Abstract: Disclosed are a display panel and a driving method. The display panel includes: a substrate, sub-pixels and a switch module. Each sub-pixel includes a pixel drive circuit and a light-emitting element. The pixel drive circuit includes an initialization transistor and a drive transistor, each including a first electrode, a second electrode, and a gate electrode; the first electrode of the initialization transistor is electrically connected to the gate electrode of the drive transistor. The drive transistor provides a drive current to the light-emitting element, the second electrodes of the initialization transistors of at least two sub-pixels are connected to an output terminal of the same switch module. An input terminal of the switch module is electrically connected to an initialization signal terminal. The switch module transfers an initialization signal to the second electrode of the initialization transistor.

Abstract: Provided are a display panel and a display device. The display panel includes: a substrate and pixel units provided on the substrate, and the pixel units of at least two different colors are adjacently arranged. In a direction facing away from the substrate, one of the pixel units includes a reflective electrode, a light emitting unit and a color resist, and the light emitting unit and the color resist disposed in a same pixel unit have a same color, a vertical projection of a geometric center of the light emitting unit on the substrate is not overlapped with that of a geometric center of the color resist in the same pixel unit on the substrate. A vertical projection of the color resist in the pixel unit on the substrate is overlapped with that of the light emitting unit in a pixel unit closest to the pixel unit on the substrate.

Abstract: Provided are a display panel, a display device and a manufacturing method of a display panel. The display panel includes: a display region including a first display region and a second display region. In the first display region, a surface of a first substrate facing towards a second substrate is provided with a plurality of organic light emitting elements. In the second display region, a surface of the second substrate facing towards the first substrate is provided with a plurality of Micro Light Emitting Diodes (LEDs) and a plurality of second traces. An encapsulation frame is further configured between the first substrate and the second substrate, and the encapsulation frame is disposed in a frame region and surrounds the display region. In the frame region, the surface of the first substrate facing towards the second substrate is provided with a plurality of first traces.

Abstract: Provided are a display panel and a display device. The display panel includes a first display area and a second display area. The first display area is reused as a sensor reserved area. The first display area includes a plurality of first pixel units. The second display area includes a plurality of second pixel units. The plurality of first pixel units include micro light-emitting diode pixel units, and the plurality of second pixel units include organic light-emitting diode pixel units. The first display area at least includes a region in which density of the plurality of first pixel units in the first display area is configured to be gradually decreased along a first direction.

Abstract: A Micro LED transferring method, a Micro LED display panel and a Micro LED display device are provided. The Micro LED display panel includes a substrate, a pixel defining layer including multiple openings, first conducting layer located in the multiple openings, photosensitive conductive bonding layers and Micro LED structures. The photosensitive conductive bonding layer is solidified after receiving light, such that elements adhered on two opposite surfaces of the photosensitive conductive bonding layer are bonded together. Due to the photosensitive conductive bonding layer, a Micro LED is detected during a transferring process rather than after a bonding process, thereby eliminating a step of removing a bonded abnormal Micro LED, thus simplifying the detecting and repairing processes of Micro LEDs.

Abstract: Provided are a display panel, a display device and a manufacturing method. The display panel includes a display area, the display area includes a transparent display region, where the transparent display region includes multiple transparent regions arranged in an array manner and multiple light-emitting regions disposed between adjacent transparent regions; a substrate; and multiple first light-emitting elements located on one side of the substrate and in the multiple light-emitting regions. In the transparent display region, film layers in at least two adjacent transparent regions have different thicknesses, and/or the film layers in the at least two adjacent transparent regions are made of different materials.

Abstract: Provided is a display panel having first and second display regions. The display panel includes: a base; an array portion located on base; and a light-emitting functional portion located on a side of the array portion facing away from base and including AMOLED and PMOLED light-emitting units. The AMOLED light-emitting unit is located in the first display region, the PMOLED light-emitting unit is located in the second display region, and the second display region is surrounded or partially surrounded by the first display region. The PMOLED and AMOLED light-emitting units each include an anode, and the anode of the PMOLED light-emitting unit has an area smaller than that of the AMOLED light-emitting unit; and/or, the display panel further includes a transparent carrier substrate located on a side of the light-emitting functional portion facing away from the base, and the PMOLED light-emitting unit has at least one film layer carried thereby.

Abstract: Provided are a display panel and a display device. The display panel includes: a substrate and pixel units provided on the substrate, and the pixel units of at least two different colors are adjacently arranged. In a direction facing away from the substrate, one of the pixel units includes a reflective electrode, a light emitting unit and a color resist, and the light emitting unit and the color resist disposed in a same pixel unit have a same color, a vertical projection of a geometric center of the light emitting unit on the substrate is not overlapped with that of a geometric center of the color resist in the same pixel unit on the substrate. A vertical projection of the color resist in the pixel unit on the substrate is overlapped with that of the light emitting unit in a pixel unit closest to the pixel unit on the substrate.

Abstract: The present disclosure provides a display panel and a display device, comprising: a flexible base substrate comprising a first flexible substrate, a second flexible substrate, and metal signal lines located between the first flexible substrate and the second flexible substrate; a display unit disposed on the flexible base substrate; a touch unit disposed on a light-exiting side of the display unit and covering the display unit; and a processing chip connected to the flexible base substrate for receiving and feeding back signals from the display unit and/or the touch unit. The metal signal lines are electrically connected to the processing chip and the touch unit transmits a touch signal to the metal signal lines through a conductive adhesive. By transmitting the touch signal to the processing chip through the conductive adhesive, the touch unit and the display unit can share one processing chip.

Abstract: A flexible light emitting diode (LED) display panel and an electronic device are provided. A bonding enhancement structure is arranged in the flexible LED display panel, so that a stress generated by a first electrode structure on a flexible substrate during bending can be reduced, a bonding force between the first electrode structure and the bonding enhancement structure can be enhanced, and thus bonding stability of an LED unit can be improved. The flexible LED display panel is applied in the electronic device, so that the LED unit does not easily peel off, and display effect and service life of the electronic device can be greatly improved.

Abstract: There are provided an array substrate, a method for manufacturing an array substrate, and a display panel. The array substrate includes: a first flexible substrate including a foldable region, gate lines and data lines intersecting with each other located on a surface of the first flexible substrate, and display pixels located in regions defined by the gate lines and the data lines. Each of the display pixels includes a pixel circuit, a pixel electrode electrically connected to the pixel circuit, and a light emitting unit located on a side of the pixel electrode facing away from the first flexible substrate and electrically connected to the pixel electrode. At least in the foldable region, the pixel electrode is arranged on the same layer as a drain, a gate or an active layer of a thin film transistor of the pixel circuit.

Abstract: A Micro LED display substrate, a method for manufacturing the Micro LED display substrate, and a Micro LED display device are provided. In the method, the Micro LED is transferred onto the organic layer of the array substrate, one etching is performed to form through hole on both the protective layer and the array substrate, and then one metal deposition is performed to simultaneously form an electrode of the Micro LED and a structure electrically connecting the graphene layer with the source or drain electrode of the thin film transistor. Compared with the related art in which the electrode of the Micro LED and the structure electrically connecting the graphene layer with the source or drain electrode of the thin film transistor are formed through two etchings and two metal depositions, the method provided by the present disclosure saves the process steps, simplifies the process and reduces the costs.

Abstract: A display panel, a method for manufacturing the display panel, and a display device including the display panel are provided. The display panel includes: a thin film transistor array layer, and a light-emitting function layer at a side of the thin film transistor array layer. The thin film transistor array layer includes a planarization layer, an electrode layer, a first insulation layer, an active layer and a buffer layer. The electrode layer includes at least one first electrode and second electrode, and each first electrode includes a connection portion and an electrode portion which are connected to each other. The light-emitting function layer includes first contact electrodes and light-emitting elements. Heat generated by the light-emitting function layer is conducted to electrode portion of the first electrode through the connection portion of the first electrode and is uniformly distributed on the connection portion and the electrode portion.

Abstract: An array substrate, display panel, display apparatus, and method for manufacturing the array substrate are provided. Array substrate includes pixel driving circuit and peripheral driving circuit. Array substrate further includes a plurality of thin film transistors including first type of thin film transistor electrically connected into peripheral driving circuit for outputting driving signal and second type of thin film transistor connected to peripheral driving circuit for outputting scanning signal. The thin film transistor includes an active layer of oxide semiconductor including at least one sub-layer. Compared with second type of thin film transistor, active layer of first type of thin film transistor has more sub-layers, and thickness of active layer of first type of thin film transistor is larger. Each sub-layer of the active layer of the second type of thin film transistor is in a same layer as the active layer of the first type of thin film transistor.

Abstract: A Micro LED display panel, a method for fabricating the Micro LED display panel and a display device are provided. When the LED chip array is transferred, it may only be required to embed the LED chip array into the adhesive film layer. The LED chip array is bonded to the array substrate through the adhesive film layer. Then, unnecessary portions of the adhesive film layer and unnecessary LED chips are removed. It is not necessary to attach LED chips in the LED chip array one by one to the substrate by soldering, in which case the process of fabricating the Micro LED display panel is simplified, the difficulty in fabricating the Micro LED display panel is reduced, the influence of the high temperature generated by the soldering process on the LED chips is avoided, and damage to the LED chips during the transfer process is avoided.

Abstract: A display panel and a method for manufacturing the display panel are provided. The method includes providing a first substrate, forming a buffer layer including at least one first buffer layer on a first side of the first substrate; forming a LED structure including a first LED structure on a side of the buffer layer facing away from the first substrate, forming a planarization layer covering the LED structure on a side of the LED structure facing away from the buffer layer, forming an electrode structure connected to the LED units on a side of the planarization layer facing away from the LED structure, and forming a control circuit on a side of the electrode structure facing away from the LED structure, where the control circuit is electrically connected to the electrode structure and configured to control operation states of the LED units.

Abstract: An array substrate, display panel, display apparatus, and method for manufacturing the array substrate are provided. Array substrate includes pixel driving circuit and peripheral driving circuit. Array substrate further includes a plurality of thin film transistors including first type of thin film transistor electrically connected into peripheral driving circuit for outputting driving signal and second type of thin film transistor connected to peripheral driving circuit for outputting scanning signal. The thin film transistor includes an active layer of oxide semiconductor including at least one sub-layer. Compared with second type of thin film transistor, active layer of first type of thin film transistor has more sub-layers, and thickness of active layer of first type of thin film transistor is larger. Each sub-layer of the active layer of the second type of thin film transistor is in a same layer as the active layer of the first type of thin film transistor.

Abstract: A Micro LED transferring method, a Micro LED display panel and a Micro LED display device are provided. The Micro LED display panel includes a substrate, a pixel defining layer including multiple openings, first conducting layer located in the multiple openings, photosensitive conductive bonding layers and Micro LED structures. The photosensitive conductive bonding layer is solidified after receiving light, such that elements adhered on two opposite surfaces of the photosensitive conductive bonding layer are bonded together. Due to the photosensitive conductive bonding layer, a Micro LED is detected during a transferring process rather than after a bonding process, thereby eliminating a step of removing a bonded abnormal Micro LED, thus simplifying the detecting and repairing processes of Micro LEDs.

Abstract: A flexible light emitting diode (LED) display panel and an electronic device are provided. A bonding enhancement structure is arranged in the flexible LED display panel, so that a stress generated by a first electrode structure on a flexible substrate during bending can be reduced, a bonding force between the first electrode structure and the bonding enhancement structure can be enhanced, and thus bonding stability of an LED unit can be improved. The flexible LED display panel is applied in the electronic device, so that the LED unit does not easily peel off, and display effect and service life of the electronic device can be greatly improved.

Abstract: There are provided an array substrate, a method for manufacturing an array substrate, and a display panel. The array substrate includes: a first flexible substrate including a foldable region, gate lines and data lines intersecting with each other located on a surface of the first flexible substrate, and display pixels located in regions defined by the gate lines and the data lines. Each of the display pixels includes a pixel circuit, a pixel electrode electrically connected to the pixel circuit, and a light emitting unit located on a side of the pixel electrode facing away from the first flexible substrate and electrically connected to the pixel electrode. At least in the foldable region, the pixel electrode is arranged on the same layer as a drain, a gate or an active layer of a thin film transistor of the pixel circuit.