Abstract: A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (30), applying (85) a medium such as flux or solder on a second substrate (42) having a substantially different coefficient of thermal expansion than the first substrate, placing (86) the cladded substrate on the second substrate, and reflowing (88) the cladded substrate and the second substrate such that thermal stress caused by the substantially different coefficient of thermal expansion between the first and second substrates is limited to when a temperature approximately reaches below a solidus temperature of the solder on the first substrate.

Abstract: A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (30), applying (85) a medium such as flux or solder on a second substrate (42) having a substantially different coefficient of thermal expansion than the first substrate, placing (86) the cladded substrate on the second substrate, and reflowing (88) the cladded substrate and the second substrate such that thermal stress caused by the substantially different coefficient of thermal expansion between the first and second substrates is limited to when a temperature approximately reaches below a solidus temperature of the solder on the first substrate.

Abstract: A module (20) can include a first substrate (12) comprised of a first material, at least a second substrate (22) comprised of at least a second material, selectively applied solder (14) of a first composition residing between the first substrate and at least the second substrate, and selectively applied solder (16) of at least a second composition residing between the first substrate and at least the second substrate. Preferably, no crack will exist in the module as a result of a reflow process of the solder due to the CTE mismatch between the first and second substrates. The different selectively applied solder compositions can have different melting points and can be solder balls, solder paste, solder preform or any other known form of solder.

Abstract: An electrical interface (210) for an electronic device (200) includes an integral connector portion (215). The connector portion (215) has protected connector contacts (220) which provide an electrical signal path to the internal circuitry of the device. The electrical interface (210) has a contact surface (112) disposed proximate to the connector portion (215) and interface contacts (117) electrically decoupled from the connector contacts (220). The contact surface (112) is responsive to a mechanical force, to electrically couple at least one of the interface contacts (117) to at least one of the connector contacts (220).

Abstract: A method for attaching a shield (102) to a an electronic assembly (116) having a heat sink (110) includes applying solder on the inner walls (104) of the shield (102). Next, the shield (102) is placed over the electronic assembly (116) such that the electronic assembly (116) is covered by the shield (102) and the shield (102) is in mechanical contact with the heat sink (110). Then, the shield (102) and heat sink (110) are heated so that the solder on the inner walls (104) of shield (102) flows and solders the shield (102) to the heat sink (110).

Abstract: A method for fabricating an in-mold graphics surface (16). A layer of an etchable material(12) is molded on a contrasting surface (13). The layer is then etched to expose the contrasting surface and produce the in-mold graphics surface. In another embodiment, a layer of hardcoat material (11) is molded over the etchable layer. The etching is accomplished by using a laser beam to selectively etch the etchable layer, while not etching the contrasting surface. The hardcoat layer (11), the etchable layer (12), and the contrasting surface (13) can be molded to a larger part (14) during an injection molding process. The graphic desing is later etched in the part to produce a customized design.

Abstract: A detachable self-contained door cover assembly (105) includes a housing (101) with an integral socket (160), a hinge member (140) having a rotation track (153), and a door cover (120) having an integral hinge shaft (123). The hinge shaft (123) engages the rotation track (153) to rotatably couple the door cover (120) to the hinge member (140) about an axis of rotation extending through the hinge shaft (123) and the rotation track (153). The hinge member (140) is attached to the socket (160), and is detachable when a force exceeding a threshold value is applied to the hinge member (140), thereby disengaging the hinge member (140) from the socket (160) without substantial damage to the hinge member (140) or to the housing (101).

Abstract: A backlighted display system includes a liquid crystal display, a flat light guide behind the display, and light emitting diodes (LED's). The light guide is a molded slab of clear polycarbonate material with two planes depressed into its rear surface. Four segmented bordering surfaces are approximately arcuate in shape. The depressed planes, the segmented bordering surfaces, and the rear surface are coated with a reflective white paint. LED holders are integrally molded with the light guide. A central portion of the front surface is optionally textured. The display system provides thin construction with even light distribution across the width of the display, low power consumption, and good outdoor visibility at dusk or dawn.