate, on which an integrated circuit is mounted, and a module cap, which is concentrically, slightly larger than the substrate. The battery holder includes a module frame having a front surface, which is concentrically, slightly larger than the module cap, a back surface and a sidewall. The module frame also has a portion of its sidewall extending above the periphery adjacent to its front surface and two holes, perpendicular to its front surface and adapted to hold the pair of batteries. The battery holder also includes a metal plate, which is secured to the back surface of the module frame, for holding the pair of batteries in place.