Abstract: An insertion tool for assisting in the insertion of an OCP 3.0 type expansion card in an expansion card slot of a computer system is disclosed. The expansion card may be a pull tab type form factor that does not have a mechanism such as an ejector latch to assist in applying force to insert the card. The expansion card has a front panel opposite a distal edge connector. The tool has a handle and a head coupled to the handle. The head has two contact areas that contact different areas of the front panel of the expansion card. For example, one of the contact areas may be an extended side arm and the other area may be a lateral rib extending from the head.

Abstract: A partition for separating computer components in an apparatus holding the computer components is provided. The partition includes a body with a first side and a second side; one or more top tabs projecting from both the first side and the second side of the body; one or more bottom tabs projecting from the first side of the body; and one or more bottom protrusions projecting from the second side of the body. The one or more top tabs are secured in a first manner, e.g., through rivets, to a first panel of the apparatus. The one or more bottom tabs are secured in the first manner to a second panel of the apparatus. The one or more bottom protrusions are secured in a second manner to the second panel of the apparatus, e.g., tucking a protrusion under the second panel. The features allow different-sized compartments for different storage form factors.

Abstract: A mold separation method includes the following steps: providing a mold separation device including a carrying mechanism, a scraping mechanism, and two separation mechanisms, wherein the scraping mechanism is disposed at an edge of the carrying mechanism, and the separation mechanisms are disposed at the edge of the carrying mechanism and are located on two opposite sides of the scraping mechanism; placing a first mold and a second mold bonded to the first mold on the carrying mechanism; causing the scraping mechanism to scrape off a spilled glue produced when the first mold is bonded to the second mold; and after scraping off the spilled glue, causing the separation mechanisms to pull open the first mold and the second mold so that the first mold and the second mold are separated from each other.

Abstract: An insertion tool for assisting in the insertion of an OCP 3.0 type expansion card in an expansion card slot of a computer system is disclosed. The expansion card may be a pull tab type form factor that does not have a mechanism such as an ejector latch to assist in applying force to insert the card. The expansion card has a front panel opposite a distal edge connector. The tool has a handle and a head coupled to the handle. The head has two contact areas that contact different areas of the front panel of the expansion card. For example, one of the contact areas may be an extended side arm and the other area may be a lateral rib extending from the head.

Abstract: A partition for separating computer components in an apparatus holding the computer components is provided. The partition includes a body with a first side and a second side; one or more top tabs projecting from both the first side and the second side of the body; one or more bottom tabs projecting from the first side of the body; and one or more bottom protrusions projecting from the second side of the body. The one or more top tabs are secured in a first manner, e.g., through rivets, to a first panel of the apparatus. The one or more bottom tabs are secured in the first manner to a second panel of the apparatus. The one or more bottom protrusions are secured in a second manner to the second panel of the apparatus, e.g., tucking a protrusion under the second panel. The features allow different-sized compartments for different storage form factors.

Abstract: A front-access chassis for storage drives can be configured to store different drives in different orientations in a single group of drives. For example, drives in a disk group can be installed with two vertical drives followed immediately by four horizontal drives. Each chassis can include multiple disk groups. Thus, drives with certain functions can be easily and readily identified based on orientation. For example, system drives may be installed vertically whereas storage drives may be installed horizontally, permitting a user to quickly identify a desired drive at a glance.

Abstract: A mold separation method includes the following steps: providing a mold separation device including a carrying mechanism, a scraping mechanism, and two separation mechanisms, wherein the scraping mechanism is disposed at an edge of the carrying mechanism, and the separation mechanisms are disposed at the edge of the carrying mechanism and are located on two opposite sides of the scraping mechanism; placing a first mold and a second mold bonded to the first mold on the carrying mechanism; causing the scraping mechanism to scrape off a spilled glue produced when the first mold is bonded to the second mold; and after scraping off the spilled glue, causing the separation mechanisms to pull open the first mold and the second mold so that the first mold and the second mold are separated from each other.

Abstract: A mold separation device includes a carrying mechanism, a scraping mechanism, and two separation mechanisms. The carrying mechanism is adapted to carry a first mold and a second mold bonded to the first mold. The scraping mechanism is disposed at an edge of the carrying mechanism and is adapted to scrape off a spilled glue produced when the first mold is bonded to the second mold. The separation mechanisms are disposed at the edge of the carrying mechanism and are located on two opposite sides of the scraping mechanism. The separation mechanisms are adapted to pull open the first mold and the second mold so that the first mold and the second mold are separated from each other.

Abstract: A fixture and method are directed to releasably couple the fixture to a semi-flexible printed circuit board (PCB)/printed circuit board assembly (PCBA) at a flexible PCB/PCBA portion. The fixture includes a body with a first arm and a second arm extending from a base, an interior surface of the first arm facing an interior surface of the second arm. A first ridge extends from the interior surface of the first arm and defines a first gap between the first ridge and the interior surface of the second arm. The first gap is sized to receive and support a flexible PCB/PCBA portion. At least one second ridge extends from the interior surface of the first arm and defines a second gap between the at least one second ridge and the interior surface of the second arm. The second gap is sized to receive and support a rigid PCB/PCBA portion.

Abstract: A fixture and method are directed to releasably couple the fixture to a semi-flexible printed circuit board (PCB)/printed circuit board assembly (PCBA) at a flexible PCB/PCBA portion. The fixture includes a body with a first arm and a second arm extending from a base, an interior surface of the first arm facing an interior surface of the second arm. A first ridge extends from the interior surface of the first arm and defines a first gap between the first ridge and the interior surface of the second arm. The first gap is sized to receive and support a flexible PCB/PCBA portion. At least one second ridge extends from the interior surface of the first arm and defines a second gap between the at least one second ridge and the interior surface of the second arm. The second gap is sized to receive and support a rigid PCB/PCBA portion.

Abstract: A wafer clamp includes a platform with a top surface, a stopper disposed at a front end of the platform, a push rod disposed at a rear end of the platform, at least one actuator pivotally connected to the push rod, and a sensor disposed at the front end of the platform, the sensor measuring a distance between the sensor and a wafer over the sensor.

Abstract: The present disclosure provides a computing device. The computing device includes an electronic component. The computing device also includes a printed circuit board assembly (PCBA). The PCBA includes at least two latch receiving spaces. The two latch receiving spaces are positioned on the PCBA to accommodate various sizes of the electronic component. The computing device also includes a latch assembly for securing the electronic component. The latch assembly is connected to the PCBA at one of the at least two latch receiving spaces.

Abstract: A wafer clamp includes a platform with a top surface, a stopper disposed at a front end of the platform, a push rod disposed at a rear end of the platform, at least one actuator pivotally connected to the push rod, and a sensor disposed at the front end of the platform, the sensor measuring a distance between the sensor and a wafer over the sensor.

Abstract: A wafer clamp includes a platform with a top surface, a stopper disposed at a front end of the platform, a push rod disposed at a rear end of the platform, at least one actuator pivotally connected to the push rod, and a sensor disposed at the front end of the platform, the sensor measuring a distance between the sensor and a wafer over the sensor.

Abstract: A molding apparatus includes a working stamp disposed above a wafer; a vacuum chuck operatively disposed below the wafer and configured to hold the wafer by vacuum force, the vacuum chuck including an inner chuck and an outer chuck surrounding the inner chuck capable of individually moving axially; and a separating ring operatively disposed above a periphery of the wafer.

Abstract: A mold separation device includes a carrying mechanism, a scraping mechanism, and two separation mechanisms. The carrying mechanism is adapted to carry a first mold and a second mold bonded to the first mold. The scraping mechanism is disposed at an edge of the carrying mechanism and is adapted to scrape off a spilled glue produced when the first mold is bonded to the second mold. The separation mechanisms are disposed at the edge of the carrying mechanism and are located on two opposite sides of the scraping mechanism. The separation mechanisms are adapted to pull open the first mold and the second mold so that the first mold and the second mold are separated from each other.

Abstract: The present disclosure provides a computing device. The computing device includes an electronic component. The computing device also includes a printed circuit board assembly (PCBA). The PCBA includes at least two latch receiving spaces. The two latch receiving spaces are positioned on the PCBA to accommodate various sizes of the electronic component. The computing device also includes a latch assembly for securing the electronic component. The latch assembly is connected to the PCBA at one of the at least two latch receiving spaces.

Abstract: A wafer cassette includes a front plate and a rear plate disposed opposite to face each other; and at least two top elongated rods, at least two middle elongated rods and at least two bottom elongated rods, each having a plurality of grooves shaped thereinto. The top elongated rods, the middle elongated rods and the bottom elongated rods each has two ends being pivotally connected to the front plate and the rear plate, respectively. The top elongated rods, the middle elongated rods and the bottom elongated rods each comprises a solid-iron rod enclosed with a cladding layer.

Abstract: A wafer clamp includes a platform with a top surface, a stopper disposed at a front end of the platform, a push rod disposed at a rear end of the platform, at least one actuator pivotally connected to the push rod, and a sensor disposed at the front end of the platform, the sensor measuring a distance between the sensor and a wafer over the sensor.

Abstract: Apparatus for carrying and shielding wafers includes a wafer container, a plurality of wafer cassettes disposed in the wafer container, and an engaging lock that prevents the wafer cassettes from shifting, the engaging lock being in direct contact with walls of the wafer cassettes.