Patents by Inventor Joseph Seeger
Joseph Seeger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120007598Abstract: A micromachined magnetic field sensor integrated with electronics is disclosed. The magnetic field sensors utilize Hall-effect sensing mechanisms to achieve 3-axis sensing. A Z axis sensor can be fabricated either on a device layer or on a conventional IC substrate with the design of conventional horizontal Hall plates. An X and Y axis sensor are constructed on the device layer. In some embodiments, a magnetic flux concentrator is applied to enhance the performance of the magnetic field sensor. In some embodiments, the magnetic field sensors are placed on slope sidewalls to achieve 3-axis magnetic sensing system. In some embodiments, a stress isolation structure is incorporated to lower the sensor offset. The conventional IC substrate and device layer are connected electrically to form a 3-axis magnetic sensing system. The magnetic field sensor can also be integrated with motion sensors that are constructed in the similar technology.Type: ApplicationFiled: July 9, 2010Publication date: January 12, 2012Applicant: InvenSense, Inc.Inventors: Chiung C. Lo, Joseph Seeger, Martin Lim
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Patent number: 8069726Abstract: An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.Type: GrantFiled: November 18, 2009Date of Patent: December 6, 2011Assignee: Invensense, Inc.Inventors: Joseph Seeger, Steven S. Nasiri, Alexander Castro
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Patent number: 8047075Abstract: A system and method in accordance with the present invention provides for a low cost, bulk micromachined accelerometer integrated with electronics. The accelerometer can also be integrated with rate sensors that operate in a vacuum environment. The quality factor of the resonances is suppressed by adding dampers. Acceleration sensing in each axis is achieved by separate structures where the motion of the proof mass affects the value of sense capacitors differentially. Two structures are used per axis to enable full bridge measurements to further reduce the mechanical noise, immunity to power supply changes and cross axis coupling. To reduce the sensitivity to packaging and temperature changes, each mechanical structure is anchored to a single anchor pillar bonded to the top cover.Type: GrantFiled: June 21, 2007Date of Patent: November 1, 2011Assignee: Invensense, Inc.Inventors: Steven S. Nasiri, Joseph Seeger, Goksen Yaralioglu
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Patent number: 8020441Abstract: An angular rate sensor is disclosed. The angular rate sensor comprises a substrate and a drive subsystem partially supported by a substrate. The drive subsystem includes at least one spring, at least one anchor, and at least one mass; the at least one mass of the drive subsystem is oscillated by at least one actuator along a first axis. Coriolis force acts on moving the drive subsystem along or around a second axis in response to angular velocity of the substrate around the third axis. The angular rate sensor also includes a sense subsystem partially supported by a substrate. The sense subsystem includes at least one spring, at least one anchor, and at least one mass.Type: GrantFiled: February 5, 2008Date of Patent: September 20, 2011Assignee: Invensense, Inc.Inventor: Joseph Seeger
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Publication number: 20110215952Abstract: Selectable communication interface configurations for motion sensing devices. In one aspect, a module for a motion sensing device includes a motion processor connected to a device component and a first motion sensor, and a multiplexer having first and second positions. Only one of the multiplexer positions is selectable at a time, where the first position selectively couples the first motion sensor and the device component using a first bus, and the second position selectively couples the first motion sensor and the motion processor using a second bus, wherein communication of information over the second bus does not influence a communication bandwidth of the first bus.Type: ApplicationFiled: March 2, 2010Publication date: September 8, 2011Applicant: INVENSENSE, INC.Inventors: Behrad ARIA, David SACHS, Joseph SEEGER
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Publication number: 20110197677Abstract: Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.Type: ApplicationFiled: April 28, 2011Publication date: August 18, 2011Applicant: InvenSense, Inc.Inventors: Steven S. NASIRI, Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri
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Patent number: 7934423Abstract: Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.Type: GrantFiled: December 10, 2007Date of Patent: May 3, 2011Assignee: Invensense, Inc.Inventors: Steven S. Nasiri, Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri
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Publication number: 20110061460Abstract: An angular velocity sensor including a drive extension mode. In one aspect, an angular rate sensor includes a base and at least three masses disposed substantially in a plane parallel to the base, the masses having a center of mass. At least one actuator drives the masses in an extension mode, such that in the extension mode the masses move in the plane simultaneously away or simultaneously towards the center of mass. At least one transducer senses at least one Coriolis force resulting from motion of the masses and angular velocity about at least one input axis of the sensor. Additional embodiments can include a linkage that constrains the masses to move in the extension mode.Type: ApplicationFiled: September 11, 2009Publication date: March 17, 2011Applicant: INVENSENSE, INCInventors: JOSEPH SEEGER, BRUNO BOROVIC
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Patent number: 7863698Abstract: An anchoring assembly for anchoring MEMS device is disclosed. The anchoring assembly comprises: a top substrate; a bottom substrate substantially parallel to the top substrate; and a first portion of the anchor between the top substrate and the bottom substrate. The first portion of the anchor is rigidly connected to the top substrate; and the first portion of the anchor is rigidly connected to the bottom substrate. A second portion of the anchor is between the top substrate and the bottom substrate. The second portion of the anchor is rigidly connected to the top substrate; the second portion of the anchor being an anchoring point for the MEMS device. A substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor; the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.Type: GrantFiled: April 3, 2009Date of Patent: January 4, 2011Assignee: Invensense, Inc.Inventors: Joseph Seeger, Goksen G. Yaralioglu, Bruno Borovic, Alexander Castro
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Publication number: 20100253437Abstract: A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.Type: ApplicationFiled: April 3, 2009Publication date: October 7, 2010Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Goksen G. YARALIOGLU, Baris CAGDASER
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Publication number: 20100252897Abstract: An anchoring assembly for anchoring MEMS device is disclosed. The anchoring assembly comprises: a top substrate; a bottom substrate substantially parallel to the top substrate; and a first portion of the anchor between the top substrate and the bottom substrate. The first portion of the anchor is rigidly connected to the top substrate; and the first portion of the anchor is rigidly connected to the bottom substrate. A second portion of the anchor is between the top substrate and the bottom substrate. The second portion of the anchor is rigidly connected to the top substrate; the second portion of the anchor being an anchoring point for the MEMS device. A substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor; the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.Type: ApplicationFiled: April 3, 2009Publication date: October 7, 2010Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Goksen G. YARALIOGLU, Bruno BOROVIC, Alexander CASTRO
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Publication number: 20100132460Abstract: An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.Type: ApplicationFiled: November 18, 2009Publication date: June 3, 2010Applicant: INVENSENSE INC.Inventors: Joseph SEEGER, Steven S. NASIRI, Alexander CASTRO
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Publication number: 20100071467Abstract: A system and method describes an inertial sensor assembly, the assembly comprises a substrate parallel to the plane, at least one in-plane angular velocity sensor comprising a pair proof masses that are oscillated in anti-phase fashion along an axis normal to the plane. The first in-plane angular velocity sensor further includes a sensing frame responsive to the angular velocity of the substrate around the first axis parallel to the plane and perpendicular to the axis normal to the plane. The assembly also includes at least one out-of-plane angular velocity sensor comprising a pair of proof masses that are oscillated in anti-phase fashion in the plane parallel to the plane. The out-of-plane angular velocity sensor further comprises a sensing frame responsive to the angular velocity of the substrate around the axis normal to the plane.Type: ApplicationFiled: September 24, 2008Publication date: March 25, 2010Applicant: INVENSENSEInventors: STEVE NASIRI, JOSEPH SEEGER, BRUNO BOROVIC, GOKSEN YARALIOGLU
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Publication number: 20100064805Abstract: A sensing frame that moves in response to torque generated by the Coriolis acceleration on a drive subsystem is disclosed. The sensing frame include a first rail. The first rail is constrained to move along the first axis parallel to the first rail. The frame includes a second rail substantially parallel to said first rail. The second rail is constrained to move along the first axis. The frame includes a base and at least two guiding arms for ensuring that the first rail and the second rail move in anti-phase fashion along the first axis. A first guiding arm is flexibly coupled to the first rail and flexibly coupled to the second rail and a second guiding arm is flexibly coupled to the first rail and flexibly coupled to the second rail.Type: ApplicationFiled: September 12, 2008Publication date: March 18, 2010Applicant: InvenSense,. Inc.Inventors: Joseph Seeger, Bruno Borovic
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Patent number: 7621183Abstract: An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.Type: GrantFiled: February 5, 2008Date of Patent: November 24, 2009Assignee: Invensense Inc.Inventors: Joseph Seeger, Steven S. Nasiri, Alexander Castro
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Publication number: 20090193892Abstract: An angular rate sensor is disclosed. The angular rate sensor comprises a substrate and a drive subsystem partially supported by a substrate. The drive subsystem includes at least one spring, at least one anchor, and at least one mass; the at least one mass of the drive subsystem is oscillated by at least one actuator along a first axis. Coriolis force acts on moving the drive subsystem along or around a second axis in response to angular velocity of the substrate around the third axis. The angular rate sensor also includes a sense subsystem partially supported by a substrate. The sense subsystem includes at least one spring, at least one anchor, and at least one mass.Type: ApplicationFiled: February 5, 2008Publication date: August 6, 2009Applicant: INVENSENSE INC.Inventor: Joseph SEEGER
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Publication number: 20090145225Abstract: Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.Type: ApplicationFiled: December 10, 2007Publication date: June 11, 2009Applicant: INVENSENSE INC.Inventors: Steven S. NASIRI, Goksen G. YARALIOGLU, Joseph SEEGER, Babak TAHERI
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Publication number: 20080314147Abstract: A system and method in accordance with the present invention provides for a low cost, bulk micromachined accelerometer integrated with electronics. The accelerometer can also be integrated with rate sensors that operate in a vacuum environment. The quality factor of the resonances is suppressed by adding dampers. Acceleration sensing in each axis is achieved by separate structures where the motion of the proof mass affects the value of sense capacitors differentially. Two structures are used per axis to enable full bridge measurements to further reduce the mechanical noise, immunity to power supply changes and cross axis coupling. To reduce the sensitivity to packaging and temperature changes, each mechanical structure is anchored to a single anchor pillar bonded to the top cover.Type: ApplicationFiled: June 21, 2007Publication date: December 25, 2008Applicant: InvenSense Inc.Inventors: Steven S. Nasiri, Joseph Seeger, Goksen Yaralioglu
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Patent number: 7458263Abstract: A dual-axis sensor for measuring X and Y components of angular velocity in an X-Y sensor plane is provided. The dual-axis sensor includes a first subsensor for measuring the X component of angular velocity, and a second subsensor for measuring the Y component of angular velocity. The first subsensor and the second subsensor are contained within a single hermetic seal within the dual-axis sensor.Type: GrantFiled: November 18, 2005Date of Patent: December 2, 2008Assignee: Invensense Inc.Inventors: Steven S. Nasiri, Joseph Seeger, Martin Lim, Anthony Francis Flannery, Jr., Alexander Castro
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Publication number: 20080115579Abstract: An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.Type: ApplicationFiled: February 5, 2008Publication date: May 22, 2008Applicant: INVENSENSE INC.Inventors: Joseph SEEGER, Steven Nasiri, Alexander Castro