Patents by Inventor Jui-Yuan Hsu
Jui-Yuan Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12233692Abstract: The invention refers to a light-transmissive plastic plate structure suitable for vehicle sunroof with curved surface and a method for fabricating the same. By using polymer material formulation, UV resistant coating formulation and precision coating technology, the wear resistance of polymer surface of plastic substrate can be improved to the same level as glass, and the original optical and physical properties after various environmental tests can also be maintained. The plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.Type: GrantFiled: February 16, 2023Date of Patent: February 25, 2025Assignee: Enflex CorporationInventors: Hsin Yuan Chen, Jui Lin Hsu, Lung Hsiang Peng, Teng Hsiang Wei, Yong-Xin Chen, Zong Yang Li
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Publication number: 20250042068Abstract: A method for processing a curved plastic panel is to first form a hard coating layer, an optical function layer, and a printing layer on a flat plastic substrate, and then cut it into a predetermined shape, and then use a hot pressing and curving device to perform a hot pressing and curving process to the flat plastic substrate in order to make it becoming a curved plastic substrate. The hot pressing and curving device can simultaneously perform hot pressing during the heating process, and has the functions of real-time monitoring of the local temperature and the local curvature forming state, and then feedback to the local heating and curvature forming mechanism for adjustments. The monitoring of temperature and curvature can be divided into multiple stages, which can be monitored stage by stage and adjusted for heating or curvature forming to improve production yield.Type: ApplicationFiled: October 20, 2024Publication date: February 6, 2025Applicant: ENFLEX CORPORATIONInventors: Hsin Yuan CHEN, Chih Teng KU, Jui Lin HSU, Chun Kai WANG, Yu Ling CHIEN
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Publication number: 20250020857Abstract: A light-guide sunroof assembly comprises a plastic substrate and a light source module furnished besides the plastic substrate. An outer layer of the plastic substrate is added with dye to form a colored background. A plurality of light-guide microstructures is furnished on the plastic substrate to guide the light generated by the light source module toward an inner surface of the plastic substrate. Thereby, the light generated by the light source module is guided by the plastic substrate and then ejects out of the inner surface of plastic substrate, so as to provide a light decoration or lighting effect that enriches the visual experience. Moreover, the plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.Type: ApplicationFiled: September 28, 2024Publication date: January 16, 2025Applicant: ENFLEX CORPORATIONInventors: Jyh Horng WANG, Hsin Yuan CHEN, Jui Lin HSU, Chih Teng KU, Lung Hsiang PENG
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Patent number: 11758699Abstract: A charging module for electric vehicle includes a power conversion unit, a heat dissipation unit, and a thermoelectric module. The power conversion unit includes a power conversion module disposed inside a cabinet, and the power conversion unit provides output power. The heat dissipation unit cools the power conversion unit through liquid cooling or air cooling. The thermoelectric module generates electrical energy based on a temperature difference between the power conversion unit and the heat dissipation unit during operation. The electrical energy is supplied to the power conversion unit and/or the heat dissipation unit.Type: GrantFiled: February 2, 2021Date of Patent: September 12, 2023Assignee: DELTA ELECTRONICS, INC.Inventors: Jui-Yuan Hsu, Ming-Hsien Hsieh, Kai-Hung Huang
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Patent number: 11699585Abstract: Embodiments of the present disclosure generally relate to methods of forming hardmasks. Embodiments described herein enable, e.g., formation of carbon-containing hardmasks having reduced film stress. In an embodiment, a method of processing a substrate is provided. The method includes positioning a substrate in a processing volume of a processing chamber and depositing a diamond-like carbon (DLC) layer on the substrate. After depositing the DLC layer, the film stress is reduced by performing a plasma treatment, wherein the plasma treatment comprises applying a radio frequency (RF) bias power of about 100 W to about 10,000 W.Type: GrantFiled: October 21, 2020Date of Patent: July 11, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Jui-Yuan Hsu, Pramit Manna, Bhaskar Kumar, Karthik Janakiraman
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Patent number: 11695233Abstract: A charging coupler has a grip, an electrical connector and a cable holder. The grip has a front opening and a rear opening on two ends thereof The grip has a first half-tube and a second half-tube connected with each other along a longitudinal direction thereof. The first half-tube has a first latch portion and a groove extending along edges thereof to connect the second half-tube. The second half-tube has a second latch portion and a rib extending along edges thereof to connect the first half-tube. The rib is substantially matched with the groove, and a sealant is filled in a gap between the rib and the groove. The first latch portion is latched with the second latch portion to tighten connection of the first half-tube and the second half-tube. The electrical connector is arranged on the front opening, and the cable holder is arranged on the rear opening.Type: GrantFiled: July 26, 2021Date of Patent: July 4, 2023Assignee: DELTA ELECTRONICS, INC.Inventors: Jui-Yuan Hsu, Hung-Sheng Hsieh
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Patent number: 11664214Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the embodiments described herein provide techniques for depositing nitrogen-doped diamond-like carbon films for patterning applications. In one or more embodiments, a method for processing a substrate includes flowing a deposition gas containing a hydrocarbon compound and a nitrogen dopant compound into a processing volume of a process chamber having a substrate positioned on an electrostatic chuck, and generating a plasma at or above the substrate by applying a first RF bias to the electrostatic chuck to deposit a nitrogen-doped diamond-like carbon film on the substrate. The nitrogen-doped diamond-like carbon film has a density of greater than 1.5 g/cc and a compressive stress of about ?20 MPa to less than ?600 MPa.Type: GrantFiled: September 28, 2020Date of Patent: May 30, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Jui-Yuan Hsu, Pramit Manna, Karthik Janakiraman
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Patent number: 11664226Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the embodiments described herein provide methods for producing reduced-stress diamond-like carbon films for patterning applications. In one or more embodiments, a method includes flowing a deposition gas containing a hydrocarbon compound into a processing volume of a process chamber having a substrate positioned on an electrostatic chuck and generating a plasma above the substrate in the processing volume by applying a first RF bias to the electrostatic chuck to deposit a stressed diamond-like carbon film on the substrate. The stressed diamond-like carbon film has a compressive stress of ?500 MPa or greater. The method further includes heating the stressed diamond-like carbon film to produce a reduced-stress diamond-like carbon film during a thermal annealing process. The reduced-stress diamond-like carbon film has a compressive stress of less than ?500 MPa.Type: GrantFiled: September 28, 2020Date of Patent: May 30, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Jui-Yuan Hsu, Pramit Manna, Karthik Janakiraman
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Publication number: 20230022359Abstract: Embodiments of the present disclosure generally relate to methods, apparatus, and systems for maintaining film modulus within a predetermined modulus range. In one implementation, a method of processing substrates includes introducing one or more processing gases to a processing volume of a processing chamber, and depositing a film on a substrate supported on a substrate support disposed in the processing volume. The method includes supplying simultaneously a first radiofrequency (RF) power and a second RF power to one or more bias electrodes of the substrate support. The first RF power includes a first RF frequency and the second RF power includes a second RF frequency that is less than the first RF frequency. A modulus of the film is maintained within a predetermined modulus range.Type: ApplicationFiled: July 22, 2021Publication date: January 26, 2023Inventors: Jui-Yuan HSU, Pramit MANNA, Karthik JANAKIRAMAN
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Patent number: 11437135Abstract: A liquid ingesting management system is provided. The liquid ingesting management system includes a fluid container, a database and a wireless transmit/receive unit. The wireless transmit/receive unit communicates with the fluid container and the database through a wireless technique to access the database and control the fluid container to perform a liquid ingesting management process.Type: GrantFiled: April 13, 2020Date of Patent: September 6, 2022Assignee: BEYOND INVESTMENT CO., LTD.Inventors: Justin Jing-Yun Huang, Jui-Yuan Hsu, Ching-Wei Huang, Ching-Wu Huang, Jean-Yun Huang, Yu-Tung Huang
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Patent number: 11421324Abstract: Embodiments of the present disclosure generally relate to hardmasks and to processes for forming hardmasks by plasma-enhanced chemical vapor deposition (PECVD). In an embodiment, a process for forming a hardmask layer on a substrate is provided. The process includes introducing a substrate to a processing volume of a PECVD chamber, the substrate on a substrate support, the substrate support comprising an electrostatic chuck, and flowing a process gas into the processing volume within the PECVD chamber, the process gas comprising a carbon-containing gas. The process further includes forming, under plasma conditions, an energized process gas from the process gas in the processing volume, electrostatically chucking the substrate to the substrate support, depositing a first carbon-containing layer on the substrate while electrostatically chucking the substrate, and forming the hardmask layer by depositing a second carbon-containing layer on the substrate.Type: GrantFiled: October 21, 2020Date of Patent: August 23, 2022Assignee: Applied Materials, Inc.Inventors: Jui-Yuan Hsu, Krishna Nittala, Pramit Manna, Karthik Janakiraman
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Publication number: 20220234463Abstract: A charging apparatus for use with an electric vehicle includes a power transmission path, a switch, a first controller, a communication unit, and a second controller. The switch is disposed on the power transmission path. The communication unit is coupled to a second connection port. The first controller is coupled to the power transmission path, the switch, the second controller, and the communication unit. When the second controller receives a first request from a power management system and correspondingly notifies the first controller, the first controller switches from a first signal to a second signal to communicate with the electric vehicle and turns off the switch, and when the first controller receives a first EV notification provided from the electric vehicle, the controller turns on the switch.Type: ApplicationFiled: September 1, 2021Publication date: July 28, 2022Inventors: Jui-Yuan HSU, Wei-Hsun LAI, Ming-Yu JIANG, Bo-Song LIN, Jung-Lien SHIH
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Publication number: 20220219555Abstract: A liquid-cooled charging equipment with multiple charging connector assemblies includes a recirculating cooling apparatus, a plurality of charging connector assemblies, a plurality of coolant supply pipes, a plurality of coolant return pipes, a plurality of valves, and a control unit. The recirculating cooling apparatus has an outlet side and an inlet side. Each charging connector assembly includes a charging connector and a charging cable having an inlet end and an outlet end. Each valve is correspondingly disposed in each coolant supply pipe. The control unit is coupled to the valves and the charging connector assemblies. When the charging connector assemblies are in operation of charging, the control unit opens the valves corresponding to the charging connector assemblies to allow the low-temperature coolant provided by the recirculating cooling apparatus to flow through the coolant supply pipes to cool the charging connectors.Type: ApplicationFiled: November 5, 2021Publication date: July 14, 2022Inventors: Jui-Yuan HSU, Ming-Hsien HSIEH, Kai-Hung HUANG
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Patent number: 11383613Abstract: Embodiments of the present disclosure provide a power distribution system and a method for charging multiple electric vehicles. The power distribution system includes: an alternating-current source, configured to provide a first electric power; an energy storage device, configured to provide a second electric power, the first electric power and the second electric power together constitute a total supply power; a charging module, including multiple charging units, where each of the charging units is electrically coupled to the alternating-current source and the energy storage device through an alternating-current bus, and the charging units are used to charge the electric vehicles; and a power management module, performing a signal transmission with the alternating-current source, the energy storage device and the charging module through a signal bus, and being configured to select a corresponding orderly charging mode according to the total supply power and total required power of the charging module.Type: GrantFiled: November 17, 2020Date of Patent: July 12, 2022Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Chao Yan, Shouzheng Wang, Jui-Yuan Hsu
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Publication number: 20220166161Abstract: A charging coupler has a grip, an electrical connector and a cable holder. The grip has a front opening and a rear opening on two ends thereof The grip has a first half-tube and a second half-tube connected with each other along a longitudinal direction thereof. The first half-tube has a first latch portion and a groove extending along edges thereof to connect the second half-tube. The second half-tube has a second latch portion and a rib extending along edges thereof to connect the first half-tube. The rib is substantially matched with the groove, and a sealant is filled in a gap between the rib and the groove. The first latch portion is latched with the second latch portion to tighten connection of the first half-tube and the second half-tube. The electrical connector is arranged on the front opening, and the cable holder is arranged on the rear opening.Type: ApplicationFiled: July 26, 2021Publication date: May 26, 2022Inventors: Jui-Yuan HSU, Hung-Sheng HSIEH
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Publication number: 20220122835Abstract: Embodiments of the present disclosure generally relate to methods of forming hardmasks. Embodiments described herein enable, e.g., formation of carbon-containing hardmasks having reduced film stress. In an embodiment, a method of processing a substrate is provided. The method includes positioning a substrate in a processing volume of a processing chamber and depositing a diamond-like carbon (DLC) layer on the substrate. After depositing the DLC layer, the film stress is reduced by performing a plasma treatment, wherein the plasma treatment comprises applying a radio frequency (RF) bias power of about 100 W to about 10,000 W.Type: ApplicationFiled: October 21, 2020Publication date: April 21, 2022Inventors: Jui-Yuan HSU, Pramit MANNA, Bhaskar KUMAR, Karthik JANAKIRAMAN
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Publication number: 20220119953Abstract: Embodiments of the present disclosure generally relate to hardmasks and to processes for forming hardmasks by plasma-enhanced chemical vapor deposition (PECVD). In an embodiment, a process for forming a hardmask layer on a substrate is provided. The process includes introducing a substrate to a processing volume of a PECVD chamber, the substrate on a substrate support, the substrate support comprising an electrostatic chuck, and flowing a process gas into the processing volume within the PECVD chamber, the process gas comprising a carbon-containing gas. The process further includes forming, under plasma conditions, an energized process gas from the process gas in the processing volume, electrostatically chucking the substrate to the substrate support, depositing a first carbon-containing layer on the substrate while electrostatically chucking the substrate, and forming the hardmask layer by depositing a second carbon-containing layer on the substrate.Type: ApplicationFiled: October 21, 2020Publication date: April 21, 2022Inventors: Jui-Yuan HSU, Krishna NITTALA, Pramit MANNA, Karthik JANAKIRAMAN
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Publication number: 20220078948Abstract: A charging module for electric vehicle includes a power conversion unit, a heat dissipation unit, and a thermoelectric module. The power conversion unit includes a power conversion module disposed inside a cabinet, and the power conversion unit provides output power. The heat dissipation unit cools the power conversion unit through liquid cooling or air cooling. The thermoelectric module generates electrical energy based on a temperature difference between the power conversion unit and the heat dissipation unit during operation. The electrical energy is supplied to the power conversion unit and/or the heat dissipation unit.Type: ApplicationFiled: February 2, 2021Publication date: March 10, 2022Inventors: Jui-Yuan HSU, Ming-Hsien HSIEH, Kai-Hung HUANG
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Publication number: 20210407791Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the embodiments described herein provide techniques for depositing nitrogen-doped diamond-like carbon films for patterning applications. In one or more embodiments, a method for processing a substrate includes flowing a deposition gas containing a hydrocarbon compound and a nitrogen dopant compound into a processing volume of a process chamber having a substrate positioned on an electrostatic chuck, and generating a plasma at or above the substrate by applying a first RF bias to the electrostatic chuck to deposit a nitrogen-doped diamond-like carbon film on the substrate. The nitrogen-doped diamond-like carbon film has a density of greater than 1.5 g/cc and a compressive stress of about ?20 MPa to less than ?600 MPa.Type: ApplicationFiled: September 28, 2020Publication date: December 30, 2021Inventors: Jui-Yuan HSU, Pramit MANNA, Karthik JANAKIRAMAN
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Publication number: 20210407802Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the embodiments described herein provide methods for producing reduced-stress diamond-like carbon films for patterning applications. In one or more embodiments, a method includes flowing a deposition gas containing a hydrocarbon compound into a processing volume of a process chamber having a substrate positioned on an electrostatic chuck and generating a plasma above the substrate in the processing volume by applying a first RF bias to the electrostatic chuck to deposit a stressed diamond-like carbon film on the substrate. The stressed diamond-like carbon film has a compressive stress of ?500 MPa or greater. The method further includes heating the stressed diamond-like carbon film to produce a reduced-stress diamond-like carbon film during a thermal annealing process. The reduced-stress diamond-like carbon film has a compressive stress of less than ?500 MPa.Type: ApplicationFiled: September 28, 2020Publication date: December 30, 2021Inventors: Jui-Yuan HSU, Pramit MANNA, Karthik JANAKIRAMAN