Abstract: A method for determining data related to a microbiome of a human includes isothermally amplifying polynucleotides of at least N different microorganisms present in a sample obtained from the human, wherein N>1, determining, based on the amplified polynucleotides, microbiome data comprising data indicative of at least one of a presence and an abundance of each of the N microorganisms, and determining, based on the microbiome data and prior data related to the N microorganisms, data related to a condition of the animal.

Abstract: The present invention is directed to a coated substrate, comprising: an antitarnish layer deposited on a substrate in an amount effective to prevent tarnishing of said coated substrate; and an outer layer deposited onto said antitarnish layer, said outer layer comprising tin or tin alloys having at least 50% by weight tin. The present invention is also directed to coated substrates having a concentration gradient of antitarnish agent diffused into the coating, as well as methods of forming such coated substrates.

Abstract: The present invention is directed to a water-based adhesive composition, comprising an admixture of: (A) about 5 to about 80 wt % of an aqueous polyester polyurethane dispersion; and (B) about 95 to about 20 wt % of an aqueous aliphatic polyurethane dispersion. The present invention is also directed to a method of adhering a workpiece or adherent to a substrate using the above water-based adhesive composition.

Abstract: The present invention is directed to a water-based adhesive composition, comprising an admixture of: (A) about 5 to about 80 wt % of an aqueous polyester polyurethane dispersion; and (B) about 95 to about 20 wt % of an aqueous aliphatic polyurethane dispersion. The present invention is also directed to a method of adhering a workpiece or adherent to a substrate using the above water-based adhesive composition.

Abstract: An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the formation of a copper/tin intermetallic and the resultant depletion of the free, unreacted, tin utilized as an oxidation and corrosion barrier, a barrier is interposed between the substrate and the coating. In a first embodiment, the barrier is formed from multiple constituent layers, at least one of which is copper. The thickness ("y") of the copper layer is dependent on the anticipated service temperature and satisfies the equation y=(-1.52+0.0871x+0.00859 t).+-.50% where t=anticipated time at the service temperature, x=anticipated service temperature (Celsius), and y=the thickness of the copper layer in microinches. In a second embodiment, the barrier layer is formed from one or more constituent layers, at least one of which is iron or iron base.

Abstract: An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the diffusion of copper from the substrate into the coating layer and the consequential formation of a brittle tin/copper intermetallic, a barrier layer is interposed between the substrate and the coating layer. This barrier layer contains from 20% to 40%, by weight, of nickel and is preferably predominantly comprised of copper. In one embodiment, an intermetallic layer selected from the group (Cu--Ni).sub.3 Sn, (Cu--Ni).sub.6 Sn.sub.5, Cu.sub.3 Sn, Cu.sub.6 Sn.sub.5 is disposed between the barrier layer and the tin base coating layer.

Abstract: An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the diffusion of copper from the substrate into the coating layer and the consequential formation of a brittle tin/copper intermetallic, a barrier layer is interposed between the substrate and the coating layer. This barrier layer contains from 10% to 70%, by weight, of nickel and is preferably predominantly comprised of copper. In one embodiment, an intermetallic layer selected from the group (Cu--Ni).sub.3 Sn, (Cu--Ni).sub.6 Sn.sub.5, Cu.sub.3 Sn, Cu.sub.6 Sn.sub.5 is disposed between the barrier layer and the tin base coating layer.

Abstract: There is provided a machinable .alpha.+.beta. brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100.degree. C.-350.degree. C. without a decrease in machinability due to phosphide formation. In preferred embodiments, the alloy further contains a tin addition for enhanced corrosion resistance. The combination of tin and phosphorous provides enhanced corrosion resistance to the alloy than could be predicted from either addition alone.

Abstract: A palladium alloy of the form Pd.sub.x M.sub.y M'.sub.z where M is at least one element selected from the group consisting of silicon, iron, nickel, copper, chromium, cobalt, boron and aluminum and M' is at least one element selected from the group consisting of titanium, vanadium, chromium, zirconium, niobium, molybdenum, hafnium, tantalum and tungsten is provided. The alloys exhibit oxidation resistance and low electrical contact resistance and are particularly suited for electrical applications such as coatings for electrical contacts or connectors. In a preferred embodiment, the alloy is palladium/niobium containing from about 5 to about 10 atomic percent niobium.

Abstract: A method for depositing a composite coating on a substrate is provided. The coating contains a mixture of ductile metal particles and a uniformly dispersed polymer particles. The polymer is present in a concentration effective to reduce frictional forces. The coating mixture is compacted such as by isostatic pressing, formed into strips and then clad to the substrate. One preferred coating contains 0.5 weight percent polytetrafluoro-ethylene in a tin matrix.

Abstract: A palladium alloy of the form PdNbM where M is at least one element selected from the group consisting of silicon, iron, nickel, copper, cobalt, boron and aluminum is provided. The alloys exhibit oxidation resistance and electrical contact resistance and are particularly suited for electrical applications such as coatings for electrical contacts or connectors. In a preferred embodiment, the alloy contains from about 5 to about 10 atomic percent niobium.

Abstract: A composite leadframe for electronic packages is provided. A polymer layer coats a portion of the leadframe. The polymer layer increases the adhesive bond between the leadframe and a molding resin. Water vapor does not accumulate under the leads and die attach paddle minimizing the popcorn effect.

Abstract: The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primar housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between components to maintain electrical isolation. The housings are characterized by high ductility to resist fracture during assembly or handling. In certain embodiments, one or both lead wires are removed to reduce the potential for lead wire breakage or separation.

Abstract: A frangible projectile made from powdered metals comprising a body of either iron and carbon, or of iron and alumina. The powdered metals are compacted, sintered, and cooled.

Abstract: The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primer housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between components to maintain electrical isolation. The housings are characterized by high ductility to resist fracture during assembly or handling. In certain embodiments, one or both lead wires are removed to reduce the potential for lead wire breakage or separation.

Abstract: The present invention relates to copper-iron-nickel alloys having utility in electronic applications because of their low coefficients of expansion and high thermal conductivities. Alloys in accordance with the present invention consist essentially of from 10% to about 80% copper and the balance iron plus nickel with the ratio of iron to nickel being in the range of from about 1.5:1 to about 2.0:1. Preferred alloys have an iron to nickel ratio in the range of from about 1.6:1 to about 1.9:1. The process includes casting the alloy and treating the iron-nickel phase of alloy to minimize its surface volume. The treating step may comprise speroidizing the iron-nickel phase or applying an electromagnetic stirring force to the alloy during the casting step.

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.

Abstract: An electrode is provided which is formed by the metallurgical bonding technique of diffusion bonding the backplate, conductor elements and electrode surface together, then applying the catalytic coating to the electrode surface, and bonding the backplate to an electrical conducting plate.

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.