Abstract: An implantable medical device (IMD) and methods of fabricating the same are provided. An IMD can include a housing and a cofire ceramic module (CCM) coupled to the housing. The CCM can include an antenna cofire-integrated in the CCM. The antenna can include a plate composed of conductive material, and conductive antenna elements that are annular substrates having perimeters substantially coextensive with the perimeter of the plate. The antenna can also include interconnections. A first set of interconnections can be coupled between the plate and one of the conductive antenna elements, and a second set of interconnections can be coupled between the conductive antenna elements. The antenna can also include a feed line conductively coupled to the plate. In some embodiments, the feed line can be substantially serpentine-shaped to adjust impedance in the CCM.

Abstract: An antenna for an implantable medical device (IMD) is provided that is formed on the same substrate as the telemetry circuitry for the IMD. The telemetry circuitry is formed on a portion of the substrate within the interior of a housing for the IMD, while at least one antenna is formed on an exterior portion of the substrate on the exterior of the housing to allow for far field telemetry. At least one electrical interconnect is formed on the substrate for connecting the antenna to the telemetry circuitry, where the electrical interconnect may comprise a controlled impedance line to minimize loss. A conformally-shaped hermetic cover, such as a ceramic material, may be formed in a desired shape around the exterior portion of the substrate and antenna and cofired together to form a monolithic structure encasing the antenna and exterior portion of the substrate.

Abstract: An implantable medical device (IMD) antenna and methods of fabricating the same are provided. An IMD can include a ceramic structure having at least one wall defining a hollow cavity. The ceramic structure can include a first end and a second end distal from the first end, the first end being open to provide access to the hollow cavity and the second end being closed. The IMD also includes an antenna cofire-integrated into the at least one wall of the ceramic structure and a housing adjoined to the ceramic structure.

Abstract: An implantable medical device (IMD) antenna and methods of fabricating the same are provided. An IMD can include a ceramic structure having at least one wall defining a hollow cavity. The ceramic structure can include a first end and a second end distal from the first end, the first and second ends being open to provide access to the hollow cavity. The IMD also includes an antenna cofire-integrated into the at least one wall of the ceramic structure and a housing adjoined to the ceramic structure.

Abstract: An implantable medical device (IMD) and methods of fabricating the same are provided. An IMD can include a housing and a cofire ceramic module (CCM) coupled to the housing. The CCM can include an antenna cofire-integrated in the CCM. The antenna can include a plate composed of conductive material, and conductive antenna elements that are annular substrates having perimeters substantially coextensive with the perimeter of the plate. The antenna can also include interconnections. A first set of interconnections can be coupled between the plate and one of the conductive antenna elements, and a second set of interconnections can be coupled between the conductive antenna elements. The antenna can also include a feed line conductively coupled to the plate. In some embodiments, the feed line can be substantially serpentine-shaped to adjust impedance in the CCM.

Abstract: An implantable medical device (IMD) antenna and methods of fabricating the same are provided. An IMD can include a ceramic structure having at least one wall defining a hollow cavity. The ceramic structure can include a first end and a second end distal from the first end, the first and second ends being open to provide access to the hollow cavity. The IMD also includes an antenna cofire-integrated into the at least one wall of the ceramic structure and a housing adjoined to the ceramic structure.

Abstract: An implantable medical device (IMD) antenna and methods of fabricating the same are provided. An IMD can include a ceramic structure having at least one wall defining a hollow cavity. The ceramic structure can include a first end and a second end distal from the first end, the first end being open to provide access to the hollow cavity and the second end being closed. The IMD also includes an antenna cofire-integrated into the at least one wall of the ceramic structure and a housing adjoined to the ceramic structure.

Abstract: An antenna for an implantable medical device (IMD) is provided including a monolithic structure derived from a plurality of discrete dielectric layers having an antenna embedded within the plurality of dielectric layers. The antenna includes antenna portions formed within different layers of the monolithic structure with at least one conductive via formed to extend through the dielectric layers in order to provide a conductive pathway between the portions of the antenna formed on different layers, such that an antenna is formed that extends between different vertical layers. The dielectric layers may comprise layers of ceramic material that can be co-fired together with the antenna to form a hermetically sealed monolithic antenna structure. The antenna embedded within the monolithic structure can be arranged to have a substantially spiral, helical, fractal, meandering or planer serpentine spiral shape.

Abstract: A co-fired electrical feedthrough for an implantable medical device (IMD) is provided having a shielded radio frequency (RF) conductive path. The feedthrough includes a monolithic structure derived from one or more layers of dielectric material and a conductive pathway extending through the monolithic structure for communicating RF signals into and from the IMD. An internal shield is formed to extend through at least one of the layers of dielectric material so as to surround the conductive pathway (e.g., in a coaxial relationship) and shield the RF conductive pathway from undesirable signals. This shielding of the RF conductive pathway prevents destructive EMI signals from entering into the IMD through the RF conductive pathway. In some embodiments, a monolithic structure containing embedded impedance matching elements is electrically connected to at least one conductive pathway in the feedthrough to perform impedance matching and/or filtering of the conductive pathway to other circuitry.

Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

Abstract: An implantable medical device (“IMD”) is provided having an antenna and an RF telemetry module for far field telemetry communications arranged on an exterior of the IMD housing, such that telemetry signal processing may be performed on the exterior of the housing. One or more feedthrough conductive paths extend through the housing to communicatively couple the RF module to circuitry within the housing. In this manner RF module is arranged entirely external to the housing, such that only power and/or low frequency data bit signals are required to be passed through the feedthrough conductive path. This allows the feedthrough conductive path to be filtered to prevent undesired interference signals (e.g., electromagnetic interference (EMI) signals) from entering the housing through the feedthrough conductive path coupled to the RF module. In some embodiments, the antenna and RF module are formed in an integrated assembly attachable to an exterior portion of the housing.

Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

Abstract: An antenna structure for an implantable medical device (IMD) is provided including a lower dielectric biocompatible antenna portion positioned on a body side of the structure and a high dielectric portion including at least one dielectric substrate having a high dielectric constant positioned on a device side of the structure. The biocompatible antenna portion is derived from an antenna layer, a biocompatible surface layer, and at least one layer of biocompatible dielectric material (e.g., high temperature cofire ceramic (HTCC) material) that provides a matching gradient between the antenna and the surrounding environment. The high dielectric portion may include at least one layer of low temperature cofire ceramic (LTCC) material. The high dielectric portion may be bonded to the biocompatible antenna portion or cofired with the biocompatible antenna portion to form a single bilayer monolithic antenna structure having a lower dielectric HTCC biocompatible antenna portion and a high dielectric LTCC portion.

Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

Abstract: An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.

Abstract: An antenna structure for an implantable medical device (IMD) is provided that includes an antenna embedded within a structure derived from a plurality of discrete dielectric layers. An array of electrodes are connected to the antenna structure and arranged for applying a bias across selected segments of the dielectric layers for altering the performance characteristics of the antenna. The bias applied by the array of electrodes can be selected to provide desired impedance matching between the antenna and the surrounding environment of the implant location to mitigate energy reflection effects at the transition from the antenna structure to the surrounding environment, to provide beam steering functionality for the antenna, or to alter the gain of the signals received by the antenna. IMD is configured to monitor received signal characteristics (e.g., RSSI, EVM or bit error rate) and alter material properties of the dielectric material through biasing to control antenna performance.

Abstract: A co-fired electrical feedthrough for an implantable medical device (IMD) is provided having a shielded radio frequency (RF) conductive path. The feedthrough includes a monolithic structure derived from one or more layers of dielectric material and a conductive pathway extending through the monolithic structure for communicating RF signals into and from the IMD. An internal shield is formed to extend through at least one of the layers of dielectric material so as to surround the conductive pathway (e.g., in a coaxial relationship) and shield the RF conductive pathway from undesirable signals. This shielding of the RF conductive pathway prevents destructive EMI signals from entering into the IMD through the RF conductive pathway. In some embodiments, a monolithic structure containing embedded impedance matching elements is electrically connected to at least one conductive pathway in the feedthrough to perform impedance matching and/or filtering of the conductive pathway to other circuitry.

Abstract: An implantable medical device (“IMD”) is provided having an antenna and an RF telemetry module for far field telemetry communications arranged on an exterior of the IMD housing, such that telemetry signal processing may be performed on the exterior of the housing. One or more feedthrough conductive paths extend through the housing to communicatively couple the RF module to circuitry within the housing. In this manner RF module is arranged entirely external to the housing, such that only power and/or low frequency data bit signals are required to be passed through the feedthrough conductive path. This allows the feedthrough conductive path to be filtered to prevent undesired interference signals (e.g., electromagnetic interference (EMI) signals) from entering the housing through the feedthrough conductive path coupled to the RF module. In some embodiments, the antenna and RF module are formed in an integrated assembly attachable to an exterior portion of the housing.

Abstract: An antenna structure for an implantable medical device (IMD) is provided that includes an antenna embedded within a structure derived from a plurality of discrete dielectric layers. An array of electrodes are connected to the antenna structure and arranged for applying a bias across selected segments of the dielectric layers for altering the performance characteristics of the antenna. The bias applied by the array of electrodes can be selected to provide desired impedance matching between the antenna and the surrounding environment of the implant location to mitigate energy reflection effects at the transition from the antenna structure to the surrounding environment, to provide beam steering functionality for the antenna, or to alter the gain of the signals received by the antenna. IMD is configured to monitor received signal characteristics (e.g., RSSI, EVM or bit error rate) and alter material properties of the dielectric material through biasing to control antenna performance.