Abstract: Machine learning, artificial intelligence, and other computer-implemented methods are used to identify various semantically important chunks in documents, automatically label them with appropriate datatypes and semantic roles, and use this enhanced information to assist authors and to support downstream processes. Chunk locations, datatypes, and semantic roles can often be automatically determined from what is here called “context”, to wit, the combination of their formatting, structure, and content; those of adjacent or nearby content; overall patterns of occurrence in a document, and similarities of all these things across documents (mainly but not exclusively among documents in the same document set).

Abstract: Performance of a collection of machines, arranged in a linear sequence of machines that form a linear communication orbit (LCO), is monitored. Multiple machines in the LCO receive, via the LCO, a set of rules (or various subsets of the same set of rules), each rule specifying one or a combination of conditions (e.g., a performance metric and corresponding criterion) for satisfying the rule, evaluate those rules with respect to locally occurring events and local processes, and store results of those evaluations in a local database. In response to a query sent to the machines via the LCO, each of the machines returns a report, including information identifying processes whose performance during the specified time period satisfies at least one rule in the set of one or more rules. Those reports are aggregated and used to generate a merged report reflecting performance information with respect to a set of machines.

Abstract: A microphone assembly includes a substrate, an acoustic transducer, an integrated circuit, and a cover couples to the substrate to enclose a back volume of the microphone assembly in which the acoustic transducer and the integrated circuit are disposed. The acoustic transducer includes a back plate and a diaphragm oriented parallel to the back plate disposed over an aperture in the substrate to receive acoustic signals. The cover is a metallic material with a thickness and a corresponding thermal diffusivity to attenuate incoming radio-frequency signals. The attenuation of the radio-frequency signals prevents ambient noise detectable by the microphone assembly.

Abstract: A wearable device includes various sensors including a microphone, heart rate monitor, pressure sensor, and so forth. The user can set the device to acquire audio data of their speech. For example, if the pressure sensor indicates the device is being worn and the user's heart rate exceeds a threshold value, audio data may be acquired. Onboard the device the audio data is processed in various ways such as detecting whether the audio data includes speech, applying a beamforming algorithm, compressing and encrypting the audio, and so forth. The audio data may be processed onboard the device, sent to another device, or a combination thereof for processing to determine sentiment data indicative of perceived emotional content of the speech. A user interface provides the user with information based on the sensor data, sentiment data, and so forth.

Abstract: A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity. The microphone assembly also includes a substrate comprising a first surface on which the integrated circuit is mounted, a guard ring mounted on the substrate and elevated relative to the first surface of the substrate, and a can mounted to the guard ring, wherein the can, the guard ring, and the substrate form a housing in which the transducer and integrated circuit are disposed.

Abstract: Microphone devices and methods for manufacturing microphone devices that include a substrate having a first surface and a second surface, a cover secured to the first surface of the substrate to form an enclosed back volume, an application specific integrated circuit (ASIC) embedded between the first surface and the second surface of the substrate, a microelectromechanical systems (MEMS) transducer mounted on the first surface of the substrate, and an inductor mounted on the first surface of the substrate.

Abstract: A microelectromechanical system (MEMS) transducer for integration in a microphone assembly is designed to produce heat-generated acoustic signals. The MEMS transducer generally comprises a substrate having an aperture, a transduction element located at least partially over the aperture and coupled to the substrate, electrical contacts coupled to the transduction element, and a resistor integrated with the substrate or the transduction element. The resistor is coupled to electrical contacts that are electrically isolated from the contacts of the MEMS transducer or transduction element. The transduction element includes an insulating material coupled to the substrate. The transduction element comprises a fixed electrode and a movable electrode located at least partially over the aperture of the substrate. The fixed electrode or the moving electrode is formed on the insulating material. The resistor can be formed on the insulating material or suspended from the insulating material.

Abstract: The present disclosure relates to a sensor assembly (100) comprising: a base (102) having a host-device interface (104), a lid (108) mounted on the base (102) to form a housing (110), the lid (108) having an insulative structural core (112) between an inner metal skin (114) and an outer metal skin (116); and a transduction element (118) disposed in the housing (112). Advantageously, the lid (108) of the sensor assembly (100) can help to minimize and reduce undesirable thermo-acoustic effects produced by external environmental conditions that may result in acoustic artifacts.

Abstract: The present disclosure relates to a sensor assembly (100) comprising: a base (102) having a host-device interface (104), a lid (108) mounted on the base (102) to form a housing (110), the lid (108) having an insulative structural core (112) between an inner metal skin (114) and an outer metal skin (116); and a transduction element (118) disposed in the housing (112). Advantageously, the lid (108) of the sensor assembly (100) can help to minimize and reduce undesirable thermo-acoustic effects produced by external environmental conditions that may result in acoustic artifacts.

Abstract: A MEMS vibration sensor die can include a substrate having a top portion, a mounting surface, and an aperture extending at least partially through the substrate. The die can include a first electrode coupled to the top portion of the substrate and positioned over the aperture. The die can include a second electrode disposed between the substrate and the first electrode. The second electrode can be spaced apart from the first electrode. The die can include a proof mass that can have a first portion coupled to the first electrode or the second electrode. The proof mass can have a second end opposite the first portion. The second end can be recessed within the aperture relative to the mounting surface of the substrate. The proof mass can be suspended freely within the aperture. The proof mass can move the first electrode or the second electrode from which it is suspended in response to vibration.

Abstract: An aerial vehicle is configured to process an image captured by an imaging device, and to identify a portion of the image that is likely to appear in images subsequently captured by the imaging device based on the motion of the aerial vehicle. A control unit aboard the aerial vehicle generates instructions for controlling such motion and provides the instructions to the imaging device. Based on such instructions, the imaging device processes the image to identify a portion of the image that will appear within a field of view of the imaging device following the motion, and selects a shutter speed, an aperture, a level of gain, or another attribute of the imaging device based on the portion of the image, in order to optimize the quality of an image subsequently captured by the imaging device.

Abstract: Systems, methods, and computer-readable media are disclosed for systems and methods for initiating automated actions using ring-shaped electronic devices. Example methods may include determining, by a ring-shaped electronic device comprising a button, a first user interaction with the button, determining that a first action associated with the first button sequence identifier is to initiate a synchronous communication, determining contact information associated with the first action, and initiating the synchronous communication using the contact information.

Abstract: Systems and apparatuses for a microelectromechanical system (MEMS) device. The MEMS device includes a housing, a transducer, and a sensor. The housing includes a substrate defining a port and a cover. The substrate and the cover cooperatively form an internal cavity. The port fluidly couples the internal cavity to an external environment. The transducer is disposed within the internal cavity and positioned to receive acoustic energy through the port. The transducer is configured to convert the acoustic energy into an electrical signal. The sensor is disposed within the internal cavity and positioned to receive a gas through the port. The sensor is configured to facilitate detecting at least one of an offensive odor, smoke, a volatile organic compound, carbon monoxide, carbon dioxide, a nitrogen oxide, methane, and ozone.

Abstract: Systems, methods, and computer-readable media are disclosed for systems and methods for detecting hand gestures using ring-shaped electronic devices. Example methods may include determining, by a ring-shaped electronic device comprising a motion sensor, first motion sensor data using the motion sensor, determining a first hand motion associated with the first motion sensor data, determining a first action associated with the first hand motion, and causing the first action to be implemented at a user device that is in wireless communication with the ring-shaped electronic device.

Abstract: According to some embodiments, the present disclosure is directed to a printed circuit board for a microphone assembly that includes a top layer structured for a MEMS transducer to be mounted thereon, a bottom layer, at least one edge, a ground plane, and a conductor electrically connected to the ground plane and the bottom layer. The MEMS transducer includes a transducer substrate, a back plate and a diaphragm. The conductor extends vertically from the top layer to the bottom layer of the printed circuit board, and horizontally along a portion of a length of at least one edge of the printed circuit board. The printed circuit board includes two short edges and two long edges, and the conductor is connected to at least one of the four edges.

Abstract: A microphone assembly includes a substrate, an acoustic transducer, an integrated circuit, and a cover couples to the substrate to enclose a back volume of the microphone assembly in which the acoustic transducer and the integrated circuit are disposed. The acoustic transducer includes a back plate and a diaphragm oriented parallel to the back plate disposed over an aperture in the substrate to receive acoustic signals. The cover is a metallic material with a thickness and a corresponding thermal diffusivity to attenuate incoming radio-frequency signals. The attenuation of the radio-frequency signals prevents ambient noise detectable by the microphone assembly.

Abstract: A microelectromechanical system (MEMS) transducer for integration in a microphone assembly is designed to produce heat-generated acoustic signals. The MEMS transducer generally comprises a substrate having an aperture, a transduction element located at least partially over the aperture and coupled to the substrate, electrical contacts coupled to the transduction element, and a resistor integrated with the substrate or the transduction element. The resistor is coupled to electrical contacts that are electrically isolated from the contacts of the MEMS transducer or transduction element. The transduction element includes an insulating material coupled to the substrate. The transduction element comprises a fixed electrode and a movable electrode located at least partially over the aperture of the substrate. The fixed electrode or the moving electrode is formed on the insulating material. The resistor can be formed on the insulating material or suspended from the insulating material.

Abstract: A hydraulic fracturing valve control system includes an electric powered, multi-plunger hydraulic fracturing pump. The system also includes a manifold coupled to the hydraulic fracturing pump. The system further includes a valve associated with the manifold, the valve being operable to move between an open position, a closed position, and a plurality of intermediate positions. The system includes a valve actuator, coupled to the valve, the valve actuator being an electric actuator that is remotely controllable in response to one or more operational aspects of the hydraulic fracturing pump. The system also includes a control interface, the control interface forming at least a portion of a control system, the control interface being accessible from a location remote from the hydraulic fracturing pump and outside of a zone of pressure formed by the hydraulic fracturing pump during operation.

Abstract: Microphone devices and methods for manufacturing microphone devices that include a substrate having a first surface and a second surface, a cover secured to the first surface of the substrate to form an enclosed back volume, an application specific integrated circuit (ASIC) embedded between the first surface and the second surface of the substrate, a microelectromechanical systems (MEMS) transducer mounted on the first surface of the substrate, and an inductor mounted on the first surface of the substrate.

Abstract: A microphone includes a housing including a substrate and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The microphone also includes a microelectromechanical systems (MEMS) transducer and an integrated circuit (IC) positioned within the housing and mounted on a common surface of the housing, where the MEMS transducer is electrically connected to the IC, and the IC is electrically connected to a conductor on the substrate. The microphone further includes an encapsulating material covering the IC, and an encapsulating material confinement structure disposed between the MEMS transducer and the IC, where the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.