Patents by Inventor Joshua Watson

Joshua Watson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200245078
    Abstract: A microphone includes a housing including a substrate and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The microphone also includes a microelectromechanical systems (MEMS) transducer and an integrated circuit (IC) positioned within the housing and mounted on a common surface of the housing, where the MEMS transducer is electrically connected to the IC, and the IC is electrically connected to a conductor on the substrate. The microphone further includes an encapsulating material covering the IC, and an encapsulating material confinement structure disposed between the MEMS transducer and the IC, where the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.
    Type: Application
    Filed: April 17, 2020
    Publication date: July 30, 2020
    Applicant: Knowles Electronics, LLC
    Inventors: Tony K. Lim, John Szczech, Joshua Watson
  • Publication number: 20200196065
    Abstract: A transducer assembly comprises an acoustic transducer comprising a transducer substrate having a first aperture defined at a first location of the transducer substrate, an acoustic transducer diaphragm disposed on the transducer substrate over the first aperture, and an acoustic transducer back plate disposed on the transducer substrate axially spaced apart from the acoustic transducer diaphragm over the first aperture. The transducer assembly also includes a vibration transducer comprising the transducer substrate having a second aperture defined at a second location thereof, a vibration transducer diaphragm disposed on the transducer substrate over the second aperture, a vibration transducer back plate disposed on the transducer substrate axially spaced apart from the vibration transducer back plate over the second aperture, and an anchor coupled to one of the vibration transducer diaphragm or the vibration transducer back plate, the anchor disposed in the second aperture and suspended freely therewithin.
    Type: Application
    Filed: December 11, 2019
    Publication date: June 18, 2020
    Applicant: Knowles Electronics, LLC
    Inventors: Michael Pedersen, John Albers, Daryl Barry, Venkataraman Chandrasekaran, Sarmad Qutub, Joshua Watson
  • Patent number: 10631099
    Abstract: A microphone includes a substrate defining an embedded cavity between a first surface of the substrate and an opposing second surface of the substrate, the first surface defining a first opening into the embedded cavity, a distance between the first surface and the second surface defining a substrate thickness. A cover is disposed over the first surface of the substrate and forms a housing, the cover including a port, the substrate thickness being greater than a height of the cover from the first surface of the substrate. A microelectromechanical systems (MEMS) transducer is disposed in the housing and mounted on the first surface of the substrate over the first opening, and an integrated circuit (IC) is disposed in the housing and electrically coupled to the MEMS transducer. The MEMS transducer and the IC are disposed in a front volume of the housing defined by the cover and the substrate.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: April 21, 2020
    Assignee: Knowles Electronics, LLC
    Inventors: Tony K. Lim, John Szczech, Joshua Watson
  • Patent number: 10547955
    Abstract: A microphone device includes a housing including a substrate having a first surface and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The device also includes a microelectromechanical systems (MEMS) transducer mounted on the substrate and an integrated circuit (IC) mounted on the substrate. The MEMS transducer of the device is electrically connected to the IC, and the IC of the device is electrically connected to a conductor on the substrate. An encapsulating material covers the IC. And an encapsulating material confinement structure is disposed between the MEMS transducer and the IC, wherein the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: January 28, 2020
    Assignee: Knowles Electronics, LLC
    Inventors: Tony K. Lim, John Szczech, Joshua Watson
  • Patent number: 10405078
    Abstract: A microphone device comprises a microphone die including a microphone motor, an acoustic integrated circuit structured to process signals produced by the microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 3, 2019
    Assignee: Knowles Electronics, LLC
    Inventors: Venkataraman Chandrasekaran, Claus Furst, Joshua Watson, John Szczech
  • Publication number: 20190104351
    Abstract: A microphone device comprises a microphone die including a microphone motor, an acoustic integrated circuit structured to process signals produced by the microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 4, 2019
    Applicant: Knowles Electronics, LLC
    Inventors: Venkataraman Chandrasekaran, Claus Furst, Joshua Watson, John Szczech
  • Publication number: 20190014421
    Abstract: A microphone includes a substrate defining an embedded cavity between a first surface of the substrate and an opposing second surface of the substrate, the first surface defining a first opening into the embedded cavity, a distance between the first surface and the second surface defining a substrate thickness. A cover is disposed over the first surface of the substrate and forms a housing, the cover including a port, the substrate thickness being greater than a height of the cover from the first surface of the substrate. A microelectromechanical systems (MEMS) transducer is disposed in the housing and mounted on the first surface of the substrate over the first opening, and an integrated circuit (IC) is disposed in the housing and electrically coupled to the MEMS transducer. The MEMS transducer and the IC are disposed in a front volume of the housing defined by the cover and the substrate.
    Type: Application
    Filed: September 11, 2018
    Publication date: January 10, 2019
    Applicant: Knowles Electronics, LLC
    Inventors: Tony K. Lim, John Szczech, Joshua Watson
  • Patent number: 10154328
    Abstract: A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed MEMS microphone die and the ASIC, and provides electrical, physical, and environmental protection for the MEMS microphone die and the ASIC. The surface-mountable package allows external acoustic energy to enter the package interior via one or more acoustic ports and impinge on the diaphragm of the MEMS microphone die. The cover of the surface-mountable package comprises an acoustic port with ingress protection to limit dust and particle intrusion. The ingress protection can be a formed member that is part of the cover of the surface-mountable package having various shapes, an internal shield, or a combination of both a formed member and internal shield.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: December 11, 2018
    Assignee: Knowles Electronics, LLC
    Inventors: Joshua Watson, Daniel Todd Grosse, Michael Robert Jacobs, William F. Schimpf, Ivelisse Del Valle Figueroa
  • Patent number: 10149031
    Abstract: A microphone device comprises a microphone die including a first microphone motor and a second microphone motor, an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a first microphone motor and a second microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: December 4, 2018
    Assignee: Knowles Electronics, LLC
    Inventors: Venkataraman Chandrasekaran, Claus Furst, Joshua Watson, John Szczech
  • Publication number: 20180343524
    Abstract: A microphone device includes a substrate having a cavity. The device also includes a microelectromechanical systems (MEMS) transducer mounted on the substrate outside of the cavity and an application specific integrated circuit mounted in the cavity. A first set of bonding wires connect the MEMS transducer to the ASIC and a second set of bonding wires connect the ASIC to a conductor within the cavity. An encapsulating material completely covers the ASIC and at least a portion of the second set of wires and is substantially confined within the cavity. A cover is installed over the substrate to cover the MEMS transducer, the encapsulating material, the ASIC, the first set of bonding wires, and the second set of bonding wires.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 29, 2018
    Applicant: Knowles Electronics, LLC
    Inventors: Tony K. Lim, John Szczech, Joshua Watson
  • Publication number: 20180070158
    Abstract: A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed MEMS microphone die and the ASIC, and provides electrical, physical, and environmental protection for the MEMS microphone die and the ASIC. The surface-mountable package allows external acoustic energy to enter the package interior via one or more acoustic ports and impinge on the diaphragm of the MEMS microphone die. The cover of the surface-mountable package comprises an acoustic port with ingress protection to limit dust and particle intrusion. The ingress protection can be a formed member that is part of the cover of the surface-mountable package having various shapes, an internal shield, or a combination of both a formed member and internal shield.
    Type: Application
    Filed: September 18, 2017
    Publication date: March 8, 2018
    Applicant: Knowles Electronics, LLC
    Inventors: Joshua WATSON, Daniel Todd GROSSE, Michael Robert JACOBS, William F. SCHIMPF, Ivelisse DEL VALLE FIGUEROA
  • Publication number: 20170347174
    Abstract: A microphone device comprises a microphone die including a first microphone motor and a second microphone motor, an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a first microphone motor and a second microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.
    Type: Application
    Filed: May 24, 2017
    Publication date: November 30, 2017
    Applicant: Knowles Electronics, LLC
    Inventors: Venkataraman Chandrasekaran, Claus Furst, Joshua Watson, John Szczech
  • Patent number: 9794661
    Abstract: A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed MEMS microphone die and the ASIC, and provides electrical, physical, and environmental protection for the MEMS microphone die and the ASIC. The surface-mountable package allows external acoustic energy to enter the package interior via one or more acoustic ports and impinge on the diaphragm of the MEMS microphone die. The cover of the surface-mountable package comprises an acoustic port with ingress protection to limit dust and particle intrusion. The ingress protection can be a formed member that is part of the cover of the surface-mountable package having various shapes, an internal shield, or a combination of both a formed member and internal shield.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: October 17, 2017
    Assignee: Knowles Electronics, LLC
    Inventors: Joshua Watson, Daniel Todd Grosse, Michael Robert Jacobs, William F. Schimpf, Ivelisse Del Valle Figueroa
  • Publication number: 20170041692
    Abstract: A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed MEMS microphone die and the ASIC, and provides electrical, physical, and environmental protection for the MEMS microphone die and the ASIC. The surface-mountable package allows external acoustic energy to enter the package interior via one or more acoustic ports and impinge on the diaphragm of the MEMS microphone die. The cover of the surface-mountable package comprises an acoustic port with ingress protection to limit dust and particle intrusion. The ingress protection can be a formed member that is part of the cover of the surface-mountable package having various shapes, an internal shield, or a combination of both a formed member and internal shield.
    Type: Application
    Filed: August 7, 2015
    Publication date: February 9, 2017
    Inventors: Joshua Watson, Daniel Todd Grosse, Michael Robert Jacobs, William F. Schimpf, Ivelisse Del Valle Figueroa
  • Publication number: 20170026730
    Abstract: A microphone includes a base, a MEMS device, and an integrated circuit. The MEMS device includes a diaphragm and a back plate. The MEMS device is connected to the integrated circuit. The microphone also includes a temperature sensor. A lid enclosed the MEMS device and the integrated circuit.
    Type: Application
    Filed: July 21, 2016
    Publication date: January 26, 2017
    Applicant: Knowles Electronics, LLC
    Inventors: John J. Albers, Joshua Watson, Lance Barron, Kurt B. Friel, Norman Dennis Talag
  • Publication number: 20170026760
    Abstract: Various embodiments relating to microphone with integrated sensor are disclosed herein. In one implementation, a sensor is disposed in, on, integrated with, and/or at the lid of a micro electro mechanical system (MEMS) microphone. In another implementation, a sensor is disposed at or integrated with an insert, over which a micro electro mechanical system (MEMS) device is disposed in a MEMS microphone. In disposing the sensor at the lid or insert, significant space savings are achieved. Consequently, a small-sized microphone is provided and achieved allowing the microphone deployed in applications where miniaturization is required or advantageous.
    Type: Application
    Filed: July 21, 2016
    Publication date: January 26, 2017
    Applicant: Knowles Electronics, LLC
    Inventors: John J. Albers, Joshua Watson, Kurt B. Friel, Norman Dennis Talag, Sung Bok Lee
  • Publication number: 20160100256
    Abstract: A microelectromechanical system (MEMS) microphone includes a base; a cover having a port extending therethrough; a MEMS die coupled to the cover, the MEMS die including a diaphragm and a back plate; an application specific integrated circuit (ASIC) coupled to the cover and the MEMS die; and an electrical interconnection from the ASIC to the base, the electrical interconnection being disposed on an inside surface of the cover. The base includes customer pads, the customer pads on the base being connected electrically to the ASIC via the electrical interconnection. The microphone is connected to a customer board at the base and arranged such that sound enters through the port in the cover.
    Type: Application
    Filed: October 28, 2015
    Publication date: April 7, 2016
    Inventors: Joshua Watson, Ivelisse Del Valle Figueroa
  • Patent number: 9307328
    Abstract: A microphone includes an interposer, a lid, and a base. The interposer includes at least one wall portion that forms a cavity. The wall portion includes a first side and a second side that are opposite from each other. The lid is coupled to the first side of the interposer and the base is coupled to the second side of the interposer such that the lid and the base enclose the cavity. A microelectromechanical system (MEMS) device is disposed in the cavity. The interposer structurally supports one or both of the lid and the base. The interposer includes a plurality of plated regions that are configured to electrically connect the lid and the base. The plated regions are configured to at least partially be exposed and open to the cavity.
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: April 5, 2016
    Assignee: Knowles Electronics, LLC
    Inventors: John Szczech, Joshua Watson, Gregory B. Servis
  • Publication number: 20150195659
    Abstract: A microphone includes an interposer, a lid, and a base. The interposer includes at least one wall portion that forms a cavity. The wall portion includes a first side and a second side that are opposite from each other. The lid is coupled to the first side of the interposer and the base is coupled to the second side of the interposer such that the lid and the base enclose the cavity. A microelectromechanical system (MEMS) device is disposed in the cavity. The interposer structurally supports one or both of the lid and the base. The interposer includes a plurality of plated regions that are configured to electrically connect the lid and the base. The plated regions are configured to at least partially be exposed and open to the cavity.
    Type: Application
    Filed: January 6, 2015
    Publication date: July 9, 2015
    Inventors: John Szczech, Joshua Watson, Gregory B. Servis
  • Publication number: 20150117681
    Abstract: A microelectromechanical system (MEMS) microphone includes a base having a port extending there through. A MEMS die is coupled to the base, and the MEMS die includes a diaphragm and a back plate. An application specific integrated circuit (ASIC) is coupled to the base and the MEMS die. A cover is coupled to the base, and the cover includes customer pads. The customer pads on the cover are connected electrically to the ASIC, and the cover is arranged to form an air tight seal with the base and enclose the MEMS die and the ASIC. The microphone is connected to a customer board at the cover and arranged such that sound enters through the port in the base.
    Type: Application
    Filed: October 27, 2014
    Publication date: April 30, 2015
    Inventors: Joshua Watson, John Szczech, Greg Servis