Patents by Inventor Ju-Li WANG

Ju-Li WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240038550
    Abstract: The present disclosure discloses a manufacturing method of an electronic device. A seed layer is formed on a substrate. After patterning the seed layer to form a plurality of sub-seed layers and a plurality of conductive lines, a metal layer is formed on a plurality of the sub-seed layers. The sub-seed layers include a first sub-seed layer and a second sub-seed layer, and the first sub-seed layer and the second sub-seed layer are separated from each other.
    Type: Application
    Filed: October 20, 2022
    Publication date: February 1, 2024
    Applicant: InnoLux Corporation
    Inventors: Chin-Lung TING, Cheng-Chi WANG, Yu-Jen CHANG, Ju-Li WANG