Abstract: A method for measuring a surface shape of an optical element, wherein the optical element has a main body with a substrate and a reflective surface, and wherein at least one cooling channel for receiving a coolant is formed in the substrate, comprising: a) recording a cooling channel pressure, b) recording a measurement environment pressure, c) determining a pressure difference based on the cooling channel pressure and the measurement environment pressure, d) comparing the pressure difference with a predetermined target pressure difference, e) monitoring for a deviation between the pressure difference and the target pressure difference, wherein, if a deviation greater than a predetermined limit value is detected, the cooling channel pressure is adapted in such a way that the deviation becomes less than or equal to the predetermined limit value, and f) measuring the surface shape if the deviation is less than or equal to the predetermined limit value.

Abstract: An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W m?1 K?1. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm m?1 K?1.

Abstract: An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W m?1 K?1. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm m?1 K?1.

Abstract: An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W m?1 K?1. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm m?1 K?1.

Abstract: Microlithography projection objectives for imaging into an image plane a pattern arranged in an object plane are described with respect to suppressing false light in such projection objectives.

Abstract: An optical element unit including a first optical element module and a sealing arrangement is disclosed. The first optical element module occupies a first module space and includes a first module component of a first component type and an associated second module component of a second component type. The first component type is optical elements and the second component type being different from the first component type. The sealing arrangement separates the first module space into a first space and a second space and substantially prevents, at least in a first direction, the intrusion of substances from one of the first space and the second space into the other one of the first space and the second space. The first module component at least partially contacts the first space and, at least in its area optically used, not contacting the second space. The second module component at least partially contacts the second space.

Abstract: An optical system has a housing with a mount and an opening to a receiving region, the receiving region being located within the housing and including the mount. At least one optical element is inserted into and removed from the receiving region through the opening, and at least one gas supply device provides a flow of gas in the receiving region. An associated method of inserting or removing an optical element into or from a receiving region in a housing is also disclosed.

Abstract: An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W m?1 K?1. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm m?1 K?1.

Abstract: An optical system has a housing with a mount and an opening to a receiving region, the receiving region being located within the housing and including the mount. At least one optical element is inserted into and removed from the receiving region through the opening, and at least one gas supply device provides a flow of gas in the receiving region. An associated method of inserting or removing an optical element into or from a receiving region in a housing is also disclosed.

Abstract: Microlithography projection objectives for imaging into an image plane a pattern arranged in an object plane are described with respect to suppressing false light in such projection objectives.

Abstract: An optical system has a housing with a mount and an opening to a receiving region, the receiving region being located within the housing and including the mount. At least one optical element is inserted into and removed from the receiving region through the opening, and at least one gas supply device provides a flow of gas in the receiving region. An associated method of inserting or removing an optical element into or from a receiving region in a housing is also disclosed.

Abstract: An optical system has a housing with a mount and an opening to a receiving region, the receiving region being located within the housing and including the mount. At least one optical element is inserted into and removed from the receiving region through the opening, and at least one gas supply device provides a flow of gas in the receiving region. An associated method of inserting or removing an optical element into or from a receiving region in a housing is also disclosed.

Abstract: Microlithography projection objectives for imaging into an image plane a pattern arranged in an object plane are described with respect to suppressing false light in such projection objectives.

Abstract: An optical element unit including a first optical element module and a sealing arrangement is disclosed. The first optical element module occupies a first module space and includes a first module component of a first component type and an associated second module component of a second component type. The first component type is optical elements and the second component type being different from the first component type. The sealing arrangement separates the first module space into a first space and a second space and substantially prevents, at least in a first direction, the intrusion of substances from one of the first space and the second space into the other one of the first space and the second space. The first module component at least partially contacts the first space and, at least in its area optically used, not contacting the second space. The second module component at least partially contacts the second space.

Abstract: An optical element unit includes a first optical element module and a sealing arrangement. The first optical element module occupies a first module space and includes a first module component of a first component type and an associated second module component of a second component type. The first component type is optical elements and the second component type being different from the first component type. The sealing arrangement separates the first module space into a first space and a second space and substantially pre-vents, at least in a first direction, the intrusion of substances from one of the first space and the second space into the other one of the first space and the second space. The first module component at least partially contacts the first space and, at least in its area optically used, not contacting the second space. The second module component at least partially contacts the second space.

Abstract: An optical system has a housing with a mount and an opening to a receiving region, the receiving region being located within the housing and including the mount. At least one optical element is inserted into and removed from the receiving region through the opening, and at least one gas supply device provides a flow of gas in the receiving region. An associated method of inserting or removing an optical element into or from a receiving region in a housing is also disclosed.

Abstract: An optical system has a housing with a mount and an opening to a receiving region, the receiving region being located within the housing and including the mount. At least one optical element is inserted into and removed from the receiving region through the opening, and at least one gas supply device provides a flow of gas in the receiving region. Alternatively or in addition, the optical system has a gas lock that receives the optical element. The opening interconnects the gas lock and the receiving region of the housing, and accommodates passage of the optical element between the gas lock and the receiving region.

Abstract: Microlithography projection objectives for imaging into an image plane a pattern arranged in an object plane are described with respect to suppressing false light in such projection objectives.

Abstract: For the production of mirrors for EUV lithography, substrates are suggested having a mean relative thermal longitudinal expansion of no more than 10 ppb across a temperature difference ?T of 15° C. and a zero-crossing temperature in the range between 20° C. and 40° C. For this purpose, at least one first and one second material having low thermal expansion coefficients and opposite gradients of the relative thermal expansion as a function of temperature are selected and a substrate is produced by mixing and bonding these materials.

Abstract: Microlithography projection objectives for imaging into an image plane a pattern arranged in an object plane are described with respect to suppressing false light in such projection objectives.