Abstract: An aliphatic polyester is provided. The aliphatic polyester comprises: a first structural unit represented by wherein R1 is absent or a C1 to C40 aliphatic hydrocarbyl; a second structural unit represented by wherein R2 is a C1 to C10 aliphatic hydrocarbyl; and a third structural unit derived from a first cross-linking agent, wherein the first cross-linking agent has three reactive functional groups, wherein at least one reactive functional group is a secondary or tertiary hydroxyl, with the proviso that the first cross-linking agent is not malic acid.

Abstract: A polyester and a method for manufacturing polyester are provided. The polyester comprises one or more repeating units derived from polyols and one or more repeating units derived from polybasic acids and contains phosphorus and a metal element, wherein one or more repeating units derived from polyols include a repeating unit derived from tricyclodecane dimethanol, the weight ratio of the phosphorus to the metal element ranges from 0.05 to 5.00, and the metal element is selected from the group consisting of Ti, Sn, Sb, Ge, Mn, Zn, Ca, Co, Pb, Al, Zr, and combinations thereof.

Abstract: An atomization powder making device suitable for atomizing molten metal to produce powder includes a housing defining an atomizing chamber, a vessel mounted inside the housing and defining a receiving space for receiving the molten metal, and a flow guide unit extending from the bottom of the vessel and having at least one liquid flow channel for conveying the molten metal from the receiving space to the atomizing chamber. A push unit is disposed in the receiving space for pushing the molten metal to flow through the at least one liquid flow channel. A gas supply unit is configured to supply an atomizing gas for atomizing the molten metal flowing out of the liquid flow channel.

Abstract: A cable connector for decreasing signal return loss includes a front cap, a base, and a connecting terminal. A first hole is formed on the front cap, and a second hole is formed on the base. A second front side of the base connects to a first back side of the front cap. The connecting terminal includes an elastic clamping part, a wire connection part, and a lead part. A back side of the clamping part is a free end, and a front side of the clamping part is connected to the wire connection part. The lead part is mounted in front of the wire connection part. The connecting terminal is mounted in the base, and the lead part pierces the front cap covering the connecting terminal through the first hole. The present invention prevents capacitance in the cable connector, and improves electric signal transmission efficiency.

Abstract: An in-memory computing memory device is disclosed. The memory device comprises an array of memory cells, a plurality of word lines, a plurality of bit lines, (M+1) input circuits, a wordline driver and an evaluation circuitry. The array is divided into (M+1) lanes and each lane comprises P memory cell columns and an input circuit. The input circuit in each lane charges a predefined bit line with a default amount of charge proportional to an input synapse value and then distributes the default amount of charge to the other second bit lines with a predefined ratio based on a constant current. The evaluation circuitry couples a selected number of the bit lines to an accumulate line and convert an average voltage at the accumulate line into a digital value in response to a set of (M+1) input synapse values and the activated word line.

Abstract: An electronic device includes a casing, a circuit board and at least one antenna module. The casing has an accommodating space and an inner side wall surrounding the accommodating space. The circuit board is disposed in the accommodating space. Each of the antenna modules includes a first radiator and a second radiator. The first radiator is disposed on the circuit board and adjacent to the inner side wall, and includes a first section, a second section and a third section extending from the first section in opposite directions respectively. The first section includes a feeding end, and the third section includes a grounding end. The second radiator is disposed on the inner side wall. A coupling gap is formed between the first radiator and the second radiator.

Abstract: A light source heat-dissipating device is disposed in a projection apparatus having a casing with an air inlet. The light source heat-dissipating device has a heat-dissipating fin assembly disposed in the casing and having an air intake side, and first and second heat-dissipating fin assemblies, a first air duct, and a fan adjacent to the first and second heat-dissipating fin assemblies. The second heat-dissipating fin assembly is stacked on the first one. The first heat-dissipating fin assembly is between the second one and the air inlet. The first air duct is adjacently-disposed at the air intake side, has a first entrance end connected with the air inlet and a first exit end opposite to the first entrance. The light source heat-dissipating device and projection apparatus improve temperature and life consistency between light source modules. The heat dissipation performances of the first and second heat-dissipating fin assemblies tend to be consistent.

Abstract: A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.

Abstract: Techniques for safe non-conservative planning include: obtaining a risk budget constraining a plan for an autonomous vehicle to satisfy an objective; based at least on the risk budget and the objective, planning a trajectory of the autonomous vehicle toward the objective, at least by: (a) determining a risk cost associated with an initial planned action of the trajectory, (b) based at least on the risk cost, determining whether the trajectory is feasible or infeasible within the risk budget, and (c) responsive to determining that the trajectory is feasible within the risk budget, executing the initial planned action; decreasing the risk budget by the risk cost, to obtain a remaining risk budget; obtaining state data corresponding to a state of the autonomous vehicle after executing the initial planned action; and based at least on the state data, the remaining risk budget, and the objective, planning another trajectory toward the objective.

Abstract: A method includes placing a first package component and a second package component over a carrier. The first conductive pillars of the first package component and second conductive pillars of the second package component face the carrier. The method further includes encapsulating the first package component and the second package component in an encapsulating material, de-bonding the first package component and the second package component from the carrier, planarizing the first conductive pillars, the second conductive pillars, and the encapsulating material, and forming redistribution lines to electrically couple to the first conductive pillars and the second conductive pillars.

Abstract: An analog-to-digital converter (ADC) system includes a main ADC, a reference ADC, a sampling control circuit, and a calibration circuit. The main ADC obtains a first sampled input voltage by sampling an analog input according to a first sampling clock, and performs analog-to-digital conversion upon the first sampled voltage to generate a first sample value. The reference ADC obtains a second sampled voltage by sampling the analog input according to a second sampling clock, and performs analog-to-digital conversion upon the second sampled voltage to generate a second sample value. The sampling control circuit controls the second sampling clock to ensure that the second sampling clock and the first sampling clock have a same frequency but different phases, and adjusts the second sample value to generate a reference sample value. The calibration circuit applies calibration to the main ADC according to the first sample value and the reference sample value.

Abstract: A polycarbonate polyester includes residues of following formula (1), formula (2) and formula (3): in which R1 is C2-C15 hydrocarbon group; R2 is C4-C16 hydrocarbon group; a molar ratio of the residue of the formula (2) to the residue of the formula (1) is in a range of greater than 0.05 to less than 0.8; * represents a linking bond.

Abstract: Present invention is related to a composite modified layer attached on a current collector comprising a lithiophilic particle being covered or coated by a polymer layer. The composite modified layer further could be coated with an additional carbon layer or artificial protective film as several suitable embodiments presented in this invention. The lithiophilic particle, such as sliver nano-particle, will firstly form a lithium-silver alloys to reduce a thermodynamic instability during the growth of lithium nuclei. The sliver nano-particle is able to be attached securely on the current collector by the polymer with high adhesion ability. The fuel cell including the composite modified layer in the present invention has higher average Coulombic efficiency and higher capacity retention.

Abstract: A heat dissipation module is configured to dissipate heat generated by at least one heating element of a projection device. The heat dissipation module includes at least one first heat pipe, at least one second heat pipe and a heat dissipation fin assembly. The first heat pipe includes a first section connected to the heating element and a second section. The second heat pipe includes a third section connected to the heating element and a fourth section. The length of the first heat pipe is less than that of the second heat pipe. The heat dissipation fin assembly includes a plurality of heat dissipation fins. The second section and the fourth section pass through the heat dissipation fin assembly, and the number of heat dissipation fins through which the second section passes is 70% or below of the number of heat dissipation fins through which the fourth section passes.

Abstract: A method includes placing a first package component and a second package component over a carrier. The first conductive pillars of the first package component and second conductive pillars of the second package component face the carrier. The method further includes encapsulating the first package component and the second package component in an encapsulating material, de-bonding the first package component and the second package component from the carrier, planarizing the first conductive pillars, the second conductive pillars, and the encapsulating material, and forming redistribution lines to electrically couple to the first conductive pillars and the second conductive pillars.

Abstract: A data writing method, a memory control circuit unit, and a memory storage apparatus are provided. The method includes: receiving a write command from a host system; and determining whether to write a data corresponding to the write command into a first area or a second area according to a write amplification factor of the first area, where if it is determined to write the data into the second area, copying the written data to the first area after writing the data.

Abstract: A projection apparatus includes a casing, a projection lens, a first fan, a second fan, and a heat sink assembly. The casing has an air inlet and an air outlet. The projection lens is disposed in the casing, and between the air inlet and the air outlet. The first fan is disposed in the casing, and between the projection lens and the air inlet. The second fan is disposed in the casing, and between the projection lens and the air outlet. The heat sink assembly is disposed in the casing and between the projection lens and the air inlet. The first fan has a first rotational speed, the second fan has a second rotational speed. The second rotational speed is larger than the first rotational speed. The projection apparatus has the advantages of low development cost and effectively lowering the influence of the heat on the image quality.

Abstract: A method of fabricating a semiconductor package structure is provided. The method includes applying a plurality of first adhesive portions onto a carrier; applying a second adhesive portion onto the carrier; disposing a plurality of micro pins respectively in the first adhesive portions, such that each of the micro pins has a first portion embedded in a corresponding one of the first adhesive portions and a second portion protruding from said corresponding one of the first adhesive portions; bonding a die to the second adhesive portion; forming a molding compound surrounding the micro pins and the die; and removing the carrier from the molding compound after forming the molding compound.

Abstract: A conductive micro pin includes a body having a first end surface, a second end surface, a first side surface connecting the first end surface and the second end surface, and a first corner between the first end surface and the first side surface, in which the first side surface is substantially flat, and the first corner is substantially rounded.

Abstract: A semiconductor package structure includes a molding compound, a micro pin extending through the molding compound, and a die surrounded by the molding compound. The micro pin has a top surface, a bottom surface, and a sidewall extending from the bottom surface to the top surface of the micro pin. The sidewall of the micro pin has a first portion and a second portion. The first portion of the sidewall is adjacent to the bottom surface of the micro pin and free of the molding compound. The second portion of the sidewall is adjacent to the top surface of the micro pin and in contact with the molding compound.