Abstract: A method for manufacturing a semiconductor device where a passive element, such as, an inductor, is floating over a substrate, where an integrated circuit is formed, such that the overall area of the semiconductor device may be highly reduced. According to the present invention, a first metal layer is formed on the substrate, a first masking layer is formed on a portion of the first metal layer, a second metal layer is formed on other portion of the first metal layer on which the first masking layer is not formed, and a second masking layer is formed on the first masking layer and the second metal layer. Then, the first masking layer and a portion of the second masking layer which includes a portion which covers the first masking layer is removed, a third metal layer is formed on portions of the first and second metal layers which are exposed by the step of removing the first masking layer and the portion of the second masking layer.

Abstract: Disclosed are a remote pressure-monitoring device and a preparing method thereof. The device comprises a metal electrode on a glass substrate, a capacitive sensor made of a silicon diaphragm, and an electroplated inductor electrically connected, in parallel, with the sensor. The glass substrate and the silicon are electrically bonded to form an LC resonator. For the fabrication of the device, first, a metal electrode which plays a role as a lower electrode for a capacitive pressure sensor is deposited on the glass substrate with the same coefficient of thermal expansion as that of silicon. An inductor is formed at a thickness by copper electroplating, surrounding the metal electrode at a predetermined distance. A silicon substrate is anisotropically etched to form a space for enveloping the metal electrode at a central area and to form a groove around the space.

Abstract: Disclosed is an electrostatic actuator. A multi-layered auxiliary electrode is further arranged between main electrode and actuating body, and positive charge or negative charge is applied to main electrode, respective auxiliary electrodes, and actuating body such that electrostatic attractive force is generated between auxiliary electrodes adjacent to the main electrode, between adjacent auxiliary electrodes, and between auxiliary electrodes adjacent to the actuating body. According to the invention, distance between the induced charges is shortened, so that electrostatic attractive force therebetween increases, thereby capable of maintaining an actuating range equal to or larger than the conventional electrostatic actuator. The electrostatic actuator according to the present invention can be applied to various MEMS devices, such as an optical switch in which a mirror is formed in the actuator, a radio frequency (RF) switch, or a variable electrostatic capacitor, or the like.

Abstract: A high-Q micromechanical device such as a capacitor and method of tuning same by electrostatically moving the capacitor's dielectric are provided. The high-Q, tunable, micromechanical capacitor is realized using an IC-compatible, electroplated-metal, surface-micromachining technology and demonstrates quality (Q−) factors in excess of 290—the highest reported to date for on-chip tunable capacitors at frequencies near 1 GHz. When combined with on-chip (or off-chip) high-Q inductors, these tunable capacitors are expected to be useful for not only low-phase noise integrated VCO applications, but also for tunable, low-loss, RF filters and tunable matching networks, both key functions capable of enhancing the multi-band programmability of wireless communication handsets.

Abstract: A high-Q micromechanical device such as a capacitor and method of tuning same by electrostatically moving the capacitor's dielectric are provided. The high-Q, tunable, micromechanical capacitor is realized using an IC-compatible, electroplated-metal, surface-micromachining technology and demonstrates quality (Q−) factors in excess of 290—the highest reported to date for on-chip tunable capacitors at frequencies near 1 GHz. When combined with on-chip (or off-chip) high-Q inductors, these tunable capacitors are expected to be useful for not only low-phase noise integrated VCO applications, but also for tunable, low-loss, RF filters and tunable matching networks, both key functions capable of enhancing the multi-band programmability of wireless communication handsets.

Abstract: Disclosed is an ink jet print head and a method of producing the same, the ink jet print head including a plurality of ink ejecting orifices which are formed with a desired shape and a uniform size by only once using metal plating technique, having an excellent productivity and a low manufacturing cost. According to a first embodiment of the present invention, in the steps for forming an improved metal barrier layer, which is comprised of the conventional barrier layer and the conventional nozzle plate combined together, the metal barrier layer can be formed on a wetting layer by using electrolytic plating or electroless plating of Ni. As a result, an upper surface of a first photoresist mold is completely covered with the overflowing Ni. Further, an upper portion of a second photoresist mold is partially covered with the overplating Ni and is partially opened at a proper size and a desired shape. Thereby, an ink ejecting orifice is created at the upper portion of the second photoresist mold.

Abstract: Disclosed are a remote pressure-monitoring device and a preparing method thereof. The device comprises a metal electrode on a glass substrate, a capacitive sensor made of a silicon diaphragm, and an electroplated inductor electrically connected, in parallel, with the sensor. The glass substrate and the silicon are electrically bonded to form an LC resonator. For the fabrication of the device, first, a metal electrode which plays a role as a lower electrode for a capacitive pressure sensor is deposited on the glass substrate with the same coefficient of thermal expansion as that of silicon. An inductor is formed at a thickness by copper electroplating, surrounding the metal electrode at a predetermined distance. A silicon substrate is anisotropically etched to form a space for enveloping the metal electrode at a central area and to form a groove around the space.

Abstract: Disclosed are a remote pressure-monitoring device and a preparing method thereof. The device comprises a metal electrode on a glass substrate, a capacitive sensor made of a silicon diaphragm, and an electroplated inductor electrically connected, in parallel, with the sensor. The glass substrate and the silicon are electrically bonded to form an LC resonator. For the fabrication of the device, first, a metal electrode which plays a role as a lower electrode for a capacitive pressure sensor is deposited on the glass substrate with the same coefficient of thermal expansion as that of silicon. An inductor is formed at a thickness by copper electroplating, surrounding the metal electrode at a predetermined distance. A silicon substrate is anisotropically etched to form a space for enveloping the metal electrode at a central area and to form a groove around the space.

Abstract: A heat generating type ink-jet print head including an ink supply passage for receiving an ink from an ink container, a micro chamber for storing the ink and nozzles, all being directly formed on a substrate, and a method for fabricating the ink-jet print head using an electrolytic polishing process, and a method for fabricating the ink-jet print head. The ink-jet print head is fabricated using an electrolytic polishing process, thereby achieving an accurate and inexpensive fabrication.

Abstract: A heat generating type ink-jet print head including an ink supply passage for receiving an ink from an ink container, a micro chamber for storing the ink and nozzles, all being directly formed on a substrate, and a method for fabricating the ink-jet print head using an electrolytic polishing process, and a method for fabricating the ink-jet print head. The ink-jet print head is fabricated using an electrolytic polishing process, thereby achieving an accurate and inexpensive fabrication.