Patents by Inventor Ju-in Yoon

Ju-in Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230042573
    Abstract: A robot hand module includes a thumb module, a plurality of finger modules, and a palm part to which the thumb module and the finger modules are coupled. The thumb module and the finger modules each include a phalangeal part movably coupled to the palm part, a cable part having a first side connected to the phalangeal part, and a driving part connected to a second side of the cable part and configured to operate the phalangeal part by extending the cable part to the outside or retracting the cable part, wherein each of the driving parts includes an inlet region from which the cable part is extended to the outside, and wherein an acute angle is defined between a first direction in which the inlet region is directed toward the outside and a second direction in which the driving parts are disposed.
    Type: Application
    Filed: March 3, 2022
    Publication date: February 9, 2023
    Inventors: Beom Su Kim, Hyun Seop Lim, Sang In Park, Ki Hyeon Bae, Kyu Jung Kim, Dong Hyun Lee, Joo Won Lee, Hyo Joong Kim, Dong Jin Hyun, Ju Young Yoon
  • Publication number: 20230042013
    Abstract: A robot hand module includes a palm part and a thumb module coupled to the palm part. The thumb module includes a thumb phalangeal part movably coupled to the palm part, a thumb cable part having a first side connected to the thumb phalangeal part, and a thumb driving part connected to a second side of the thumb cable part and configured to operate the thumb phalangeal part by extending the thumb cable part to the outside or retracting the thumb cable part. The thumb cable part includes a first thumb cable extended from the thumb driving part and having a first side fixed in the thumb phalangeal part and a second thumb cable having a first side and a second side fixed in the thumb phalangeal part.
    Type: Application
    Filed: March 18, 2022
    Publication date: February 9, 2023
    Inventors: Beom Su Kim, Hyun Seop Lim, Sang In Park, Ki Hyeon Bae, Kyu Jung Kim, Dong Hyun Lee, Joo Won Lee, Hyo Joong Kim, Dong Jin Hyun, Ju Young Yoon
  • Publication number: 20230021447
    Abstract: This patent proposal document provides a complete robot hand control scheme using myoelectric intention estimation of the human being using the kernel Principal Component Analysis Algorithm (kPCA). The robot hand system includes a biometric EMG sensor system, a robot hand including with multiple fingers, a controller connected with the biometric EMG sensor system, and a robot hand. The controller acquires the biometric EMG signal by means of a biometric sensor system, estimates myoelectric motion intention by applying the kernel principal component analysis (kPCA) algorithm using a kernel function, and delivers a control command corresponding to the estimated motion intention of the user to the robot hand.
    Type: Application
    Filed: June 20, 2022
    Publication date: January 26, 2023
    Inventors: Muhammad Zahak Jamal, Ju Young Yoon, Dong Hyun Lee
  • Patent number: 11559908
    Abstract: A robot uni includes: a first link forming a center of rotation of the robot unit; a second link configured to perform a revolution motion or a rotation motion based on the center of rotation when rotated about the first link; first members, each of which is provided between the first link and the second link; drivers, each of which is provided in a direction that faces the first link and is configured to provide driving forces to the first members; wires configured to transmit the driving forces of the drivers to the first members; and second members, each of which is provided on the first link and the second link, is wound by the wires, and is configured to perform a revolution motion or a rotation motion along with the first link and the second link in a case where each of the first members is driven.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: January 24, 2023
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Beom Su Kim, Sang In Park, Seung Kyu Nam, Dong Jin Hyun, Ju Young Yoon
  • Patent number: 11550413
    Abstract: A touch sensor integrated color filter and a manufacturing method for the touch sensor integrated filter are disclosed. In the touch sensor integrated color filter, a touch sensor layer including a metal layer and a transparent conductive layer is formed on a black matrix of a flexible color filter.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: January 10, 2023
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Seong Ho Park, Ju In Yoon, Kyoung Mo Lee, Young Chan Choi
  • Publication number: 20230001585
    Abstract: An embodiment rehabilitation robot control apparatus includes a brainwave signal measuring device configured to measure a brainwave signal of a user, a preprocessing device configured to preprocess the measured brainwave signal, a classification device configured to classify a motor intention of the user based on the brainwave signal preprocessed by the preprocessing device, and a controller configured to reflect the motor intention of the user in real time to control an operation or a stop of a rehabilitation robot.
    Type: Application
    Filed: May 25, 2022
    Publication date: January 5, 2023
    Inventors: Seung Kyu Nam, Ju Young Yoon, Tae Jun Lee, Beom Su Kim, Jae Seung Jeong, Jae Hyun Kim, Adedoyin Olumuyiwa Aderinwale, Jun Ha Jung, Dong Hwa Jeong
  • Publication number: 20220415769
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Application
    Filed: August 29, 2022
    Publication date: December 29, 2022
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Publication number: 20220384106
    Abstract: The present disclosure provides a capacitor module including: a capacitor; a first housing having a hexahedron shape and having an inner space in which the capacitor is disposed, the first housing including a pair of cooling parts recessed inwards from a pair of parallel surfaces among outer side surfaces thereof such that a refrigerant flows, a pair of cooling channels disposed inside opposite side surfaces perpendicular to the surfaces of the pair of cooling parts such that the pair of cooling parts communicate with each other, and a through-hole configured to connect each of the cooling channels to the outside such that the refrigerant is introduced or discharged therethrough; and a cooling plate coupled to the first housing so as to seal the cooling parts.
    Type: Application
    Filed: March 15, 2022
    Publication date: December 1, 2022
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Hyong Joon PARK, Ju Man YOON, Seul Bee LEE, Ju Hee KIM, Ok Geun HA, Se Heun KWON, Sung Jun YOON, Sang Hoon LEE
  • Publication number: 20220375985
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Application
    Filed: June 10, 2022
    Publication date: November 24, 2022
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Patent number: 11491072
    Abstract: A wearable apparatus for assisting muscular strength includes a back support, and a connection chain having a first end portion coupled to the back support to be rotatable upward or downward. The connection chain extends from the back of the wearer to a side thereof and includes a plurality of rotary elements arranged abreast laterally, each rotary element being rotatably coupled to an adjacent rotary element laterally. The wearable apparatus further includes an upper arm module that extends in a direction in which an upper arm of the wearer extends, one end portion of the upper arm module coupled to a second end portion of the connection chain to be rotatable upward or downward with respect to the one end portion. The upper arm module generates a rotational force for rotating the upper arm of the wearer upward or downward.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: November 8, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Kyu Jung Kim, Hyun Seop Lim, Ki Hyeon Bae, Ju Young Yoon, Dong Jin Hyun, Kyung Mo Jung
  • Patent number: 11495364
    Abstract: A method of decommissioning a nuclear facility, including: exposing the plurality of upper penetration holes by removing the plurality of sandboxes; enlarging an upper space of the cavity by cutting an upper portion of the biological shield concrete that is disposed between the plurality of upper penetration holes and between the plurality of upper penetration holes and the cavity; and separating the nuclear reactor pressure vessel from the biological shield concrete.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: November 8, 2022
    Assignee: KOREA HYDRO & NUCLEAR POWER CO., LTD.
    Inventors: Seok-Ju Hwang, Ju-Young Yoon, Young Hwan Hwang, Cheon-Woo Kim
  • Publication number: 20220335895
    Abstract: An organic light emitting diode display includes: a substrate; an overlapping layer on the substrate; a pixel on the substrate and the overlapping layer; and a scan line, a data line, a driving voltage line, and an initialization voltage line that are connected to the pixel. The pixel includes: an organic light emitting diode; a second transistor connected to the scan line and the data line; a driving transistor including a gate electrode, an input terminal, and an output terminal, and to apply a current to the organic light emitting diode from the output terminal; and a voltage application transistor to apply a voltage to the overlapping layer. An output of the second transistor is connected to the input terminal of the driving transistor, and the overlapping layer is between the driving transistor and the substrate while overlapping with the driving transistor on a plane.
    Type: Application
    Filed: July 1, 2022
    Publication date: October 20, 2022
    Inventors: Ju-Won YOON, Gun Hee KIM, Sang Ho PARK, Seung Chan LEE, Joo Hee JEON
  • Publication number: 20220331189
    Abstract: A walking assisting apparatus includes a leg mounted device configured to be mounted on a leg of a user to assist walking of the user. A waist mounted device is provided on an upper side of the leg mounted device and configured to be mounted on a waist of the user. A support is located on a front side of the leg mounted device and configured to contact a ground surface. A control device is coupled to a front side of the waist mounted device, electrically connected to the leg mounted device, and configured to control the leg mounted device. A connector connects the control device and the leg mounted device to detachably housing house the support.
    Type: Application
    Filed: September 24, 2021
    Publication date: October 20, 2022
    Inventors: Kyu Jung Kim, Hyun Seop Lim, Ju Young Yoon, Dong Jin Hyun, Sang In Park
  • Patent number: 11458617
    Abstract: A robot driving device includes a base provided at a point spaced apart from a joint part of a robot, a driving part installed to be movable on the base, and for providing a driving force to the joint part, a wire connecting the driving part and the joint part to transfer the driving force of the driving part to the joint part, an adjustment part having an elastic part for elastically supporting the driving part with respect to the base, and allowing the driving part to move on the base in order to give tension to the wire, and a fixing part for fixing relative locations of the driving part to the base at a point at which the driving part has moved.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: October 4, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Beom Su Kim, Sang In Park, Seung Kyu Nam, Dong Jin Hyun, Ju Young Yoon
  • Publication number: 20220310579
    Abstract: A display device and a method for fabricating the same. The display device includes a substrate including a circuit layer and a first pad unit; an auxiliary substrate disposed below the substrate and comprising a driving circuit and a second pad unit; a light-emitting unit disposed on the circuit layer; and a connection electrode in contact with a side surface of the substrate and electrically connecting the first pad unit with the second pad unit. The method includes forming a circuit layer and a first pad unit on a first surface of a substrate; forming a driving circuit and a second pad unit on a fourth surface of an auxiliary substrate; and attaching a second surface of the substrate opposite the first surface to a third surface of the auxiliary substrate opposite the fourth surface.
    Type: Application
    Filed: June 15, 2022
    Publication date: September 29, 2022
    Applicant: Samsung Display Co. Ltd.
    Inventors: Seung Chan LEE, Gun Hee KIM, Sang Ho PARK, Ju Won YOON, Joo Hee JEON, Hyun Joon KIM
  • Patent number: 11455065
    Abstract: A touch sensor according to an embodiment of the present invention includes a base layer, a first electrode layer disposed on the base layer, and a second electrode layer disposed at an upper level of the first electrode layer. The first electrode layer includes a plurality of first sensing electrode rows extending in a first direction parallel to a top surface of the base layer, and first traces branched from each of the first sensing electrode rows and alternately distributed on both lateral portions of the base layer. The second electrode layer includes a plurality of second sensing electrode columns extending in a second direction that is parallel to the top surface of the base layer and intersects the first direction, and second traces branching from the second sensing electrode columns.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: September 27, 2022
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Yong Soo Park, Sung Woo Yu, Jae Hyun Lee, Keon Kim, Ju In Yoon
  • Publication number: 20220293482
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Application
    Filed: December 20, 2021
    Publication date: September 15, 2022
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
  • Patent number: 11430723
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: August 30, 2022
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Patent number: 11413207
    Abstract: A wearable apparatus for assisting muscular strength includes: a main body mechanism extending in a vertical direction of a wearer's torso, and being fixed to a side of a wearer's torso under a wearer's shoulder; a fastening mechanism extending along an extension direction of a wearer's upper arm, and being disposed at and being in contact with a lower surface of the wearer's upper arm; a connecting mechanism having a first end coupled to the fastening mechanism and a second end movably coupled to the main body mechanism so as to be movable with respect to the main body mechanism; and a support mechanism movably coupled between the first end and the second end of the connecting mechanism to apply a support force to the connecting mechanism, and coupled to the main body mechanism and movable with respect thereto.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: August 16, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Kyu Jung Kim, Hyun Seop Lim, Beom Su Kim, Ju Young Yoon, Dong Jin Hyun, Ki Hyeon Bae
  • Patent number: D973091
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: December 20, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Young-Seok Seo, Hee June Kwak, Ju Ae Yoon, Mu Gyeom Kim