Abstract: Provided is a chemical mechanical polishing conditioner capable of controlling a polishing depth. The CMP conditioner capable of controlling the polishing depth comprises a substrate; a binding layer disposed on the substrate; multiple abrasive units placed on the binding layer; and multiple abrasive terminal units placed on the binding layer. Each abrasive unit has an abrasive unit substrate and an abrasive layer, and the abrasive layer is a diamond film formed by chemical vapor deposition and has multiple abrasive tips. The abrasive tips of the abrasive units are relatively higher than surfaces of the abrasive terminal units to form a protrusion height. Accordingly, the CMP conditioner controls the polishing depth of an article to be conditioned.

Abstract: The present invention relates to a chemical mechanical polishing conditioner having different heights, comprising: a substrate; a binding layer disposed on the substrate; and multiple abrasive units placed on the binding layer. Each abrasive unit has an abrasive unit substrate and an abrasive layer which is a diamond film formed by chemical vapor deposition and has multiple abrasive tips. The abrasive units have a first tip height and a second tip height. The first tip height is different from the second tip height. The chemical mechanical polishing conditioner can adjust the surface roughness of the pad to be polished and improve the drainage of abrasive slurry.

Abstract: The present invention relates to a chemical mechanical polishing conditioner, comprising: a substrate; a binding layer disposed on the substrate; and multiple abrasive units placed on the binding layer; wherein each abrasive unit has an abrasive unit substrate and an abrasive layer which is a diamond film formed by chemical vapor deposition and has multiple abrasive tips; wherein the abrasive units have uniform heights, such that the abrasive units form a planarized surface. Therefore, the present invention can improve planarization of the conditioner, enhance efficiency, and prolong lifetime.

Abstract: An assembly includes an electrical connector, a cable unit, and adapter terminals. The electrical connector includes an insulator body and conductive terminals disposed at the insulator body. Each conductive terminal includes an insert arm positioned outside the insulator body. The cable unit includes a plug connector and cables connected to the plug connector. Each of the adapter terminals is connected to a core wire of a corresponding cable and is sleeved on the insert arm of a corresponding conductive terminal. Each adapter terminal is electrically connected between the core wire of the corresponding cable and the insert arm of the corresponding conductive terminal.

Abstract: The present invention relates to a chemical mechanical polishing conditioner with high performance, comprising a substrate; a binding layer disposed on the substrate; and a plurality of abrasive particles fixed directly on the substrate by the binding layer, or each abrasive particle disposed on a metal fixing seat and the substrate have a plurality of blind holes and a plurality of through holes, so that the metal fixing seats are installed into the blind holes or the through holes, and the metal fixing seat fixed on the substrate by the binding layer; wherein the abrasive particles are treated by a surface processing treatment to make the abrasive particles have specific cutting edge angles, crystal structures, tip heights, or tip orientations. Therefore, the present invention can control the profile of each abrasive particle to accomplish the best polishing performance.

Abstract: A knob structure and an electronic device thereof are disclosed. The knob structure is assembled with a case of the electronic device and includes a plurality of pressing portions, an elastic component, and a fixing component. At least one pressing portion has a pressing rib used for pressing a switch module. The elastic component includes a main body and a plurality of elastic ribs. The plurality of elastic rib is disposed on the main body to support the pressing portion. When the pressing portion is pressed along a supporting direction, the elastic rib is capable of providing an elastic force. The fixing component includes a first end and a second end, wherein the first end connects to at least one of the plurality of pressing portions and the second end is extended along a direction different from the supporting direction and fixed to the case.

Abstract: A foldable electronic device includes a first body, a second body and a hinge body. The hinge body is pivoted to the first body around a first pivoting axis and pivoted to the second body around a second pivoting axis so that the first body is able to rotate relatively to the second body. When the first body rotates to a first position relatively to the second body, a first front surface of the first body is closed to a second front surface of the second body on a closing plane, and a pivoting plane where the first pivoting axis and the second pivoting axis are located on and the closing plane are oblique to each other.

Abstract: A radio-frequency (RF) front-end supporting at least a first and second wireless communication bands includes a mixer arranged for mixing a received signal with a first local oscillation signal when the shared receiver front-end performs the reception operation according to the first wireless communication band, and for mixing the received signal with a second local oscillation signal when the shared receiver front-end performs the reception operation according to the second wireless communication band, wherein the first and second local oscillation signals are different in frequency.

Abstract: The present invention relates to a chemical mechanical polishing conditioner with high quality abrasive particles, comprising a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles placed on the bonding layer, and the abrasive particles are placed on the substrate by the bonding layer; wherein the abrasive particles have a risk diamond content measured by a screening apparatus for screening abrasive particles. Therefore, the chemical mechanical polishing conditioner with high quality abrasive particles is produced, after the risk diamond content is judged by the screening apparatus for screening abrasive particles; thereby avoiding scratches and breakages produced on the polishing pad due to the risk diamonds during a chemical mechanical polishing process.

Abstract: The present invention relates to a segment-type chemical mechanical polishing conditioner and a method for manufacturing thereof. The segment-type chemical mechanical polishing conditioner comprises: a bottom substrate having a center protrusion; an abrasive unit binding layer disposed on the outside of the surface of the bottom substrate; and a plurality of abrasive units placed on the abrasive unit binding layer; wherein the abrasive units have a fan-shaped contour and are arrange along the center protrusion of the bottom substrate to form a discontinuous circular contour. Therefore, the present invention can utilize the center protrusion of the bottom substrate to adjust the arrangements of the abrasive units, and effectively improve the problem of thermal deformation of the surface of the chemical mechanical polishing conditioner during heat-hardening process, thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a chemical mechanical polishing conditioner with high quality abrasive particles, comprising a substrate; a binding layer disposed on the substrate; and a plurality of abrasive particles placed on the binding layer, and the abrasive particles are placed on the substrate by the binding layer; wherein the chemical mechanical polishing conditioner with high quality abrasive particles is moved to pass through a water jet and a high pressure fluid by a conveying device, and the high pressure fluid is applied on the abrasive particles through the water jet to remove one or more than one risk diamond included in the abrasive particles. Therefore, the present invention can improve a problem of conventional risk diamond residue on the conditioner, thereby enhancing the polishing performance and service time of the conditioner.

Abstract: Apparatus and methods for reducing capacitive loading of a power amplifier supply control module are disclosed. In one embodiment, a method of power supply control in a power amplifier system includes controlling a voltage level of a supply voltage using a supply control module, amplifying a first radio frequency (RF) signal using a first power amplifier module, amplifying a second RF signal using a second power amplifier module, delivering the supply voltage to a first supply input of the first power amplifier module through a first resonant circuit, and delivering the supply voltage to a second supply input of the second power amplifier module through a second resonant circuit. The first resonant circuit includes a first inductor and a first capacitor electrically connected in parallel, and the second resonant circuit includes a second inductor and a second capacitor electrically connected in parallel.

Abstract: An assembled wearable electronic device includes a first body, a second body and an engaging assembly. The first body has a primary system for providing the independent operation of the first body and producing a related first data. The second body has a secondary system and a fixing assembly. The secondary system is for providing the independent operation of the second body and producing a related second data. The engaging assembly is disposed at one of the first and second bodies. When the engaging assembly is located at a first position, the first and second bodies contact each other to be combined through the engaging assembly. When the engaging assembly moves to a second position, the first and second bodies are configured to be separated from each other. When the first and second bodies are connected to each other, the second data is read by the primary system.

Abstract: A light exposure system includes a light source device, a shutter device and a control device. The light source device is capable of emitting a light to an assembly liquid crystal cell. The shutter device is located on an optical path of the light. The control device controls the light source device or the shutter device to control the illuminance on the assembly liquid crystal cell. The control device makes the assembly liquid crystal cell have a plurality of first exposure times receiving a first illuminance and a plurality of second exposure times receiving a second illuminance during the light exposure process. The first exposure times and the second exposure times are arranged alternately. The sum of the first exposure times and the second exposure times is substantially equal to the default continuous exposure time.

Abstract: An assembly includes an electrical connector, a cable unit, and adapter terminals. The electrical connector includes an insulator body and conductive terminals disposed at the insulator body. Each conductive terminal includes an insert arm positioned outside the insulator body. The cable unit includes a plug connector and cables connected to the plug connector. Each of the adapter terminals is connected to a core wire of a corresponding cable and is sleeved on the insert arm of a corresponding conductive terminal. Each adapter terminal is electrically connected between the core wire of the corresponding cable and the insert arm of the corresponding conductive terminal.

Abstract: A heat dissipation structure of a projection device includes at least one fan, at least one light emitting unit, at least one air guide, and a sensing device. The fan with an outlet is used for providing a cooling flow. The light emitting unit is used for providing a light beam. The air guide is dismountable disposed in front of the outlet. The air guide is used for guiding the cooling flow to a hot spot of the light emitting unit. The sensing device is used for sensing a projection direction of the projection device.

Abstract: A circuit board assembling structure includes a first casing, a second casing, a dam and a circuit board. The first casing has an outer edge and at least a snap-engaging element. The second casing is coupled to the first casing. The dam is mounted on the first casing. The at least a snap-engaging element is disposed between the outer edge of the first casing and the dam. The circuit board is a resilient carrier which is snap-engaged with the at least a snap-engaging element, such that the circuit board is disposed between the outer edge of the first casing and the dam. Furthermore, an electronic device having the circuit board assembling structure and an assembling method of the electronic device are further provided.

Abstract: An optical imaging lens includes a lens barrel, a front lens element, plural intermediate lens elements, and a rear lens element. The front lens element has a first central lens portion and a first assembly portion. The first assembly portion has a first front abutting section, a first front slanting surface section, and a first rear slanting surface section. Each of the intermediate lens elements has a second central lens portion and a second assembly portion. The second assembly portion has a second front slanting surface section and a second rear slanting surface section. The rear lens element has a third central lens portion and a third assembly portion. The third assembly portion has a third front slanting surface section.

Abstract: The present invention discloses an electronic device including a storage device, an input device, a display device and a processing unit. The storage device stores an input rule table. The input device receives at least one input signal corresponding to text editing. The display device is arranged to display a text input interface, wherein the text input interface comprises a first display region and a second display region provided for users to do the text editing by the input device, wherein the display device has a display region, the display region has a predetermined display area, and the text input interface has an interface area. The processing dynamically adjusts the interface area of the text input interface to change the ratio of the interface area and the predetermined display area of the display region according to the input signal and the input rule table.

Abstract: The present invention relates to a driving circuit and a driving method for LED. The driving circuit for LED comprises an inductor used for producing an output current, a power switch coupled to the inductor and used for controlling the inductor to transmit the output current to a plurality of LEDs and drive the plurality of LEDs, an adjusting circuit receiving a PWM signal related to the output current, and a driving unit producing an adjusting impedance value according to the PWM signal. The driving unit generates a switching signal according to the adjusting impedance value. The switching signal switches the power switch and enables the inductor to produce the output current. The driving unit adjusts the frequency of the switching signal according to the adjusting impedance value.