Patents by Inventor Ju Wu
Ju Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250253230Abstract: The present disclosure provides a semiconductor structure that includes a substrate having devices formed thereon and an interconnect structure electrically coupling the devices into an integrated circuit; a passivation structure formed on the interconnect structure; and a capacitor embedded in the passivation structure, wherein the capacitor includes first metal-insulator-metal (MIM) stacks inserted in first trenches, and second MIM stacks formed into first pillar structures.Type: ApplicationFiled: October 4, 2024Publication date: August 7, 2025Inventors: Tzu-Ting LIU, Hsiang-Ku SHEN, Yi-Shan HSIEH, Chia-Yueh CHOU, Ying-Ju WU, Chen-Chiu HUANG, Dian-Hau CHEN
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Publication number: 20250243227Abstract: Disclosed herein are compounds that stabilize recombinant human ?-iduronidase (rh-?-IDUA) activity, and their uses in the treatment and/or prophylaxis of lysosomal storage diseases (LSDs), such as mucopolysaccharidosis type I (MPS1). The compound disclosed herein has the structure of formula (I), wherein, n is an integral between 0 and 2; X1 is O or —NH; X2 is O, —NH or —NRa, in which Ra is C1-10alkyl; Y is H or wherein m and p are independently 0 or 1; X3 is S, O, or —NH; X4 is O, —NH, methylene, or —CH2(C1-10)alkyl; and A is aryl, heteroaryl, or heterocyclyl optionally substituted with one or more substituent selected from the group consisting of halo, hydroxyl, amino and phosphate.Type: ApplicationFiled: April 10, 2023Publication date: July 31, 2025Inventors: Wei-Chieh CHENG, Shih-Ying CHANG, Hsuan-Hsuan TENG, Hsi-Ju WU, Hung-Yi LIN
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Patent number: 12373563Abstract: A computer system for failing a secure boot in a case tampering event comprises a microcontroller unit (MCU); a trusted platform module (TPM), for generating random bytes for a secure boot of the computer system; a bootloader, for storing information comprising the random bytes in the MCU and at least one hardware of the computer system and performing the secure boot, wherein the TPM is comprised in the bootloader; an operating system (OS), for performing the secure boot; and at least one sensor, coupled to the MCU, for detecting a case tampering event, and transmitting a signal for triggering a deletion of the random bytes, if the case tampering event happens. The MCU performs the operation of deleting the random bytes stored in the MCU and the at least one hardware according to a power supply, in response to the signal.Type: GrantFiled: December 30, 2021Date of Patent: July 29, 2025Assignee: Moxa Inc.Inventors: Chia-Te Chou, Tsung-Yi Lin, Yoong Tak Tan, Hsin-Ju Wu, Jian-Yu Liao, Che-Yu Huang, Tsung-Li Fang, Kuo-Chen Wu, Chih-Yu Chen
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Patent number: 12341055Abstract: A semiconductor device includes a first interlayer dielectric (ILD) layer disposed over a substrate, a control layer disposed over the first ILD layer and containing silicon and oxygen, and a resistor wire disposed over the control layer. An oxygen concentration of the control layer is greater than an oxygen concentration of the first ILD layer.Type: GrantFiled: March 31, 2022Date of Patent: June 24, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jun-Nan Nian, Yao-Hsiang Liang, Ming-Ching Chung, Hsueh-Han Lu, Chun-Ju Wu
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Publication number: 20250177064Abstract: Systems, methods, and instruments for tracking localized movement of an anatomic structure at a surgical site are provided that can, for example, detect and identify movement of the anatomic structure not otherwise tracked by a global navigation system. One embodiment can include a cannula with a localized navigation sensor coupled to a distal end thereof. The cannula can be coupled to a robot arm and the localized navigation sensor can detect movement of an anatomic structure relative to the cannula. The localized navigation sensor can include one or more tines that selectively extend from the cannula to contact the anatomic structure. A controller can receive data from the localized navigation sensor and a global navigation system, and determine if movement detected by the localized navigation sensor is tracked by the global navigation system. Systems, methods, and instruments of the present disclosure can be used independently of a global navigation system.Type: ApplicationFiled: February 13, 2025Publication date: June 5, 2025Inventors: Robert Brik, Brice Dudley, JR., William Miller, Marc Puls, William J. Frasier, Cheng-Ju Wu
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Publication number: 20250178012Abstract: A portable coating device for applying a coating solution onto a solar panel includes a supply module for supplying the coating solution, a base, a spraying module disposed on the base, a transmission module disposed at two opposite ends of the base, an arc bracket, and an applicator. The base spans the solar panel and moves thereon through the support of the transmission module. The arc bracket is disposed at the bottom of the base and has a plurality of seepage openings, and an inner surface of the arc bracket faces the spraying module. The applicator includes a porous material that deforms under pressure. The applicator is assembled to the base and supported by the arc bracket.Type: ApplicationFiled: November 30, 2023Publication date: June 5, 2025Applicant: Metal Industries Research & Development CentreInventors: Kuo-Yu Chien, Zong-Hsin Liu, Hsien-Ju Wu, Hsiang-Pin Wang, Po-Chi Hu, Chih-Hsuan Huang, Jia Yan Lin, Chun-Mu Wu, Yi Yan Li, Zong Lun Wu, Cheng-Tang Pan, Ming-Cheng Lin
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Publication number: 20250145040Abstract: A method for monitoring an electric vehicle charging apparatus is provided. A charging pile that includes a power meter and a processor is used to provide a charging current to an electric vehicle through a charging connector. The power meter detects the charging current to generate an initial current value and an initial power value that correspond to an initial charging time, and a present current value and a present power value that correspond to a present time, so that the processor calculates an initial resistance value and a present resistance value of the charging connector accordingly, and then calculates an estimated present temperature value of the charging connector based on the initial resistance value and the present resistance value. The estimated present temperature value is compared with an over-temperature threshold to determine whether to reduce the charging current.Type: ApplicationFiled: November 2, 2023Publication date: May 8, 2025Inventors: Hsien-Ju WU, Chun-Chieh CHIU, Tai-Chang CHEN, Jinn-Feng JIANG, Chia-Lung HUANG, Mei-Jung CHEN
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Publication number: 20250138601Abstract: A fixing assembly includes a base with a receiving slot, a bracket rotatably connected to the base along its length direction, and a functional component on the bracket. The bracket has a resilient structure that deforms elastically and exerts a force toward the base when the bracket rotates away. The functional component contacts the memory module, and the receiving slot is for installing the memory module.Type: ApplicationFiled: August 30, 2024Publication date: May 1, 2025Inventors: CHANG-JU WU, CHIH-MIN LIN
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Publication number: 20250132247Abstract: An interconnection structure is provided to include a substrate, a first metal trench, a boron nitride dielectric, a second metal trench, and a metal via. The substrate is formed with a first metal trench. The boron nitride dielectric is disposed over the substrate. The second metal trench is formed in the boron nitride dielectric. The metal via is disposed to interconnect the first metal trench and the second metal trench.Type: ApplicationFiled: October 24, 2023Publication date: April 24, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chi-Lin TENG, Gary LIU, Ting-Ya LO, Yen-Ju WU, Shao-Kuan LEE, Kuang-Wei YANG, Hsin-Yen HUANG, Hsiao-Kang CHANG
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Publication number: 20250118654Abstract: A passivation layer is formed over an interconnect structure. An opening is etched at least partially through the passivation layer. A first conductive layer is deposited over the passivation layer. The first conductive layer partially fills the opening. An insulator layer is deposited over the first conductive layer. The insulator layer partially fills the opening. A second conductive layer is deposited over the insulator layer. The second conductive layer completely fills the opening. A first conductive structure is formed that is electrically coupled to the first conductive layer. A second conductive structure is formed that is electrically coupled to the second conductive layer.Type: ApplicationFiled: October 10, 2023Publication date: April 10, 2025Inventors: Ying-Ju Wu, Tzu-Ting Liu, Hsiang-Ku Shen, Chen-Chiu Huang, Dian-Hau Chen
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Publication number: 20250118598Abstract: An interconnection structure and a manufacturing method thereof are provided. The interconnection structure includes a first dielectric layer, a first conductive feature, a second dielectric layer, and a barrier layer. The first conductive feature is disposed on the first dielectric layer, the second dielectric layer is disposed on the first dielectric layer and surrounds the sidewalls of the first conductive feature, the barrier layer is disposed between the first dielectric layer and the second dielectric layer and between the sidewalls of the first conductive feature and the second dielectric layer.Type: ApplicationFiled: October 4, 2023Publication date: April 10, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Shao-Kuan LEE, Kuang-Wei YANG, Gary HSU WEI LIU, Yen-Ju WU, Jing-Ting SU, Hsin-Yen HUANG, Hsiao-Kang CHANG, Wei-Chen CHU, Shu-Yun KU, Chia-Tien WU, Ming-Han LEE, Hsin-Ping CHEN
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Publication number: 20250112088Abstract: A semiconductor structure is provided. The semiconductor structure includes a first low dielectric constant (low-k) layer, a first metal layer, a metal cap layer, a dielectric on dielectric (DoD) layer, an etch stop layer (ESL), a second low-k layer, a metal via and a second metal layer. The dielectric constant of the first low-k layer is less than 4. The first metal layer is embodied in the first low-k layer. The first low-k layer exposes the first metal layer. The metal cap layer is disposed on the first metal layer. The DoD layer is disposed on the first low-k layer. The etch stop layer is disposed on the metal cap layer and the DoD layer. The second low-k layer is disposed above the etch stop layer. The metal via is embodied in the second low-k layer and connected to the first metal layer.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Chin LEE, Yen Ju WU, Shao-Kuan LEE, Kuang-Wei YANG, Hsin-Yen HUANG, Jing Ting SU, Kai-Fang CHENG, Hsiao-Kang CHANG, Wei-Chen CHU, Shu-Yun KU, Chia-Tien WU, Ming-Han LEE, Hsin-Ping CHEN
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Patent number: 12262957Abstract: System and method for position and posture detection are provided to determine whether to update an original position and posture information of a surgical machine during surgery navigation. The system includes a sensing element, a displacement and/or angle sensing element and a processor. A coordinate signal of a marker module generated by the sensing element and a displacement and/or angle signal of the marker module generated by the displacement and/or angle sensing element are received by the processor and used to create a transformation matrix. A position and posture information of the surgical machine is obtained using the transformation matrix and the coordinate signal and provided to determine whether to update the original position and posture information.Type: GrantFiled: December 22, 2021Date of Patent: April 1, 2025Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTREInventors: Ming-Hui Chen, Hsien-Ju Wu, Kai-Szu Lo
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Publication number: 20250103110Abstract: A joint module for cutting coolant circuit in server comprises a shell, a plug connector, folding mechanism, and a switch. The plug connector is placed on the shell and movable in a first direction between a first position and a second position for connecting a plug. The folding mechanism is connected to the shell and the plug connector and is used for moving the plug connector. The switch is placed on the shell with a first condition and a second condition. When the switch is in the first condition, the folding mechanism is unfolded, the plug connector is on the first position and is connected to the plug, when the switch is in the second condition, the folding mechanism is folded, the plug connector is on the second position and is disconnected to the plug. A server and a computing system with the joint module is also disclosed.Type: ApplicationFiled: June 24, 2024Publication date: March 27, 2025Inventors: CHANG-JU WU, CHIH-MIN LIN
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Systems, methods, and devices for localized tracking of a vertebral body or other anatomic structure
Patent number: 12251168Abstract: Systems, methods, and instruments for tracking localized movement of an anatomic structure at a surgical site are provided that can, for example, detect and identify movement of the anatomic structure not otherwise tracked by a global navigation system. One embodiment can include a cannula with a localized navigation sensor coupled to a distal end thereof. The cannula can be coupled to a robot arm and the localized navigation sensor can detect movement of an anatomic structure relative to the cannula. The localized navigation sensor can include one or more tines that selectively extend from the cannula to contact the anatomic structure. A controller can receive data from the localized navigation sensor and a global navigation system, and determine if movement detected by the localized navigation sensor is tracked by the global navigation system. Systems, methods, and instruments of the present disclosure can be used independently of a global navigation system.Type: GrantFiled: May 28, 2021Date of Patent: March 18, 2025Assignee: Medos International SarlInventors: Robert Brik, Brice Dudley, Jr., William Miller, Marc Puls, William Frasier, Cheng-Ju Wu -
Publication number: 20250082871Abstract: A nebulization medicament delivery device is provided, which includes a mouthpiece opening; an airway; at least one first vent configured to introduce external air into the airway, wherein the mouthpiece opening is in communication with the at least one first vent through the airway; a nebulization module including a mesh and configured for nebulization; a first pressure sensor disposed inside the nebulization medicament delivery device and to be air-tightly isolated from the airway, and configured to detect external air pressure outside the nebulization medicament delivery device; a second pressure sensor disposed adjacent to the airway or within the airway, and configured to detect air pressure inside the airway; and a controller, which drives the nebulization module to perform nebulization based on air pressure difference between the external air pressure and the air pressure inside the airway.Type: ApplicationFiled: September 6, 2024Publication date: March 13, 2025Inventors: HUNG JU WU, YI SHEN LU
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Publication number: 20250081393Abstract: A joint module for cutting coolant circuit in a server comprises a base, a first moving piece, a second moving piece, a drive component, and a plug connector located on the first moving piece. The first moving piece is movable in a first direction between a first position and a second position. The second moving piece is movable in a second direction between a third position and a fourth position. The drive component moves the second moving piece. When the second moving piece is on the third position, the first moving piece is on the first position and the plug connector is connected to a plug. When the second moving piece is on the fourth position, the first moving piece is on the second position and the plug connector is disconnected with the plug. A server and a computing system with the joint module are also disclosed.Type: ApplicationFiled: May 15, 2024Publication date: March 6, 2025Inventors: CHANG-JU WU, CHIH-MIN LIN
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Publication number: 20250053039Abstract: An E-paper display panel including an E-paper display layer, a first substrate, a pixel array layer, a common electrode layer, and a driving circuit is provided. The first substrate is disposed at a first side of the E-paper display layer. The pixel array substrate is disposed between the first substrate and the E-paper display layer and includes touch electrodes and driving pixels arranged in an array. Each driving pixel includes a first pixel electrode and a second pixel electrode. The touch electrodes, the first pixel electrode, and the second pixel electrode are overlapped with each other. The common electrode layer is disposed at a second side of the E-paper display layer. The first side is opposite to the second side. The driving circuit is in signal communication with the common electrode layer and the pixel array layer. The touch electrodes are individually in signal communication with the driving circuit.Type: ApplicationFiled: July 11, 2024Publication date: February 13, 2025Applicant: E Ink Holdings Inc.Inventors: Chia-Ming Hsieh, Chi-Mao Hung, Sung-Hui Huang, Chuen-Jen Liu, Liang-Yu Yan, Pei Ju Wu, Po-Chun Chuang, Che-Sheng Chang, Wen-Chung Yang
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Patent number: D1072805Type: GrantFiled: March 30, 2020Date of Patent: April 29, 2025Assignee: COMPAL ELECTRONICS, INC.Inventors: Han-Tsai Liu, Jyh-Chyang Tzou, Yao-Hsien Yang, Meng Ju Wu, Pai-Feng Chen, I-Hao Chen
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Patent number: D1084894Type: GrantFiled: October 18, 2023Date of Patent: July 22, 2025Inventor: Yu Ju Wu