Abstract: The present invention relates generally to forming interconnects over contacts and more particularly, to a method and structure for filling interconnect trenches with a sacrificial filler material before removal of a hard mask layer to protect the liners of the contacts from damage during the removal process. A method is disclosed that may include: filling an opening in a dielectric layer above a contact and a contact liner with a sacrificial filler material, such that the contact liner is completely covered by the sacrificial filler material; removing a hard mask layer used to pattern and form the opening; and removing the sacrificial filler material from the opening selective to the dielectric layer, the contact liner, and the contact to form an interconnect trench.