Abstract: A query on a graph database can be efficiently performed employing a combination of an abstraction program and a graph analytics appliance. The abstraction program is generated from a query request employing an abstraction program compiler residing on a computational node, and includes programming instructions for performing parallel operations on graph data. The graph analytics appliance receives or generates the abstraction program, and runs the abstraction program on data fetched from a graph database to generate filtered data that is less than the fetched data. The filtered data is returned to the computational node. The bandwidth between the graph database and the graph analytic engine can be greater than the bandwidth between the computational node and the graph analytic engine in order to utilize processing capacity of the graph analytics appliance.

Abstract: A graph analytics appliance can be employed to extract data from a graph database in an efficient manner. The graph analytics appliance includes a router, a worklist scheduler, a processing unit, and an input/output unit. The router receives an abstraction program including a plurality of parallel algorithms for a query request from an abstraction program compiler residing on computational node or the graph analytics appliance. The worklist scheduler generates a prioritized plurality of parallel threads for executing the query request from the plurality of parallel algorithms. The processing unit executes multiple threads selected from the prioritized plurality of parallel threads. The input/output unit communicates with a graph database.

Abstract: A query on a graph database can be efficiently performed employing a combination of an abstraction program and a graph analytics appliance. The abstraction program is generated from a query request employing an abstraction program compiler residing on a computational node, and includes programming instructions for performing parallel operations on graph data. The graph analytics appliance receives or generates the abstraction program, and runs the abstraction program on data fetched from a graph database to generate filtered data that is less than the fetched data. The filtered data is returned to the computational node. The bandwidth between the graph database and the graph analytic engine can be greater than the bandwidth between the computational node and the graph analytic engine in order to utilize processing capacity of the graph analytics appliance.

Abstract: Enhanced modularity in heterogeneous three-dimensional computer processing chip stacks includes a method of manufacture. The method includes preparing a host layer and integrating the host layer with at least one other layer in the stack. The host layer is prepared by forming cavities on the host layer for receiving chips pre-configured with heterogeneous properties relative to each other, disposing the chips in corresponding cavities on the host layer, and joining the chips to respective surfaces of the cavities thereby forming an element having a smooth surface with respect to the host layer and the chips.

Abstract: In one aspect, a method of enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging is disclosed. Also provided is an arrangement for implementing the inventive method. In another aspect, a method and on-chip controller are disclosed for enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging. Also provided is an on-chip reliability/variability controller arrangement for implementing the inventive method. In yet another aspect, base semiconductor chips, each comprising a plurality of chiplets, are manufactured and tested. For a base semiconductor chip having at least one non-functional chiplet, at least one repair semiconductor chiplet chiplet is vertically stacked. A functional multi-chip assembly is formed, which provides the same functionality as a base semiconductor chip in which all chiplets are functional.

Abstract: A semiconductor chip includes a plurality of multi-core clusters each including a plurality of cores and a cluster controller unit. Each cluster controller unit is configured to control thread assignment within the multi-core cluster to which it belongs. The cluster controller unit monitors various parameters measured in the plurality of cores within the multi-core cluster to estimate the computational demand of each thread that runs in the cores. The cluster controller unit may reassign the threads within the multi-core cluster based on the estimated computational demand of the threads and transmit a signal to an upper-level software manager that controls the thread assignment across the semiconductor chip. When an acceptable solution to thread assignment cannot be achieved by shuffling of threads within the multi-core cluster, the cluster controller unit may also report inability to solve thread assignment to the upper-level software manager to request a system level solution.

Abstract: Multi-bit stuck-at fault error recovery can be enabled by adaptive multi-bit error correction method, in which the overhead of error correction hardware is reduced without affecting the lifetime of the memory device. Error correction logic hardware is decoupled from memory blocks. An error correction logic block is partitioned such that error correction logic entries support different number of error correction capabilities based on the probability of occurrence of the different number of errors in different memory blocks. Faulty memory blocks are mapped to appropriate error correction logic entries. The mapping can be one-to-one or many-to-one depending on embodiments. The adaptive partitioning of the error correction logic entries can be configured to match projected statistical distribution of errors in logic blocks, and can reduce the total error correction logic overhead, provide sufficient error correction, and/or extend the lifetime of the memory device.

Abstract: A dynamic predictive and/or exact caching mechanism is provided in various stages of a microprocessor pipeline so that various control signals can be stored and memorized in the course of program execution. Exact control signal vector caching may be done. Whenever an issue group is formed following instruction decode, register renaming, and dependency checking, an encoded copy of the issue group information can be cached under the tag of the leading instruction. The resulting dependency cache or control vector cache can be accessed right at the beginning of the instruction issue logic stage of the microprocessor pipeline the next time the corresponding group of instructions come up for re-execution. Since the encoded issue group bit pattern may be accessed in a single cycle out of the cache, the resulting microprocessor pipeline with this embodiment can be seen as two parallel pipes, where the shorter pipe is followed if there is a dependency cache or control vector cache hit.

Abstract: Multi-bit stuck-at fault error recovery can be enabled by adaptive multi-bit error correction method, in which the overhead of error correction hardware is reduced without affecting the lifetime of the memory device. Error correction logic hardware is decoupled from memory blocks. An error correction logic block is partitioned such that error correction logic entries support different number of error correction capabilities based on the probability of occurrence of the different number of errors in different memory blocks. Faulty memory blocks are mapped to appropriate error correction logic entries. The mapping can be one-to-one or many-to-one depending on embodiments. The adaptive partitioning of the error correction logic entries can be configured to match projected statistical distribution of errors in logic blocks, and can reduce the total error correction logic overhead, provide sufficient error correction, and/or extend the lifetime of the memory device.

Abstract: A computer program product for generating and implementing a three-dimensional (3D) computer processing chip stack plan. The computer readable program code includes computer readable program code configured for receiving system requirements from a plurality of clients, identifying common processing structures and technologies from the system requirements, and assigning the common processing structures and technologies to at least one layer in the 3D computer processing chip stack plan. The computer readable program code is also configured for identifying uncommon processing structures and technologies from the system requirements and assigning the uncommon processing structures and technologies to a host layer in the 3D computer processing chip stack plan. The computer readable program code is further configured for determining placement and wiring of the uncommon structures on the host layer, storing placement information in the plan, and transmitting the plan to manufacturing equipment.

Abstract: A method for generating and implementing a three-dimensional (3D) computer processing chip stack plan that includes receiving system requirements from a plurality of clients, identifying common processing structures and technologies from the system requirements, and assigning the common processing structures and technologies to a layer in the 3D computer processing chip stack plan. The method also includes identifying uncommon processing structures and technologies from the system requirements and assigning the uncommon processing structures and technologies to a host layer in the 3D computer processing chip stack plan. The method further includes determining placement and wiring of the uncommon structures on the host layer, storing placement information in the plan, and transmitting the plan to manufacturing equipment.

Abstract: A three-dimensional computer processing chip stack that includes a host layer disposed on at least one other layer in the stack. The host layer includes cavities formed thereon for receiving chips pre-configured with heterogeneous properties relative to each other. The cavities are formed to accommodate the heterogeneous properties of the chips. The chips are joined to respective surfaces of the cavities, thereby forming an element having a smooth surface with respect to the host layer and the chips.

Abstract: A dynamic predictive and/or exact caching mechanism is provided in various stages of a microprocessor pipeline so that various control signals can be stored and memorized in the course of program execution. Exact control signal vector caching may be done. Whenever an issue group is formed following instruction decode, register renaming, and dependency checking, an encoded copy of the issue group information can be cached under the tag of the leading instruction. The resulting dependency cache or control vector cache can be accessed right at the beginning of the instruction issue logic stage of the microprocessor pipeline the next time the corresponding group of instructions come up for re-execution. Since the encoded issue group bit pattern may be accessed in a single cycle out of the cache, the resulting microprocessor pipeline with this embodiment can be seen as two parallel pipes, where the shorter pipe is followed if there is a dependency cache or control vector cache hit.

Abstract: A dynamic predictive and/or exact caching mechanism is provided in various stages of a microprocessor pipeline so that various control signals can be stored and memorized in the course of program execution. Exact control signal vector caching may be done. Whenever an issue group is formed following instruction decode, register renaming, and dependency checking, an encoded copy of the issue group information can be cached under the tag of the leading instruction. The resulting dependency cache or control vector cache can be accessed right at the beginning of the instruction issue logic stage of the microprocessor pipeline the next time the corresponding group of instructions come up for re-execution. Since the encoded issue group bit pattern may be accessed in a single cycle out of the cache, the resulting microprocessor pipeline with this embodiment can be seen as two parallel pipes, where the shorter pipe is followed if there is a dependency cache or control vector cache hit.

Abstract: Block placement within each device-containing layer is optimized under the constraint of a simultaneous optimization of interlayer connectivity between the device-containing layer and immediately adjacent device-containing layers. For each functional block within the device-containing layer, lateral heat flow is calculated to laterally adjacent functional blocks. If the lateral heat flow is less than a threshold value for a pair of adjacent functional blocks, placement of the functional blocks and/or interlayer interconnect structure array therebetween or modification of the interlayer interconnect structure array is performed. This routine is repeated for all adjacent pairs of functional blocks in each of the device-containing layers. Subsequently, block placement within each device-containing layer may be optimized under the constraint of a simultaneous optimization of interlayer connectivity across all device-containing layers.

Abstract: A system for soft error recovery used during processor execution. The system may include a microprocessor, processor, controller, or the like. The system may also include a pipeline to reduce the cycle time of the processor, and a write-back stage within the pipeline. The system may further include an error-correcting code stage before the write-back stage that checks a value to be written by the processor for any error. The error-correcting code stage may correct any error in the value, and the pipeline may lack a recovery unit pipeline.

Abstract: Mechanisms for modeling system level effects of soft errors are provided. Mechanisms are provided for integrating device-level and component-level soft error rate (SER) analysis mechanisms with micro-architecture level performance analysis tools during a concept phase of the IC design to thereby generate a SER analysis tool. A first SER profile for the IC design is generated by applying the SER analysis tool to the IC design. At a later phase of the IC design, detailed information about SER vulnerabilities of logic and storage elements within the IC design are obtained and the first SER profile is refined based on the detailed information about SER vulnerabilities to thereby generate a second SER profile for the IC design. Modifications to the IC design are made at one or more phases of the IC design based on one of the first SER profile or the second SER profile.

Abstract: Enhanced modularity in heterogeneous three-dimensional computer processing chip stacks includes a method of manufacture. The method includes preparing a host layer and integrating the host layer with at least one other layer in the stack. The host layer is prepared by forming cavities on the host layer for receiving chips pre-configured with heterogeneous properties relative to each other, disposing the chips in corresponding cavities on the host layer, and joining the chips to respective surfaces of the cavities thereby forming an element having a smooth surface with respect to the host layer and the chips.

Abstract: A semiconductor chip includes a plurality of multi-core clusters each including a plurality of cores and a cluster controller unit. Each cluster controller unit is configured to control thread assignment within the multi-core cluster to which it belongs. The cluster controller unit monitors various parameters measured in the plurality of cores within the multi-core cluster to estimate the computational demand of each thread that runs in the cores. The cluster controller unit may reassign the threads within the multi-core cluster based on the estimated computational demand of the threads and transmit a signal to an upper-level software manager that controls the thread assignment across the semiconductor chip. When an acceptable solution to thread assignment cannot be achieved by shuffling of threads within the multi-core cluster, the cluster controller unit may also report inability to solve thread assignment to the upper-level software manager to request a system level solution.

Abstract: A novel trace cache design and organization to efficiently store and retrieve multi-path traces. A goal is to design a trace cache, which is capable of storing multi-path traces without significant duplication in the traces. Furthermore, the effective access latency of these traces is reduced.