Abstract: The present invention relates to copper-iron-nickel composite materials having utility in electronic applications because of their low coefficients of expansion and high thermal conductivities. Composite materials in accordance with the present invention consist essentially of about 10% to 80% copper and the balance iron plus nickel with the ratio of iron to nickel being in the range of from about 1.5:1 to about 2.0:1. Preferred composite materials have an iron to nickel ratio in the range of from about 1.6:1 to about 1.9:1.

Abstract: The present invention relates to a process for forming improved bonds between components of electrical or electronic devices. The process of the present invention preferably comprises annealing a metallic substrate to form a substantially uniform, substantially continuous oxide layer on a surface of the substrate, exposing the oxidized substrate to a reducing atmosphere so as to form an irregular surface on the substrate, and bonding another component to the irregular surface.

Abstract: The present invention relates to an addition to tin coating solutions for inhibiting the growth of tin whiskers. The addition comprises a concentration of a metal salt selected from the group consisting of palladium salt, silver salt, nickel salt, iron salt, cadmium salt, platinum salt, gold salt, indium salt, ruthenium salt and cobalt salt. In a preferred embodiment, the metal salt addition is either a palladium salt such as palladium chloride or a silver salt such as silver sulfate.

Abstract: An improved thermode for bonding interconnect tape to at least one bonding site on an electronic device is disclosed. The thermode includes a component for controlling deflection of the interconnect tape at a position outside of said bonding site whereby thermal stresses generated in the interconnect tape while bonding are substantially reduced.

Abstract: An electrolytic cell is provided with electrodes which are inserted within electrode frames with internal flow conduits and which are formed by metallurgical bonding, and the use of adhesives and an electrical resistance lowering conductive compound between contact surfaces.

Abstract: The present invention relates to a thermosonic wire bonding technique for forming high quality wire interconnections in semiconductor devices. The technique includes using palladium or palladium alloy lead wires to form the wire interconnections between the components of a semiconductor device. The technique also includes forming a protective atmosphere about the palladium lead wire during a portion of the bonding process and controlling the stage temperatures used during the bonding process.

Abstract: The process of forming a composite with an alloy having an alloy component of about 0.5 to 12% aluminum and a matrix selected from a material of the group consisting of copper, iron or nickel. The alloy is heated in an oxygen-rich atmosphere to form a material oxide-rich layer on a surface of the alloy. The alloy is then heated in a reducing atmosphere to reduce the material oxide-rich layer to form an aluminum oxide on the surface of the alloy and a material-rich layer on the aluminum oxide layer.

Abstract: A method of producing a strip adapted for use as an electrical contact terminal comprising the following steps. First, a strip of relatively flexible substrate material is provided. Then, a substantially continuous strip of powdered metal or metal alloy is deposited onto a surface of the strip to produce the electrical contact terminal.

Abstract: A composite material having improved bond strength and a substantially smooth external surface comprises a deoxidized copper alloy core material and a copper-aluminum-silicon clad material. The composite is formed by rolling together the core and clad, preferably in an unheated condition, in a single pass with a reduction of about 50% to 75% to form a metallurgical bond between the core and clad and thereafter enhancing the bond strength by heating the bonded core and cladding to a temperature in the range of about 200.degree. C. to about 750.degree. C. for a time period of about 5 minutes to about 24 hours.

Abstract: The process of forming a composite with an alloy having an alloy component of about 0.5 to 12% aluminum and a matrix selected from a material of the group consisting of copper, iron or nickel. The alloy is heated in an oxygen-rich atmosphere to form a material oxide-rich layer on a surface of the alloy. The alloy is then heated in a reducing atmosphere to reduce the material oxide-rich layer to form an aluminum oxide on the surface of the alloy and a material-rich layer on the aluminum oxide layer.

Abstract: Copper alloys are disclosed which may be bonded to aluminum containing members with reduced formation of undesirable copper-aluminum intermetallic compounds. The copper alloys consist essentially of about 15% to about 30% nickel and the balance essentially copper. The nickel addition in the alloys suppresses the nucleation rate and the subsequent growth rate of copper-aluminum intermetallic compounds. The copper alloys of the instant invention have particular utility in integrated circuit assemblies as lead frames, lead wires and beam lead tapes.

Abstract: A composite structure having improved solderability shelf life and contact resistance is formed by coating a copper alloy substrate material with a tin-containing material. The copper alloy substrate material consists essentially of about 15% to about 30% nickel and the balance essentially copper. The copper alloy may further include up to about 25% zinc. The nickel in the alloy retards the growth of copper-tin and/or copper-zinc-tin intermetallic compounds and the diffusion of the copper through the coating. The coating may be formed from tin or tin alloys including tin solders, e.g. 60% Tin-40% lead solder.

Abstract: A composite material having improved bond strength and a substantially smooth external surface comprises a deoxidized copper alloy core material and a copper-aluminum-silicon clad material. The composite is formed by rolling together the core and clad, preferably in an unheated condition, in a single pass with a reduction of about 50% to 75% to form a metallurgical bond between the core and clad and thereafter enhancing the bond strength by heating the bonded core and cladding to a temperature in the range of about 200.degree. C. to about 750.degree. C. for a time period of about 5 minutes to about 24 hours.

Abstract: Novel and advantageous metal laminates particularly useful in making coins comprising a copper core and a cladding metallurgically bonded thereto of a copper base alloy containing from 2 to 3.5% aluminum, from 1 to 2.5% silicon and the balance essentially copper. Disclosure also teaches a method of preparing copper laminates by providing a copper core in strip form in the hard temper and a copper alloy cladding fully annealed in strip form, wherein the components are rolled together in a single pass with a reduction of from 50 to 75% to provide the metallurgically bonded laminate.

Abstract: Novel and advantageous metal laminates particularly useful in making coins comprising a copper core and a cladding metallurgically bonded thereto of a copper base alloy containing from 2 to 3.5% aluminum, from 1 to 2.5% silicon and the balance essentially copper. Disclosure also teaches a method of preparing copper laminates by providing a copper core in strip form in the hard temper and a copper alloy cladding fully annealed in strip form, wherein the components are rolled together in a single pass with a reduction of from 50 to 75% to provide the metallurgically bonded laminate.

Abstract: A composite aluminum base alloy foil is described which is particularly useful as foil material in electrical capacitors. The composite is based on the use of a relatively lower purity, inexpensive core material clad on both sides with a relatively higher purity, more expensive cladding material.

Abstract: A particular aluminum base alloy system which utilizes gallium as an alloying element is described and is particularly useful as foil material in electrical capacitors. The addition of the small amount of gallium to the alloy system provides foil produced from the alloy with a significant increase in capacitance properties. A particular processing scheme for producing foil from this alloy system is also disclosed.

Abstract: Improved aluminum alloys are disclosed which are particularly useful as foil material in electrical capacitors. These alloys may contain either titanium in an aluminum base or a titanium and boron mixture in an aluminum base. The particular combination of titanium and boron presents a greater increase in capacitance in foil formed from this alloy than the increase in capacitance due to titanium or boron alone. Particular processing of such alloys is also disclosed.

Abstract: High strength extrudable and readily weldable aluminum base alloys are prepared comprising 0.9-1.5% magnesium, 0.4-0.8% silicon, and 0.9-1.5% copper, which may also include optional elements such as manganese, iron, and chromium, wherein the silicon content must not exceed the sum of 0.58 .times. magnesium content plus 0.25 .times. the manganese plus iron contents and the copper content must not exceed the sum of magnesium plus silicon contents. Such alloys display improved retention of strength properties after being subjected to welding conditions.