Abstract: An optical device utilized in a laser projector includes a circulatory air channel, a phosphor wheel disposed in the circulatory air channel, a thermal exchanger partially disposed in the circulatory air channel, and an air guiding component disposed in the circulatory air channel for guiding an air provided by the thermal exchanger toward the phosphor wheel. The temperature of the air passing through the phosphor wheel is lower than an environment temperature.

Abstract: A light guide assembly, a backlight module and a liquid crystal display (LCD) are provided. The backlight module includes a back plate, light guide plate, an adhesive member and a light source. The light guide plate is disposed on the back plate and includes a first optical surface, a second optical surface and a light-incident surface. The first optical surface is opposite to the second optical surface. The light-incident surface connects the first optical surface and the second optical surface. The first optical surface or the second optical surface of the light guide plate is set with a recess. The adhesive member is disposed in the recess to adhere the light guide plate to the back plate. The light source is disposed on the back plate and emits light toward the light guide plate.

Abstract: A grinding tool includes a rigid support body and a carrier substrate. The carrier substrate is attached to the support body, and is supported by the support body. Two opposing surfaces of the carrier substrate respectively define a working surface and a non-working surface. A plurality of first abrasive particles are affixed on the working surface, and a plurality of second abrasive particles are affixed on the non-working surface. The first abrasive particles have a first average size, and the second abrasive particles have a second average size smaller than the first average size. The carrier substrate is attached to the support body at the non-working surface. Moreover, a method of manufacturing the grinding tool is described herein.

Abstract: The present invention relates to a driving circuit and a driving method for LED. The driving circuit for LED comprises an inductor used for producing an output current, a power switch coupled to the inductor and used for controlling the inductor to transmit the output current to a plurality of LEDs and drive the plurality of LEDs, an adjusting circuit receiving a PWM signal related to the output current, and a driving unit producing an adjusting impedance value according to the PWM signal. The driving unit generates a switching signal according to the adjusting impedance value. The switching signal switches the power switch and enables the inductor to produce the output current. The driving unit adjusts the frequency of the switching signal according to the adjusting impedance value.

Abstract: The present invention relates to an EUV pod having marks, which comprises a mask pod and one or more mark disposed on the mask pod. One or more sensor of a processing machine is used for detecting the one or more mark. By including the one or more mark, the surface roughness of one or more region of the mask pod detectable by the one or more sensor can be altered. The one or more sensor emits light to the mask pod, which reflects the light to the one or more sensor. The one or more sensor receives the reflection light from the mask pod and judges if the voltage generated by the reflection light falls within the reflection ranges of the mark. Thereby, whether the one or more sensor corresponds to the one or more make can be confirmed.

Abstract: Provided is a CMP conditioner with brushes comprising: a substrate comprising a surface, multiple concave parts formed in the surface; multiple abrasive assemblies, each abrasive assembly comprising a metal bar and an abrasive particle, the metal bar comprising a connecting end and a dressing end, the abrasive particle mounted in the dressing end of the metal bar and protruding a tip, wherein vertical distances between the tips and a level of the surface are equal; and multiple brushes mounted in the surface, wherein ends of the brushes are higher than the tips, vertical distances between the ends of the brushes and a level of the tips ranging from 0.1 mm to 1 mm. The present invention, with precise control of the vertical distance between the tips and the level of the surface, and of the vertical distance between the ends of the brushes and a level of the tips improves the cleaning ability of the CMP conditioner with brushes for the scraps in holes of the surface of a pad and avoid problems, e.g.

Abstract: A set-top box includes a casing defining a receiving space. An infrared signal receiver and a power button are received in the receiving space. The casing further defines a mounting hole coupled with the receiving space. An operation button is slidably received in the mounting hole. The infrared signal receiver and the power button face the operation button, infrared signals can pass through the operation button and then be received by the infrared signal receiver.

Abstract: A light guide assembly, a backlight module and a liquid crystal display (LCD) are provided. The backlight module includes a back plate light guide plate, an adhesive member and a light source. The light guide plate is disposed on the back plate and includes a first optical surface, a second optical surface and a light-incident surface. The first optical surface is opposite to the second optical surface. The light-incident surface connects the first optical surface and the second optical surface. The first optical surface or the second optical surface of the light guide plate is set with recess. The adhesive member is disposed in the recess to adhere the light guide plate to the back plate. The light source is disposed on the back plate and emits light toward the light guide plate.

Abstract: The present invention relates to a chemical mechanical polishing conditioner and manufacturing methods thereof. The chemical mechanical polishing conditioner comprises: a planar substrate having a leveling surface; a bonding layer disposed on the surface of the planar substrate; and a plurality of abrasive particles embedded in the surface of the bonding layer and fixed to the surface of the planar substrate by the binding layer; wherein the planar substrate is formed by a deformation compensation for the non-planar substrate during curing the binding layer, and thus the tips of the abrasive particles have a leveled height. Therefore, the present invention can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: A heat dissipation assembly for a projection apparatus is provided. The projection apparatus includes a light source, optical elements and a heat dissipation assembly. The heat dissipation assembly includes a case, a heat dissipation element, a fan and a temperature controlling unit. The optical elements transmit a light beam generated by the light source, and thereby generate heat. The heat dissipation assembly is adapted for heat dissipation correspondingly. In the heat dissipation assembly, the case protects the optical elements from being polluted by the dust during heat dissipation. The temperature controlling unit senses the surrounding temperature to control the fan for cooling the heat dissipation element, and the durability of the optical elements are thereby enhanced.

Abstract: Aspects of this disclosure relate to a mode linearization switch circuit that can adjust an effective impedance provided to an output of an amplifier. In an embodiment, an apparatus includes an amplifier configured to amplify a radio frequency (RF) signal and a mode linearization switch circuit electrically coupled to an output of the amplifier. The mode linearization switch circuit can include a capacitor, a switch in series with the capacitor, and a series LC circuit in parallel with the switch.

Abstract: Aspects of this disclosure relate to efficient power amplifiers, such as class-F power amplifiers. A power amplifier transistor can provide an amplified RF signal. A termination can be coupled to an output of the power amplifier transistor and configured to provide a short circuit at a second harmonic. In some instances, the termination circuit can provide an open circuit at a third harmonic. A resonant circuit can be coupled to the output terminal of the power amplifier transistor and configured to provide an open circuit at the third harmonic. In certain embodiments, an input termination circuit coupled to an input terminal of the power amplifier transistor can provide a short circuit at the second harmonic. The power amplifiers of this disclosure can be implemented, for example, in envelope tracking applications.

Abstract: The projection apparatus includes a light source, optical elements and a heat dissipation assembly. The heat dissipation assembly includes a case, a heat dissipation element, a fan and a temperature controlling unit. The optical elements transmit a light beam generated by the light source, and thereby generate heat. The heat dissipation assembly is adapted for heat dissipation correspondingly. In the heat dissipation assembly, the case protects the optical elements from being polluted by the dust during heat dissipation. The temperature controlling unit senses the surrounding temperature to control the fan for cooling the heat dissipation element, and the durability of the optical elements are thereby enhanced.

Abstract: The present invention relates to a reticle pod having gas guiding apparatus. The gas guiding apparatus communicates with at least an inlet of the reticle pod and comprises a first outlet corresponding to a first gas flowing space of the reticle pod and a second outlet corresponding to a second gas flowing space. When the inlet supplies a high-purity gas to the gas guiding apparatus, the high-purity gas will flows through the gas guiding apparatus, and flow to the first and second gas flowing spaces via the first and second outlets, respectively to distribute uniformly in the first and second gas flowing spaces. In addition, the cleaning efficiency on the reticle is improved; the contact between the reticle and air can be avoided for protecting the reticle. Thereby, the usage of the high-purity gas is reduced, and the filling efficiency of the high-purity gas is enhanced.

Abstract: Switchable base feed circuit for radio-frequency (RF) power amplifiers. In some embodiments, an RF power amplifier (PA) circuit can include a transistor having a base, a collector, and an emitter, with the transistor being configured to amplify an RF signal. The PA circuit can further include a bias circuit configured to provide a base bias signal to the base of the transistor. The PA circuit can further include a switchable base feed circuit implemented between the bias circuit and the base of the transistor. The switchable base feed circuit can be configured to provide a plurality of different resistance values for the base bias signal between the bias circuit and the base of the transistor. Such a PA circuit can be implemented in products such as a die, a module, and a wireless device.

Abstract: Switchable feedback circuit for radio-frequency (RF) power amplifiers. In some embodiments, an RF power amplifier (PA) circuit can include a transistor having a base, a collector, and an emitter. The transistor can be configured to amplify an RF signal. The RF PA circuit can further include a switchable feedback circuit implemented between the collector and the base. The switchable feedback circuit can be configured to provide a plurality of resistance values between the collector and the base. Such a PA circuit can be implemented in products such as a die, a module, and a wireless device.

Abstract: Provided is a CMP conditioner comprising: a substrate comprising multiple concave parts, the concave parts formed in a surface of the substrate and each concave part having a side wall; multiple fixed plates, each fixed plate comprising a bottom, a top, a concavity and an inclined plane, the bottom fixed into the concave part, the top integrated with the bottom with a contact surface formed between the top and the bottom, the concavity formed in the top and opposite the bottom, the inclined plane formed between the contact surface and the concavity, an angle and a space formed between the inclined plane and the side wall; and multiple abrasive units, each abrasive unit mounted in the concavity. When the CMP conditioner is applied to a pad, the thickness of the pad can recover to its original thickness; i.e., the cutting depth is increased to improve the dressing performance.

Abstract: The present invention relates to a diamond screening apparatus, comprising: a working platform comprising a working plane; a conveyer disposed on the working plane of the working platform for carrying a diamond matrix unit; an image capture device forming one or a plurality of captured images in different regions of the diamond matrix unit; a display device; and an image recognition module, which is electrically connected to the image capture device and the display device, performs a geometric feature parameter analysis on the captured images to determine one or a plurality of risk diamonds of the diamond matrix unit.

Abstract: Disclosed is a wafer comprising a first layer of GaSb grown on a GaSb substrate by molecular beam epitaxy (MBE), an oxide layer deposited on the surface of the first layer, and a cap layer deposited on the surface of the oxide layer. The wafer was capped with an arsenic (As) layer after the growth of the first layer. The As layer was removed from the wafer before the oxide layer was deposited on the surface of the first layer. Also disclosed is a method of forming a wafer. The method comprises growing a first layer of GaSb on a GaSb substrate by MBE, capping the wafer with an As layer after the growth of the first layer, removing the As layer from the wafer, depositing an oxide layer on the surface of the first layer, and depositing a cap layer on the surface of the oxide layer.

Abstract: The present invention relates to a wafer transport system and a method of operating the same. The wafer transport system comprises at least one semiconductor apparatus, a track, a transfer device, a positioning device, a carrier and a cleaning device. The wafer transport system transports wafers along the at least one semiconductor apparatus via the carrier riding on the track. The transfer device transfers the wafers from the carrier to the at least one semiconductor apparatus. The positioning device identifies and controls the position of the carrier on the track. The cleaning device maintains the cleanliness of the wafers. The present invention provides advantages for improving the yield rate of a wafer, shortening the fabrication time of a wafer, and offering the flexibility and the extendibility to a wafer transport system.