Abstract: Disclosed is a lens module, especially a projection lens for semiconductor lithography, comprising at least one replaceable optical element that is disposed in a lens housing. At least one gas exchange device is positioned in an area of the replaceable optical element in such a way that a receiving zone for the replaceable optical element can be flushed when the optical element is replaced.

Abstract: In a projection exposure method, primary radiation having a center wavelength ? is generated and guided through an illumination system along an illumination path and through a projection system along a projection path. The center wavelength is varied within a wavelength variation range ?? having a lower limit ?MIN?? and an upper limit ?MAX??. A specific absorption coefficient k(?) of at least one gaseous absorbent species selected from the group consisting of oxygen (O2), ozone (O3) and water vapor (H2O) present in at least one gas-filled space along at least one of the illumination path and the projection path varies between a minimum absorption coefficient kMIN and a maximum absorption coefficient kMAX within the wavelength variation range such that an absorption ratio (kMAX/kMIN) exceeds 10.

Abstract: Disclosed is a lens module, especially a projection lens for semiconductor lithography, comprising at least one replaceable optical element that is disposed in a lens housing. At least one gas exchange device is positioned in an area of the replaceable optical element in such a way that a receiving zone for the replaceable optical element can be flushed when the optical element is replaced.

Abstract: Disclosed is a lens module, especially a projection lens for semiconductor lithography, comprising at least one replaceable optical element that is disposed in a lens housing. At least one gas exchange device is positioned in an area of the replaceable optical element in such a way that a receiving zone for the replaceable optical element can be flushed when the optical element is replaced.

Abstract: A cleaning module for an EUV lithography device with a supply (206) for molecular hydrogen, a heating filament (210) and a line (212) for atomic and/or molecular hydrogen. The line (212) has at least one bend with a bending angle of less than 120 degrees, and has a material on its inner surface which has a low recombination rate for atomic hydrogen. The supply (206) is of flared shape at its end, which faces the heating filament (210). A gentler cleaning of optical elements is achieved with such a cleaning module, or also by exciting a cleaning gas with a cold cathode or a plasma, or by filtering out charged particles via of electrical and/or magnetic fields.

Abstract: Described is an examination system (1) for locating contamination (2) on an optical element (4) installed in an optical system (5), which examination system (1) comprises: a spatially resolving detector (6); imaging optics (7) that magnify in particular at a magnification of between 2 times and 100 times, for magnified imaging of a surface sub-region (3a) of the optical element (4) on the spatially resolving detector (6); as well as a movement mechanism (12), in particular a motorized movement mechanism (12), for displacing the imaging optics (7) together with the detector (6) relative to the surface (3) of the optical element (4) such that any desired surface sub-region of the surface (3) can be imaged at magnification.

Abstract: In a projection exposure method, primary radiation having a center wavelength ? is generated and guided through an illumination system along an illumination path and through a projection system along a projection path. The center wavelength is varied within a wavelength variation range ?? having a lower limit ?MIN?? and an upper limit ?MAX??. A specific absorption coefficient k(?) of at least one gaseous absorbent species selected from the group consisting of oxygen (O2), ozone (O3) and water vapor (H2O) present in at least one gas-filled space along at least one of the illumination path and the projection path varies between a minimum absorption coefficient kMIN and a maximum absorption coefficient kMAX within the wavelength variation range such that an absorption ratio (kMAX/kMIN) exceeds 10.

Abstract: An optical element unit is provided comprising an optical element group; a housing receiving said optical element group and having an inner housing part and an exit end; and a purge unit connected to said housing and providing a purge medium to said inner housing part. The optical element group comprises an ultimate optical element. The ultimate optical element is located at the exit end of housing and separates the inner housing part from an environment external to the housing. The ultimate optical element and the housing define a sealing gap. The purge unit provides purge medium to the sealing gap to prevent intrusion of contaminants into the inner housing part.

Abstract: Microlithography projection objectives for imaging into an image plane a pattern arranged in an object plane are described with respect to suppressing false light in such projection objectives.

Abstract: An apparatus for scattered light inspection of optical elements, having a light-generating unit (2) for generating light that is irradiated onto the optical element (9) respectively to be inspected, and a detector (4) for detecting scattered light (14) that is emitted by the optical element during irradiation. At least a portion of the components (2 to 8, 12) of the inspection apparatus are arranged on or in a housing/holding unit (1) that is dimensioned such that it can be held by a reticle holder of a lithography exposure machine, or all the components of the inspection apparatus are arranged on or in a common housing/holding unit that is portable and/or mobile. The apparatus may be used, e.g., for scattered light inspection of the surface of a lens, closest to the field, of a projection objective of a microlithography projection exposure machine.

Abstract: An optical element unit including a first optical element module and a sealing arrangement is disclosed. The first optical element module occupies a first module space and includes a first module component of a first component type and an associated second module component of a second component type. The first component type is optical elements and the second component type being different from the first component type. The sealing arrangement separates the first module space into a first space and a second space and substantially prevents, at least in a first direction, the intrusion of substances from one of the first space and the second space into the other one of the first space and the second space. The first module component at least partially contacts the first space and, at least in its area optically used, not contacting the second space. The second module component at least partially contacts the second space.

Abstract: An optical element unit is provided comprising an optical element group; a housing receiving said optical element group and having an inner housing part and an exit end; and a purge unit connected to said housing and providing a purge medium to said inner housing part. The optical element group comprises an ultimate optical element. The ultimate optical element is located at the exit end of housing and separates the inner housing part from an environment external to the housing. The ultimate optical element and the housing define a sealing gap. The purge unit provides purge medium to the sealing gap to prevent intrusion of contaminants into the inner housing part.

Abstract: Disclosed is a lens module, especially a projection lens for semiconductor lithography, comprising at least one replaceable optical element that is disposed in a lens housing. At least one gas exchange device is positioned in an area of the replaceable optical element in such a way that a receiving zone for the replaceable optical element can be flushed when the optical element is replaced.

Abstract: Described is an examination system (1) for locating contamination (2) on an optical element (4) installed in an optical system (5), which examination system (1) comprises: a spatially resolving detector (6); imaging optics (7) that magnify in particular at a magnification of between 2 times and 100 times, for magnified imaging of a surface sub-region (3a) of the optical element (4) on the spatially resolving detector (6); as well as a movement mechanism (12), in particular a motorised movement mechanism (12), for displacing the imaging optics (7) together with the detector (6) relative to the surface (3) of the optical element (4) such that any desired surface sub-region of the surface (3) can be imaged at magnification.

Abstract: An apparatus for scattered light inspection of optical elements, having a light-generating unit (2) for generating light that is irradiated onto the optical element (9) respectively to be inspected, and a detector (4) for detecting scattered light (14) that is emitted by the optical element during irradiation. At least a portion of the components (2 to 8, 12) of the inspection apparatus are arranged on or in a housing/holding unit (1) that is dimensioned such that it can be held by a reticule holder of a lithography exposure machine, or all the components of the inspection apparatus are arranged on or in a common housing/holding unit that is portable and/or mobile. The apparatus may be used, e.g., for scattered light inspection of the surface of a lens, closest to the field, of a projection objective of a microlithography projection exposure machine.