Patents by Inventor Jui-Hsien Chang
Jui-Hsien Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240144862Abstract: An electronic device with a first region and a second region located around the first region is disclosed. The electronic device includes a first gate driver and a second gate driver disposed in the second region, and a first transistor and a second transistor disposed in the first region. The first gate driver is used for outputting a first signal. The second gate driver is used for outputting a second signal. The first transistor is used for receiving the first signal from the first gate driver. The second transistor is used for receiving the second signal from the second gate driver. In a top view of the electronic device, the first region has a first side and a second side opposite to the first side, and the first gate driver and the second gate driver are located more adjacent to the first side and away from the second side.Type: ApplicationFiled: January 3, 2024Publication date: May 2, 2024Applicant: InnoLux CorporationInventors: Chun-Hsien LIN, Jui-Feng KO, Geng-Fu CHANG
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Publication number: 20240147711Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.Type: ApplicationFiled: January 4, 2024Publication date: May 2, 2024Inventors: PERNG-FEI YUH, YIH WANG, MENG-SHENG CHANG, JUI-CHE TSAI, KU-FENG LIN, YU-WEI LIN, KEH-JENG CHANG, CHANSYUN DAVID YANG, SHAO-TING WU, SHAO-YU CHOU, PHILEX MING-YAN FAN, YOSHITAKA YAMAUCHI, TZU-HSIEN YANG
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Patent number: 11919284Abstract: A rotary seat including a base includes an outer surface, and a composite material layer attached to at least a part of the outer surface. The base also includes a recess for accommodating a turntable and including a first opening on the outer surface. The material of the composite material layer includes fibers and a resin. Therefore, the rotary seat may be more lightweight. A rotary table is also provided and includes the rotary seat, a driving device which drives the rotary seat to rotate, and a turntable which is rotatably disposed in the recess of the base.Type: GrantFiled: June 11, 2021Date of Patent: March 5, 2024Assignee: Hiwin Technologies Corp.Inventors: Yung-Tsai Chuo, Yaw-Zen Chang, Jui-Che Lin, Yu-Hsien Ho, Yu Liu
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Patent number: 11107797Abstract: The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.Type: GrantFiled: August 25, 2020Date of Patent: August 31, 2021Assignee: EPISTAR CORPORATIONInventors: Jui-Hsien Chang, Been-Yu Liaw, Cheng-Nan Han, Min-Hsun Hsieh
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Publication number: 20210043610Abstract: The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.Type: ApplicationFiled: August 25, 2020Publication date: February 11, 2021Inventors: Jui-Hsien CHANG, Been-Yu LIAW, Cheng-Nan HAN, Min-Hsun HSIEH
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Patent number: 10756067Abstract: The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.Type: GrantFiled: January 26, 2018Date of Patent: August 25, 2020Assignee: EPISTAR CORPORATIONInventors: Jui-Hsien Chang, Been-Yu Liaw, Cheng-Nan Han, Min-Hsun Hsieh
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Patent number: 10217904Abstract: This disclosure discloses a light-emitting device. The light-emitting device has a first outermost sidewall and includes a light-emitting diode and an electrode. The light-emitting diode has a pad and a side surface. The electrode has a segment formed on the pad to extend beyond the side surface, and a first protrusion extending from the segment to the first outermost sidewall.Type: GrantFiled: February 2, 2016Date of Patent: February 26, 2019Assignee: EPISTAR CORPORATIONInventors: Hung-Hsuan Chen, Chih-Peng Ni, Jui-Hsien Chang, Hsin-Yu Lee, Tsen-Kuei Wang, Chen-Yen Fan
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Publication number: 20180190626Abstract: The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.Type: ApplicationFiled: January 26, 2018Publication date: July 5, 2018Inventors: Jui-Hsien CHANG, Been-Yu LIAW, Cheng-Nan HAN, Min-Hsun HSIEH
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Patent number: 9917075Abstract: The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.Type: GrantFiled: December 11, 2014Date of Patent: March 13, 2018Assignee: EPISTAR CORPORATIONInventors: Jui-Hsien Chang, Been-Yu Liaw, Cheng-Nan Han, Min-Hsun Hsieh
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Publication number: 20160225955Abstract: This disclosure discloses a light-emitting device. The light-emitting device has a first outermost sidewall and includes a light-emitting diode and an electrode. The light-emitting diode has a pad and a side surface. The electrode has a segment formed on the pad to extend beyond the side surface, and a first protrusion extending from the segment to the first outermost sidewall.Type: ApplicationFiled: February 2, 2016Publication date: August 4, 2016Inventors: Hung-Hsuan CHEN, Chih-Peng NI, Jui-Hsien CHANG, Hsin-Yu LEE, Tsen-Kuei WANG, Chen-Yen FAN
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Publication number: 20150173132Abstract: The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.Type: ApplicationFiled: December 11, 2014Publication date: June 18, 2015Inventors: Jui-Hsien CHANG, Been-Yu LIAW, Cheng-Nan HAN, Min-Hsun HSIEH
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Patent number: 8606987Abstract: A data writing method for a flash memory is provided. The data writing method includes: dividing a new data into at lease one sub-data by the size of a writing unit; selecting one of a plurality of spare blocks from the flash memory as a substitute block for substituting a data block, wherein the new data is to be written into the data block; sequentially writing the sub-data having the size of the writing unit into the substitute block in the writing unit; and storing the sub-data not having the size of the writing unit into a temporary area. The writing efficiency of the flash memory can be improved by temporarily storing the sub-data not having the size of the writing unit into the temporary area and then writing the sub-data not having the size of the writing unit with subsequent data into the substitute block.Type: GrantFiled: March 20, 2008Date of Patent: December 10, 2013Assignee: Phison Electronics Corp.Inventors: Jiunn-Yeong Yang, Jui-Hsien Chang, Chien-Hua Chu, Jian-Yo Su, Chih-Kang Yeh
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Patent number: 8055873Abstract: A data writing method for a flash memory is provided. The data writing method includes following steps. First, a block is selected as a substitute block from a spare area of the flash memory, wherein the substitute block is used for substituting a data block in a data area for writing a new data. Next, the new data is directly written into the substitute block starting from a start page, wherein there is valid data in the data block before the address for writing the new data. Thereby, meaningless data moving can be reduced, system performance can be improved, and overlong waiting time for writing the new data can be prevented.Type: GrantFiled: March 27, 2008Date of Patent: November 8, 2011Assignee: Phison Electronics Corp.Inventors: Chien-Hua Chu, Chih-Kang Yeh, Jian-Yo Su, Jui-Hsien Chang
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Patent number: 7863105Abstract: An image sensor package comprises a substrate, a chip mounted over the substrate. A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.Type: GrantFiled: May 8, 2008Date of Patent: January 4, 2011Assignee: Advanced Chip Engineering Technology Inc.Inventors: Wen-Kun Yang, Jui-Hsien Chang
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Publication number: 20100042774Abstract: A block management method for a flash memory chip having multiple planes is provided, wherein each plane has a plurality of physical blocks. The method includes disposing a plurality of physical units, wherein each physical unit includes a physical block of each plane, and the physical blocks in the physical unit have a simultaneously-operable relationship. The method also includes writing data in a single plane access mode when a host system does not update all the physical blocks in an updated the physical unit. The method further includes writing the data in a multi-planes access mode when the host system updates all the physical blocks in the updated physical unit, wherein the physical blocks for writing the data have the simultaneously-operable relationship.Type: ApplicationFiled: November 5, 2008Publication date: February 18, 2010Applicant: PHISON ELECTRONICS CORP.Inventors: Jiunn-Yeong Yang, Chien-Hua Chu, Chih-Kang Yeh, Kuang-Tung Fang, Jui-Hsien Chang
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Publication number: 20090198875Abstract: A data writing method for a flash memory is provided. The data writing method includes following steps. First, a block is selected as a substitute block from a spare area of the flash memory, wherein the substitute block is used for substituting a data block in a data area for writing a new data. Next, the new data is directly written into the substitute block starting from a start page, wherein there is valid data in the data block before the address for writing the new data. Thereby, meaningless data moving can be reduced, system performance can be improved, and overlong waiting time for writing the new data can be prevented.Type: ApplicationFiled: March 27, 2008Publication date: August 6, 2009Applicant: PHISON ELECTRONICS CORP.Inventors: Chien-Hua Chu, Chih-Kang Yeh, Jian-Yo Su, Jui-Hsien Chang
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Patent number: 7566854Abstract: The present invention provides an image sensor module. The image sensor module has a die formed on a substrate, the die having a micro lens area, a lens holder formed on the substrate and over the die, a lens formed in the lens holder. A filter is formed within the lens holder and between the lens and the die, and at least one passive device formed on the substrate and covered within the lens holder. Conductive bumps or LGA (leadless grid array) are formed on the bottom surface of the substrate.Type: GrantFiled: December 8, 2006Date of Patent: July 28, 2009Assignee: Advanced Chip Engineering Technology Inc.Inventors: Wen-Kun Yang, Jui-Hsien Chang
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Publication number: 20090166873Abstract: The interconnecting structure for a semiconductor die includes a die having bonding pads on an active surface; a core attached the side wall (edge) of the die by adhesion material; an isolating base adhered on the active surface of the die by adhesion glue; a through silicon via (TSV) open from the back side of the die to expose the bonding pads; a build up layer coupled between the bonding pads to terminal metal pads by the through silicon via; solder balls melted on terminal pads, wherein the terminal pads located on the core and/or the die.Type: ApplicationFiled: December 27, 2007Publication date: July 2, 2009Inventors: Wen-Kun Yang, Jui-Hsien Chang, Chi-Chen Lee, Mon-Chin Tsai
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Publication number: 20090150597Abstract: A data writing method for a flash memory is provided. The data writing method includes: dividing a new data into at lease one sub-data by the length of a writing unit; selecting one of a plurality of spare blocks from the flash memory as a substitute block for substituting a data block, wherein the new data is to be written into the data block; sequentially writing the sub-data having the length of the writing unit into the substitute block in the writing unit; and storing the sub-data not having the length of the writing unit into a temporary area. The writing efficiency of the flash memory can be improved by temporarily storing the sub-data not having the length of the writing unit into the temporary area and then writing the sub-data not having the length of the writing unit with subsequent data into the substitute block.Type: ApplicationFiled: March 20, 2008Publication date: June 11, 2009Applicant: PHISON ELECTRONICS CORP.Inventors: Jiunn-Yeong Yang, Jui-Hsien Chang, Chien-Hua Chu, Jian-Yo Su, Chih-Kang Yeh
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Patent number: 7525139Abstract: An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.Type: GrantFiled: December 29, 2004Date of Patent: April 28, 2009Assignee: Advanced Chip Engineering Technology Inc.Inventors: Wen-Kun Yang, Chin-Chen Yang, Wen-Ping Yang, Wen-Bin Sun, Chao-nan Chou, His-Ying Yuan, Jui-Hsien Chang