Abstract: A silicon photonics optical transceiver device includes a silicon photonics optical module and a heat conducting housing that accommodates the silicon photonic optical module therein. The heat conducting housing has an inner surface formed with a first heat dissipation portion that wraps around and is in contact with transmitter optical sub-assemblies of the silicon photonics optical module to realize thermal conduction, and a second heat dissipation portion that is in contact with a digital signal processor of the silicon photonics optical module to realize thermal conduction.

Abstract: A method of Webpage navigation can include a computer device loading a Webpage having at least a first portion and a second portion, arranging the Webpage in order to present the first portion in the display area of the computer device and to place the second portion out of the display area, and presenting a navigation map corresponding to the Webpage in the display area. In response to a control command input with respect to the navigation map, the Webpage can be arranged in order to present the second portion in the display area.

Abstract: A semiconductor device includes a first dielectric layer disposed over a substrate and a conductive feature, a doped dielectric layer disposed over the first dielectric layer, a first metal portion disposed in the first dielectric layer and in contact with the conductive feature, and a doped metal portion disposed over the first metal portion. The first metal portion and the doped metal portion include a same noble metal material. The doped dielectric layer and the doped metal portion include same dopants. The dopants are bonded to the noble metal material.

Abstract: Methods of post-polymerization modification of a polymer are provided herein. The present methods comprise the step of reacting a polymer with at least one nucleophile in a nucleophilic substitution reaction performed without a solvent to produce a functionalized polymer. The nucleophile can be selected from the group consisting of thioacetate, phenoxide, alkoxide, carboxylate, thiolate, thiocarboxylate, dithiocarboxylate, thiourea, thiocarbamate, dithiocarbamate, xanthate, thiocyanate. Nucleophilic substitution reaction can be performed in the presence of a phase transfer catalyst. Nucleophilic substitution reaction can also be performed via a two-step in-situ reactive mixing process with the initial formation of the polymer-amine ionomer (polymer-NR3+Br) which catalyzes the subsequent nucleophilic substitution with a second nucleophile to form a bi-functional polymer.

Abstract: A semiconductor device includes a source feature and a drain feature disposed over a substrate. The semiconductor device includes a source via electrically coupled to the source feature and a drain via electrically coupled to the drain feature. The semiconductor device includes a source via metal line disposed over and directly connected to the source via. The semiconductor device includes and a drain via metal line disposed over and directly connected to the drain via. The source via metal line has two first outer edges extending lengthwise along a first direction and at least one of the first outer edges is substantially aligned with an edge of the source via from a top view. The drain via metal line has two second outer edges extending lengthwise along the first direction and the two second outer edges are offset from edges of the drain via from a top view.

Abstract: An image capturing module includes a flexible circuit board and an image sensor. The flexible circuit board includes a plurality of first pads and a plurality of second pads. The first pads are disposed on a first surface of the flexible circuit board and the second pads are disposed on a second surface of the flexible circuit board, wherein the first surface is opposite to the second surface. The image sensor is disposed on the first surface. A distance between the image sensor and the first pads is identical to a distance between the image sensor and the second pads. The flexible circuit board is folded to align and weld the first pads with the second pads, such that a light receiving surface of the image sensor is perpendicular to surfaces of the first and second pads.

Abstract: The present disclosure encompasses immunogenic/therapeutic compositions including Globo series antigens (SSEA-4, Globo H or SSEA-3) glycoconjugates and therapeutic adjuvants (OBI-821 or OBI-834) as well as methods of making and using the same to treat proliferative diseases such as cancer. The therapeutic conjugates include an antigen linked to a carrier. In particular, the therapeutic conjugates include a SSEA-4, Globo H or SSEA-3 moiety and a KLH moiety subunit linked via a linker. The therapeutic compositions are in part envisaged to act as cancer vaccines (single valent, bi-valent or tri-valent vaccines) for boosting the body's natural ability to protect itself, through the immune system from dangers posed by damaged or abnormal cells such as cancer cells. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.

Abstract: Pharmaceutical composition comprising antibodies or antigen binding fragments thereof that bind to Globo H, stage-specific embryonic antigen 3 (SSEA-3) and stage-specific embryonic antigen 4 (SSEA-4) are disclosed herein, as well as methods of use thereof. Methods of use include, without limitation, cancer therapies and diagnostics. The antibodies of the disclosure can bind to certain cancer cell surfaces. Exemplary targets of the antibodies disclosed herein can include carcinomas, such as sarcoma, skin cancer, leukemia, lymphoma, brain cancer, glioblastoma, lung cancer, breast cancer, oral cancer, head-and-neck cancer, nasopharyngeal cancer, esophagus cancer, stomach cancer, liver cancer, bile duct cancer, gallbladder cancer, bladder cancer, pancreatic cancer, intestinal cancer, colorectal cancer, kidney cancer, cervix cancer, endometrial cancer, ovarian cancer, testical cancer, buccal cancer, oropharyngeal cancer, laryngeal cancer and prostate cancer.

Abstract: A method includes forming a dummy gate oxide on a wafer, and the dummy gate oxide is formed on a sidewall and a top surface of a protruding semiconductor fin in the wafer. The formation of the dummy gate oxide may include a Plasma Enhanced Chemical Vapor Deposition (PECVD) process in a deposition chamber, and the PECVD process includes applying a Radio Frequency (RF) power to a conductive plate below the wafer. The method further includes forming a dummy gate electrode over the dummy gate oxide, removing the dummy gate electrode and the dummy gate oxide to form a trench between opposing gate spacers, and forming a replacement gate in the trench.

Abstract: A color filter, a method for manufacturing a color filter, a color filter substrate, and a display device are disclosed. The color filter includes a first quantum dot light emitting layer and a first reflective layer. The first quantum dot light emitting layer has a light incident surface; and the first reflective layer is on a side of the first quantum dot light emitting layer away from the light incident surface, the first quantum dot light emitting layer includes a plurality of first quantum dots, the first quantum dots are configured to be stimulated by light of a first wavelength from the light incident surface to emit light of a second wavelength, and the first reflective layer is configured to transmit the light of the second wavelength and reflect the light of the first wavelength.

Abstract: A light source module including a light guide plate, a light-emitting assembly and an optical film is provided. The light guide plate has a first surface, a second surface opposite to the first surface, a first side surface, a second side surface opposite to the first side surface, and a light incident surface connecting the first surface, the second surface, the first side surface and the second side surface. The light-emitting assembly is disposed beside the light incident surface and is adapted to provide a light beam toward the light incident surface. The optical film is disposed on the second surface. The optical film has a light-emitting surface parallel to the second surface and away from the light guide plate. The light-emitting surface includes a first edge region adjacent to the first side surface, a second edge region adjacent to the second side surface, and a central region.

Abstract: The present invention provides a device for actively cancelling a target sound wavefront in an open space, the device comprising a signal processing module comprising at least one processor operatively coupled with a datastore, the at least one processor configured to: receive a data comprising one or more geographical features, and one or more audio features generated by one or more receiving microphones having a geographical relationship with an array of receiving microphones in an area adjacent to a user; process aid data using a prediction model adapting a trained deep learning framework; and provide output the inverse sound wavefront of the target sound at the area of said predicting microphones.

Abstract: A semiconductor wafer, a benchmark device embedded on a semiconductor wafer, and a method of operating a benchmark device embedded on a semiconductor wafer are provided. The semiconductor wafer includes a benchmark device disposed within a scribe line of the semiconductor wafer. The benchmark device includes a transistor, a diode, and a disconnecting switch electrically connected to the transistor and the diode. The disconnecting switch is configured to form a conductive path between the transistor and the diode at a first stage, and to electrically isolate the transistor from the diode at a second stage.

Abstract: The present disclosure provides a method of operating a benchmark device embedded on a semiconductor wafer. The method includes applying a first voltage to a first electrode of the benchmark device, and applying a second voltage to a second electrode of the benchmark device. The method further includes electrically isolating a first component of the benchmark device from a second component of the benchmark device through a disconnecting switch connected between the first component and the second component.

Abstract: A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.

Abstract: A method includes forming a first dielectric layer over a source/drain region, and forming a source/drain contact plug over and electrically connecting to the source/drain region. A top portion of the source/drain contact plug has a first lateral dimension. An implantation process is performed to implant a dopant into the first dielectric layer. The implantation process results in the source/drain contact plug to have a second lateral dimension smaller than the first lateral dimension. The method further includes forming a second dielectric layer over the etch stop layer, and forming a gate contact plug adjacent to the source/drain contact plug.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a gate structure over a substrate. The semiconductor structure also includes source/drain structures on opposite sides of the gate structure. The semiconductor structure also includes a dielectric layer over the gate structure and the source/drain structures. The semiconductor structure also includes a via plug passing through the dielectric layer and including a first group IV element. The dielectric layer includes a second group IV element, a first compound, and a second compound, and the second compound includes elements in the first compound and the first group IV element.

Abstract: A buoy position monitoring method includes a buoy positioning step, an unmanned aerial vehicle receiving step and an unmanned aerial vehicle flying step. In the buoy positioning step, a plurality of buoys are put on a water surface. Each of the buoys is capable of sending a detecting signal. Each of the detecting signals is sent periodically and includes a position dataset of each of the buoys. In the unmanned aerial vehicle receiving step, an unmanned aerial vehicle is disposed on an initial position, and the unmanned aerial vehicle receives the detecting signals. In the unmanned aerial vehicle flying step, when at least one of the buoys is lost, the unmanned aerial vehicle flies to a predetermined position to get contact with the at least one buoy that is lost.

Abstract: A cooling system includes a tank, a heat exchanger, a separation tank, a first tube, a second tube, a third tube, a gas storage device, a fourth tube, a first valve, a second valve and a third valve. A heating element is immersed in a dielectric liquid in the tank. The heat exchanger condenses dielectric vapor of the dielectric liquid. The separation tank is used for a separation operation. The first tube is connected to the tank and the heat exchanger. The second tube is connected to the heat exchanger and the separation tank. The third tube is connected to the separation tank and the tank. The gas storage device stores the dielectric vapor. The fourth tube is connected to the gas storage device and the separation tank.