Patents by Inventor Joseph Seeger
Joseph Seeger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8539835Abstract: A sensing frame is disclosed. The sensing frame includes a first rail and a second rail. The first and second rails are constrained to move along a first axis parallel to the first and second rails. The frame includes a base and at least two guiding arms for ensuring that the first rail and the second rail move in anti-phase fashion along the first axis. First and second guiding arms are flexibly coupled to the first rail and second rail. The first guiding arm is flexibly suspended to the base at first anchoring points for allowing rotation of the first guiding arm, and the second guiding arm is suspended to the base at a second anchoring point allowing rotation of the second guiding arm. The sensing frame includes a plurality of coupling flexures and a transducer for sensing motion of the first and second rails.Type: GrantFiled: March 22, 2012Date of Patent: September 24, 2013Assignee: Invensense, Inc.Inventors: Joseph Seeger, Bruno Borovic
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Patent number: 8534127Abstract: An angular velocity sensor including a drive extension mode. In one aspect, an angular rate sensor includes a base and at least three masses disposed substantially in a plane parallel to the base, the masses having a center of mass. At least one actuator drives the masses in an extension mode, such that in the extension mode the masses move in the plane simultaneously away or simultaneously towards the center of mass. At least one transducer senses at least one Coriolis force resulting from motion of the masses and angular velocity about at least one input axis of the sensor. Additional embodiments can include a linkage that constrains the masses to move in the extension mode.Type: GrantFiled: September 11, 2009Date of Patent: September 17, 2013Assignee: Invensense, Inc.Inventors: Joseph Seeger, Bruno Borovic
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Publication number: 20130233048Abstract: A self-test method by rotating the proof mass at a high frequency enables testing the functionality of both the drive and sense systems at the same time. In this method, the proof mass is rotated at a drive frequency. An input force which is substantially two times the drive frequency is applied to the actuation structures to rotate the proof mass of the gyroscope around the sensitive axis orthogonal to the drive axis. An output response of the gyroscope at the drive frequency is detected by a circuitry and a self-test response is obtained.Type: ApplicationFiled: April 12, 2013Publication date: September 12, 2013Applicant: INVENSENSE, INC.Inventors: Ozan Anac, Joseph Seeger
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Publication number: 20130068018Abstract: A gyroscope is disclosed. The gyroscope comprises a substrate; and a guided mass system. The guided mass system comprises proof-mass and guiding arm. The proof-mass and the guiding arm are disposed in a plane parallel to the substrate. The proof-mass is coupled to the guiding arm. The guiding arm is also coupled to the substrate through a spring. The guiding arm allows motion of the proof-mass to a first direction in the plane. The guiding arm and the proof-mass rotate about a first sense axis. The first sense axis is in the plane and parallel to the first direction. The gyroscope includes an actuator for vibrating the proof-mass in the first direction. The gyroscope also includes a transducer for sensing motion of the proof-mass-normal to the plane in response to angular velocity about a first input axis that is in the plane and orthogonal to the first direction.Type: ApplicationFiled: September 16, 2011Publication date: March 21, 2013Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Ozan ANAC
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Patent number: 8395381Abstract: A micromachined magnetic field sensor integrated with electronics is disclosed. The magnetic field sensors utilize Hall-effect sensing mechanisms to achieve 3-axis sensing. A Z axis sensor can be fabricated either on a device layer or on a conventional IC substrate with the design of conventional horizontal Hall plates. An X and Y axis sensor are constructed on the device layer. In some embodiments, a magnetic flux concentrator is applied to enhance the performance of the magnetic field sensor. In some embodiments, the magnetic field sensors are placed on slope sidewalls to achieve 3-axis magnetic sensing system. In some embodiments, a stress isolation structure is incorporated to lower the sensor offset. The conventional IC substrate and device layer are connected electrically to form a 3-axis magnetic sensing system. The magnetic field sensor can also be integrated with motion sensors that are constructed in the similar technology.Type: GrantFiled: July 9, 2010Date of Patent: March 12, 2013Assignee: Invensense, Inc.Inventors: Chiung C. Lo, Joseph Seeger, Martin Lim
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Patent number: 8347717Abstract: An angular velocity sensor including a drive extension mode. In one aspect, an angular rate sensor includes a base and at least three masses disposed substantially in a plane parallel to the base, the masses having a center of mass. At least one actuator drives the masses in an extension mode, such that in the extension mode the masses move in the plane simultaneously away or simultaneously towards the center of mass. At least one transducer senses at least one Coriolis force resulting from motion of the masses and angular velocity about at least one input axis of the sensor. Additional embodiments can include a linkage that constrains the masses to move in the extension mode.Type: GrantFiled: August 1, 2012Date of Patent: January 8, 2013Assignee: Invensense, Inc.Inventors: Joseph Seeger, Bruno Borovic
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Publication number: 20130001710Abstract: A method and system for providing a MEMS device with a portion exposed to an outside environment are disclosed. The method comprises bonding a handle wafer to a device wafer to form a MEMS substrate with a dielectric layer disposed between the handle and device wafers. The method includes lithographically defining at least one standoff on the device wafer and bonding the at least one standoff to an integrated circuit substrate to form a sealed cavity between the MEMS substrate and the integrated circuit substrate. The method includes defining at least one opening in the handle wafer, standoff, or integrated circuit substrate to expose a portion of the to expose a portion of the device wafer to the outside environment.Type: ApplicationFiled: June 28, 2012Publication date: January 3, 2013Applicant: INVENSENSE, INC.Inventors: Michael J. DANEMAN, Martin LIM, Joseph SEEGER, Igor TCHERTKOV, Steven S. NASIRI
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Publication number: 20130001550Abstract: A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the integrated circuit substrate. The integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode. The MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface, and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff. A force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode.Type: ApplicationFiled: June 28, 2012Publication date: January 3, 2013Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Igor TCHERTKOV, Hasan AKYOL, Goksen G. YARALIOGLU, Steven S. NASIRI, Ilya GURIN
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Publication number: 20120291549Abstract: An angular velocity sensor including a drive extension mode. In one aspect, an angular rate sensor includes a base and at least three masses disposed substantially in a plane parallel to the base, the masses having a center of mass. At least one actuator drives the masses in an extension mode, such that in the extension mode the masses move in the plane simultaneously away or simultaneously towards the center of mass. At least one transducer senses at least one Coriolis force resulting from motion of the masses and angular velocity about at least one input axis of the sensor. Additional embodiments can include a linkage that constrains the masses to move in the extension mode.Type: ApplicationFiled: August 1, 2012Publication date: November 22, 2012Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Bruno BOROVIC
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Patent number: 8310380Abstract: Selectable communication interface configurations for motion sensing devices. In one aspect, a module for a motion sensing device includes a motion processor connected to a device component and a first motion sensor, and a multiplexer having first and second positions. Only one of the multiplexer positions is selectable at a time, where the first position selectively couples the first motion sensor and the device component using a first bus, and the second position selectively couples the first motion sensor and the motion processor using a second bus, wherein communication of information over the second bus does not influence a communication bandwidth of the first bus.Type: GrantFiled: March 2, 2010Date of Patent: November 13, 2012Assignee: Invensense Inc.Inventors: Behrad Aria, David Sachs, Joseph Seeger
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Publication number: 20120242400Abstract: A high-voltage MEMS system compatible with low-voltage semiconductor process technology is disclosed. The system comprises a MEMS device coupled to a high-voltage bias generator employing an extended-voltage isolation residing in a semiconductor technology substrate. The system avoids the use of high-voltage transistors so that special high-voltage processing steps are not required of the semiconductor technology, thereby reducing process cost and complexity. MEMS testing capability is addressed with a self-test circuit allowing modulation of the bias voltage and current so that a need for external high-voltage connections and associated electro-static discharge protection circuitry are also avoided.Type: ApplicationFiled: March 24, 2011Publication date: September 27, 2012Applicant: INVENSENSE, INC.Inventors: Derek SHAEFFER, Baris CAGDASER, Joseph SEEGER
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Publication number: 20120216612Abstract: A sensing frame is disclosed. The sensing frame includes a first rail and a second rail. The first and second rails are constrained to move along a first axis parallel to the first and second rails. The frame includes a base and at least two guiding arms for ensuring that the first rail and the second rail move in anti-phase fashion along the first axis. First and second guiding arms are flexibly coupled to the first rail and second rail. The first guiding arm is flexibly suspended to the base at first anchoring points for allowing rotation of the first guiding arm, and the second guiding arm is suspended to the base at a second anchoring point allowing rotation of the second guiding arm. The sensing frame includes a plurality of coupling flexures and a transducer for sensing motion of the first and second rails.Type: ApplicationFiled: March 22, 2012Publication date: August 30, 2012Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Bruno BOROVIC
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Publication number: 20120200362Abstract: A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.Type: ApplicationFiled: April 16, 2012Publication date: August 9, 2012Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Goksen G. YARALIOGLU, Baris CAGDASER
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Publication number: 20120176128Abstract: A micromachined magnetic field sensor comprising is disclosed. The micromachined magnetic field comprises a substrate; a drive subsystem, the drive subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field along a third axis. The micromachined magnetic field sensor also includes a sense subsystem, the sense subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; wherein a portion of the sense subsystem moves along a fourth axis; a coupling spring between the drive subsystem and the sense subsystem which causes motion of the sense subsystem in response to the magnetic field; and a position transducer to detect the motion of the sense subsystem.Type: ApplicationFiled: January 11, 2011Publication date: July 12, 2012Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Chiung C. LO, Baris CAGDASER, Derek SHAEFFER
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Publication number: 20120176129Abstract: A micromachined magnetic field sensor is disclosed. The micromachined magnetic field sensor comprises a substrate; and a drive subsystem partially supported by the substrate with a plurality of beams, and at least one anchor; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field vector along a third axis. The micromachined magnetic field sensor also includes a position transducer to detect the motion of the drive subsystem and an electrostatic offset cancellation mechanism coupled to the drive subsystem.Type: ApplicationFiled: January 11, 2011Publication date: July 12, 2012Applicant: InvenSense, Inc.Inventors: Joseph SEEGER, Chiung C. LO, Baris CAGDASER, Derek SHAEFFER
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Publication number: 20120125101Abstract: A system and method in accordance with an embodiment reduces the cross-axis sensitivity of a gyroscope. This is achieved by building a gyroscope using a mechanical transducer that comprises a spring system that is less sensitive to fabrication imperfection and optimized to minimize the response to the rotations other than the intended input rotation axis.Type: ApplicationFiled: January 30, 2012Publication date: May 24, 2012Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Ozan ANAC
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Patent number: 8183944Abstract: A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.Type: GrantFiled: April 3, 2009Date of Patent: May 22, 2012Assignee: Invensense, Inc.Inventors: Joseph Seeger, Goksen G. Yaralioglu, Baris Cagdaser
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Publication number: 20120086446Abstract: An integrated MEMS device is disclosed. The system comprises a MEMS resonator; and a MEMS device coupled to a MEMS resonator. The MEMS resonator and MEMS device are fabricated on a common substrate so that certain characteristics of the MEM resonator and MEMS device track each other as operating conditions vary.Type: ApplicationFiled: December 28, 2010Publication date: April 12, 2012Applicant: INVENSENSE, INC.Inventors: Derek SHAEFFER, Baris CAGDASER, Chiung C. LO, Joseph SEEGER
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Patent number: 8141424Abstract: A sensing frame that moves in response to torque generated by the Coriolis acceleration on a drive subsystem is disclosed. The sensing frame include a first rail. The first rail is constrained to move along the first axis parallel to the first rail. The frame includes a second rail substantially parallel to said first rail. The second rail is constrained to move along the first axis. The frame includes a base and at least two guiding arms for ensuring that the first rail and the second rail move in anti-phase fashion along the first axis. A first guiding arm is flexibly coupled to the first rail and flexibly coupled to the second rail and a second guiding arm is flexibly coupled to the first rail and flexibly coupled to the second rail.Type: GrantFiled: September 12, 2008Date of Patent: March 27, 2012Assignee: Invensense, Inc.Inventors: Joseph Seeger, Bruno Borovic
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Publication number: 20120007597Abstract: A micromachined magnetic field sensor integrated with electronics is disclosed. The magnetic field sensors utilize Hall-effect sensing mechanisms to achieve 3-axis sensing. A Z axis sensor can be fabricated either on a device layer or on a conventional IC substrate with the design of conventional horizontal Hall plates. An X and Y axis sensor are constructed on the device layer. In some embodiments, a magnetic flux concentrator is applied to enhance the performance of the magnetic field sensor. In some embodiments, the magnetic field sensors are placed on slope sidewalls to achieve 3-axis magnetic sensing system. In some embodiments, a stress isolation structure is incorporated to lower the sensor offset. The conventional IC substrate and device layer are connected electrically to form a 3-axis magnetic sensing system. The magnetic field sensor can also be integrated with motion sensors that are constructed in the similar technology.Type: ApplicationFiled: July 9, 2010Publication date: January 12, 2012Applicant: InvenSense, Inc.Inventors: Joseph Seeger, Chiung C. Lo