Abstract: An electronic device includes a chip and a circuit structure layer overlapped with the chip. The circuit structure layer includes a redistribution structure layer and an element structure layer, and the redistribution structure layer and the element structure layer are electrically connected to the chip. At least one of the redistribution structure layer and the element structure layer includes at least one opening, and in a normal direction of the electronic device, the at least one opening is overlapped with aside of the chip.

Abstract: Provided are an electronic device and a method for manufacturing the same. The electronic device includes a substrate including first and second surfaces opposite to each other in a first direction and including a cavity and a through hole penetrating the first and second surfaces, a first electronic unit disposed in the cavity, a conductive element disposed in the through hole and electrically connected to the first electronic unit and including a seed layer pattern and a conductive pillar extending from the seed layer pattern along the first direction, and a circuit structure disposed on the first surface of the substrate and electrically connected to the first electronic unit and the conductive element.

Abstract: Provided is a manufacturing method of an electronic device including the following steps. A substrate is provided, where the substrate has a first surface and a second surface opposite to each other. A through hole penetrating the substrate is formed. A build-up structure on the first surface and the second surface of the substrate is formed. The build-up structure disposed on the first surface and the second surface is simultaneously cut, so that the build-up structure forms a first groove and a second groove respectively. An electronic device is also provided.

Abstract: The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes a substrate including first and second surfaces opposite to each other in a first direction, a cavity, and a through-hole penetrating the first and second surfaces, a bonding element disposed in the cavity, a first electronic unit disposed in the cavity and bonded onto the substrate through the bonding element, a conductive element disposed in the through-hole and electrically connected to the first electronic unit, a circuit structure disposed on the first surface of the substrate and electrically connected to the first electronic unit and the conductive element, and a connection element disposed on the conductive element, wherein a reflow temperature of the bonding element is higher than a reflow temperature of the connection element.

Abstract: The present disclosure provides an electronic device including an electronic unit including a first conductive pad, a protective layer disposed on the electronic unit, a packaging layer surrounding the electronic unit and the protective layer, a conductive component disposed in the protective layer and overlapped with the first conductive pad, a bonding component disposed on the conductive component and overlapped with the first conductive pad, and an external component disposed on the bonding component and including a second conductive pad overlapped with the first conductive pad. The external component is electrically connected to the first conductive pad through the bonding component.

Abstract: Provided is an electronic device, which includes a substrate, a via, a conductive element and a circuit structure. The via penetrates through the substrate and includes a first via and a second via. The conductive element is disposed in the via and includes a first conductive element and a second conductive element. The first conductive element is disposed in the first via. The second conductive element is disposed in the second via. The circuit structure is disposed on the substrate and is electrically connected to the conductive element. In a first direction, there is a first spacing between the two adjacent first conductive elements. There is a second spacing between the two adjacent second conductive elements. The first spacing is greater than the second spacing.

Abstract: The present disclosure provides an electronic device and a method for manufacturing the same, in which the method includes the following steps. A substrate structure is provided, wherein the substrate structure includes a first substrate and a second substrate. A first anti-warpage layer is provided on at least one side of the substrate structure. A first circuit structure is formed on the first substrate. A packaging structure is formed on the first circuit structure, wherein the first substrate is disposed between the first circuit structure and the second substrate, and the coefficient of thermal expansion of the first substrate is greater than the coefficient of thermal expansion of the second substrate.

Abstract: An electronic device includes a control unit, a circuit structure, a sensing element and an emitting element. The circuit structure is disposed on the control unit, the sensing element is embedded in the circuit structure, and the emitting element is disposed on the circuit structure. A minimum distance between the sensing element and the control unit is less than a minimum distance between the emitting element and the control unit.

Abstract: An electronic device includes a substrate, a through hole, a first electronic unit, a second electronic unit, a circuit structure, and a third electronic unit. The substrate has a first surface, a second surface opposite the first surface, a first cavity, and a second cavity. A sidewall of the first cavity is connected to the first surface, and a sidewall of the second cavity is connected to the first surface. The through hole extends through the substrate, and a sidewall of the through hole is connected to the first surface and the second surface. The first electronic unit is disposed in the first cavity. The second electronic unit is disposed in the second cavity. The circuit structure is disposed on the first electronic unit and the second electronic unit. The bottom surfaces of the first and second cavities have a roughness ranging from 0 to 2 micrometers.

Abstract: An electronic device is provided. The electronic device includes an electronic unit and a circuit structure. The circuit structure is electrically connected to the electronic unit. The circuit structure includes a first conductive layer, a first insulating layer and a first heat dissipation element. The first insulating layer is disposed between the first conductive layer and the electronic unit. The first heat dissipation element is in contact with the first conductive layer. Moreover, a heat transfer coefficient of the first dissipation element is greater than a heat transfer coefficient of the first insulating layer and less than a heat transfer coefficient of the first conductive layer.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, at least one electronic unit, an adhesive layer, an insulating layer, and a conductive structure. The substrate has at least one recess. The electronic unit is disposed in the recess, and the adhesive layer is disposed between the electronic unit and a bottom surface of the recess. The insulating layer is disposed on the electronic unit and the recess. The conductive structure is disposed on the insulating layer, and the conductive structure penetrates through the insulating layer to be electrically connected to the electronic unit.

Abstract: An electronic device includes a circuit structure, a first electronic unit and an encapsulation layer. The first electronic unit is disposed on the circuit structure. The encapsulation layer surrounds the first electronic unit. The circuit structure includes at least one first insulating layer and at least one second insulating layer. The at least one first insulating layer is disposed between the first electronic unit and the at least one second insulating layer. A stiffness of the at least one first insulating layer is less than a stiffness of the at least one second insulating layer.

Abstract: An electronic device and a related tiled electronic device are disclosed. The electronic device includes a protective layer, a circuit structure, a sensing element and a control unit. The circuit structure is disposed on the protective layer and surrounds the sensing element. The control unit is disposed between the circuit structure and the protective layer and electrically connected to the sensing element. The protective layer surrounds the control unit and contacts a surface of the circuit structure.

Abstract: An electronic device includes an electronic unit and a connection structure disposed on the electronic unit. The electronic unit includes an electronic element and a conductive pad electrically connected to the electronic element. The connection structure includes a first pad electrically connected to the conductive pad, a second pad electrically connected to the first pad, and a first polymer surrounding the first pad and the second pad. The first pad includes a first portion, a second portion, and a third portion. The first portion is in contact with the conductive pad, the second portion connects the first portion, and the third portion connects the second portion and extends outwardly with respect to the first portion. The third portion has a first edge adjacent to the conductive pad, and at least a portion of the first edge is inclined toward the conductive pad.

Abstract: A package device is provided and includes a substrate and a conductive element. The substrate includes a through hole, a first portion, and a second portion, wherein the through hole penetrates the first portion and the second portion, and a first thickness of the first portion is less than a second thickness of the second portion. The conductive element is disposed in the through hole, wherein the first portion of the substrate includes compressive stress, and the second portion of the substrate includes tensile stress.

Abstract: An electronic device is provided. The electronic device includes a substrate, a through hole, a first circuit structure, and an electronic unit. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate and connects the first side to the second side. The first circuit structure is disposed on the first side and includes a first metal layer and a first dielectric layer. The first metal layer overlaps a first portion of the first side. The first dielectric layer overlaps a second portion of the first side. The first portion is connected to the second portion. The electronic unit is electrically connected to the first circuit structure. Moreover, a surface roughness of the first portion is lower than a surface roughness of the second portion.

Abstract: A method of manufacturing an electronic device is provided. The method includes the following steps: providing a substrate; forming a circuit structure on the substrate; forming a hole in the substrate; forming a conductive element in the hole; bonding a chip to the circuit structure; and performing a first cutting step to cut a portion of the circuit structure and the substrate, and forming a groove in the substrate.

Abstract: The present disclosure provides an electronic device and a method of manufacturing the same. The electronic device includes at least one first electronic unit, a molding layer surrounding the at least one first electronic unit, a circuit structure electrically connected to the at least one first electronic unit, a conductive layer in which the circuit structure and the conductive layer are corresponded to the opposite sides of the molding layer, and a connection element disposed between the circuit structure and the conductive layer. The molding layer surrounds the connection element and includes a recess.

Abstract: An electronic device is provided. The electronic device includes an electronic element; a conductive pad disposed on the electronic element and electrically connected to the electronic element; and a redistribution structure disposed on the conductive pad. The redistribution structure includes a plurality of conductive layers; a polymer layer enclosing the conductive layers; and a bump electrically connected to the conductive pad through the conductive layers. The center of the conductive pad is horizontally shifted from the center of the bump. The conductive layers include a first conductive layer. The first conductive layer has a side surface contacting the polymer layer, and the side surface has a side edge having roughness of 0.08 ?m to 0.8 ?m in a cross-sectional view.

Abstract: The present disclosure discloses a manufacturing method of an electronic device. A seed layer is formed on a substrate. After patterning the seed layer to form a plurality of sub-seed layers and a plurality of conductive lines, a metal layer is formed on a plurality of the sub-seed layers. The sub-seed layers include a first sub-seed layer and a second sub-seed layer, and the first sub-seed layer and the second sub-seed layer are separated from each other.