Patents by Inventor Jun Chen

Jun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11800677
    Abstract: A power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: October 24, 2023
    Assignee: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Hao Wu, Jun Chen, Chunxia Xu, Xiaowei Hui
  • Publication number: 20230335954
    Abstract: A connector includes an end protector and lead frames. Each lead frame includes a plurality of connection terminal groups and a shield layer. Each connection terminal group includes two connection terminals configured to transmit a signal. Each connection terminal has a first connection end that cooperates with insertion of a circuit board. The shield layer is configured to electromagnetically isolate connection terminal groups in adjacent lead frames. The end protector includes a conductive structure that is located between the first connection ends of the two connection terminals in each connection terminal group. In the foregoing technical solution, with the conductive structure that is on the end protector, a transmission path of a loop signal corresponding to a differential signal transmitted by each connection terminal group is improved, crosstalk between loop signals corresponding to different connection terminal groups is reduced, and communication effect of the connector is improved.
    Type: Application
    Filed: June 21, 2023
    Publication date: October 19, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Shuang QIU, Jun CHEN, Wang XIONG
  • Patent number: 11791580
    Abstract: A plug connector for mating with a receptacle connector which is provided with a groove at an upper surface thereof includes: an insulating body; and a locking elastic piece on the insulating body, wherein the insulating body includes a main body and a mating portion extending forward from the main body, a bottom of the mating portion protrudes downward to form a sinking portion, and the sinking portion is located entirely above the groove.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: October 17, 2023
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Yang-Tsun Hsu, Jun Chen, Fan-Bo Meng, Cai-Yuan Wang
  • Patent number: 11791265
    Abstract: Embodiments of methods and structures for forming a 3D integrated wiring structure are disclosed. The method can include forming an insulating layer on a front side of a first substrate; forming a semiconductor layer on a front side of the insulating layer; patterning the semiconductor layer to expose at least a portion of a surface of the insulating layer; forming a plurality of semiconductor structures over the front side of the first substrate, wherein the semiconductor structures include a plurality of conductive contacts and a first conductive layer; joining a second substrate with the semiconductor structures; performing a thinning process on a backside of the first substrate to expose the insulating layer and one end of the plurality of conductive contacts; and forming a conductive wiring layer on the exposed insulating layer.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: October 17, 2023
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jifeng Zhu, Jun Chen, Si Ping Hu, Zhenyu Lu
  • Publication number: 20230328936
    Abstract: A power converter, heat exchangers, heat sinks, and a photovoltaic power generation system, related to the field of heat dissipation. The power converter includes: a power semiconductor device, a magnetic element, a sealed cavity, and a heat dissipation cavity. The power semiconductor device and the magnetic element are disposed in the sealed cavity. The power semiconductor device dissipates heat through a first heat sink, and cooling fins of the first heat sink are located in the heat dissipation cavity. The magnetic element dissipates heat through a second heat sink, and cooling fins of the second heat sink are located in the heat dissipation cavity, Accordingly, reliability and heat dissipation effect of heat dissipation performed by the power converter are improved.
    Type: Application
    Filed: June 16, 2023
    Publication date: October 12, 2023
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Faming SUN, Jun CHEN, Quanming LI, Xiaowei HUI
  • Publication number: 20230327035
    Abstract: An interconnection piece (200) and a solar cell assembly, which relate to the technical field of photovoltaics and which ensure the normal interconnection of cell pieces, while also inhibiting the degree of deformation of back contact cells during welding. The interconnection piece (200) includes a flexible insulation substrate (210) and a plurality of structural welding strips (220) that are spaced apart on the flexible insulation substrate (210). Each structural welding strip (220) is provided with two welding portions and a connecting portion (221) located between the two welding portions. The connecting portions (221) are connected to two welding portions, respectively. At least part of each connecting portion (221) is located in the flexible insulation substrate (210), and the two welding portions extend out of the flexible insulation substrate (210). The solar cell assembly includes the interconnection piece (200) mentioned above.
    Type: Application
    Filed: November 4, 2020
    Publication date: October 12, 2023
    Inventors: Hua LI, Yong WANG, Peng CHEN, Debao ZHAO, Jun CHEN, Jiyu LIU
  • Publication number: 20230327504
    Abstract: A stator includes a stator core and a seal kit. The stator core includes a yoke part and a plurality of tooth parts. A tooth root of the tooth part is connected to the yoke part. A tooth top of the tooth part is away from the yoke part. An opening slot is formed between two adjacent tooth parts. The opening slot includes a coil slot and a flow passing slot that communicate with each other. The coil slot extends from the tooth top to the tooth root. The coil slot is configured to accommodate a stator coil. The flow passing slot extends from the tooth root to the yoke part. The seal kit is connected to an inner wall of the opening slot. The seal kit and the inner wall of the flow passing slot jointly form a flow passing passage for a coolant to flow through.
    Type: Application
    Filed: May 22, 2023
    Publication date: October 12, 2023
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Hongbing LIU, Haisong XU, Jiangang WANG, Shaobo YANG, Bayaer EERHEMU, Jun CHEN
  • Publication number: 20230328916
    Abstract: A heat dissipation device includes an air-guiding housing and a heat sink assembly. An air guiding channel running through in a first direction is defined by the air-guiding housing, an air outlet of the air guiding channel is configured to provide cooling air to at least one power supply unit. The air-guiding housing comprises a mounting surface located at an end of the air-guiding housing in a second direction, the first direction is perpendicular to the second direction. An electronic equipment having the heat dissipation device is also provided.
    Type: Application
    Filed: March 17, 2023
    Publication date: October 12, 2023
    Inventors: SAN-LONG ZHOU, GONG-WEN ZHANG, YANG LI, JUN LI, JUN CHEN
  • Publication number: 20230325492
    Abstract: Example secure runtime systems and methods are described. In one implementation, a secure runtime system is configured to execute multiple applications in a secure manner. The secure runtime is associated with a secure enclave defined by a hardware device. A secure application loader is configured to load an application into the secure runtime system and an OS bridge is configured to provide OS services to the application.
    Type: Application
    Filed: June 15, 2023
    Publication date: October 12, 2023
    Inventors: Yan Michalevsky, Boris Mittleberg, Jun Chen, Daljeet Singh Chhabra
  • Patent number: 11779897
    Abstract: An example of a flow cell includes a substrate, a plurality of chambers defined on or in the substrate, and a plurality of depressions defined in the substrate and within a perimeter of each of the plurality of chambers. The depressions are separated by interstitial regions. Primers are attached within each of the plurality of depressions, and a capture site is located within each of the plurality of chambers.
    Type: Grant
    Filed: October 31, 2021
    Date of Patent: October 10, 2023
    Assignee: Illumina, Inc.
    Inventors: Lewis J. Kraft, Tarun Kumar Khurana, Yir-Shyuan Wu, Xi-Jun Chen, Arnaud Rival, Justin Fullerton, M. Shane Bowen, Hui Han, Jeffrey S. Fisher, Yasaman Farshchi, Mathieu Lessard-Viger
  • Publication number: 20230318370
    Abstract: A motor, a powertrain, and a device. A plurality of first oil channels are formed between an inner surface of a housing and an outer surface of a stator core, second oil channels are formed at groove roots of coil slots of the stator core, to form double-layer oil channels at the outer surface of the stator core and the root of the coil slot of the stator core, and ensure effective cooling of the stator core and a coil winding. After cooling oil is injected from an oil filling port, a flow direction of the cooling oil in some of the second oil channels is opposite to that of cooling oil in a remaining second oil channel, so that interleaved reverse flows are implemented, and axial temperature of the stator core and the coil winding is more even.
    Type: Application
    Filed: May 22, 2023
    Publication date: October 5, 2023
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Hongbing LIU, Haisong XU, Bayaer EERHEMU, Shaobo YANG, Jun CHEN
  • Publication number: 20230305821
    Abstract: A code checking method includes: causing a compiler to generate a map file and a low-level code file(s) according to a high-level code file(s); obtaining target function information from the map file; finding a target code file from the low-level code file(s); obtaining a first return command of a target function name of the target function information from the target code file; traversing the low-level code file(s) to obtain each calling module name and a second return command of each calling function name; obtaining a second storage area of each calling module name from the map file; and generating a check failure result when calling of a target function name by each calling function name is not complied with a bank-switching compile form according to a first storage area of the target function information, the first return command, each second storage area, and each second return command.
    Type: Application
    Filed: August 10, 2022
    Publication date: September 28, 2023
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yong-Bo Cai, Jun-Chen Zhang, Ming-Rui Li
  • Publication number: 20230305877
    Abstract: An information handling system may include at least one processor and a memory. The information handling system may be configured to perform an upgrade of a plurality of hosts of an information handling system cluster by: determining a score for each host based on hardware metrics of each host; based on the determined scores, selecting a first host for upgrading; migrating virtual machines from the first host to one or more other hosts; and causing the first host to perform the upgrade.
    Type: Application
    Filed: April 13, 2022
    Publication date: September 28, 2023
    Applicant: Dell Products L.P.
    Inventors: Hanzhang GU, Jun CHEN, Charlie CHEN
  • Patent number: 11766171
    Abstract: A method for capturing biometric measurement data of a patient's eye, in which the fixation is monitored during the entire biometric measurement. Information in respect of the fixation is extracted, depending on the different recording modes, from already available or additionally captured recordings and/or data. Central retinal OCT scans with absolute fixation information and frontal images with relative fixation information with or without at least partial diffuse lighting are used. On the basis of this extracted fixation information, the subsequent evaluation only uses the captured biometric measurement data captured just before, at the same time as or just after frontal images with the correct fixation. The method can also be applied to different measurement tasks, in which use is made of different measurement modes and in which the alignment of the measurement object is important for the measurement results.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: September 26, 2023
    Assignee: Carl Zeiss Meditec AG
    Inventors: Ferid Bajramovic, Wei-Jun Chen, Tobias Bühren
  • Publication number: 20230296038
    Abstract: An oil inlet of a motor communicates with a first end of an oil pump through a first passage. A first oil sump of the motor communicates with a second end of the oil pump through a second passage. When the oil pump is rotating, a port at the first end is an oil outlet of the oil pump, and a port at the second end is an oil inlet of the oil pump. The first end of the oil pump communicates with a second oil sump through a third passage with a first valve. The second end of the oil pump communicates with the second oil sump through a fourth passage with a second valve. In this way, when the oil pump is reversing, coolant may be input into a motor cavity and accumulate in the motor cavity, so as to cool motor components in an immersion manner.
    Type: Application
    Filed: May 24, 2023
    Publication date: September 21, 2023
    Inventors: Jiangang Wang, Chaoqiang Wu, Hongbing Liu, Jun Chen, Hu Zhong
  • Publication number: 20230293777
    Abstract: Provided is an implant material, an implant suitable for implantation in bone defect repair and in spinal fusion, and a preparation method thereof. The implant material is used for filling in an internal cavity of a titanium cage/titanium stent (10) or a bone defect site, and is consisted of an upper layer (21), a lower layer (22) and an intermediate layer between the upper layer (21) and lower layer (22), wherein the intermediate layer is composed of an annular coating region (23) located at the periphery and a central region (24) located inside the annular coating region. The central region (24) is filled with a first filling material, which is a gel material having a pro-osteogenic effect. The annular coating region (23) is filled with a second filling material, which is a gel material regulating epigenetics. The upper layer (21) and lower layer (22) are filled with a third filling material, which is a gel material regulating immuno-inflammatory response and stress response.
    Type: Application
    Filed: July 13, 2021
    Publication date: September 21, 2023
    Inventors: Xuenong ZOU, Hualin YI, Jun CHEN, Gang WANG, Yan CHEN, Hao HU
  • Patent number: 11764810
    Abstract: A decoding system, a decoding controller, and a decoding control method are provided. In the decoding system, a decoding controller is disposed between two adjacent decoders. The decoding controller determines whether to perform turn-off based on a non-turn-off indication received by a previous-stage decoder, a turn-off indication output by the previous-stage decoder, and historical turn-off probability statistics. This is equivalent to adding a buffer zone between the two adjacent decoders.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: September 19, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Qing Lu, Hong Chen, Jun Chen
  • Patent number: 11761501
    Abstract: The invention discloses a friction simulating device, comprising: a first driving shaft, a first driving gear, a second driving gear, a second driving shaft, a plurality of friction plates and a driving mechanism. The first driving gear is coaxially fixedly connected to the first driving shaft. The second driving gear is located on a radial outer side of the first driving gear and is provided coaxially with the first driving gear. The second driving shaft is coaxially fixedly connected to the second driving gear. The plurality of friction plates being provided subsequently between the first driving gear and the second driving gear in a direction of an axis of the first driving gear, wherein some of the friction plates are axially movably connected to the first driving gear in a circumferential direction, and the other friction plates are axially movably connected to the second driving gear in the circumferential direction.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: September 19, 2023
    Assignee: Suzhou ITI Motor Technology Co., Ltd.
    Inventors: Jie Yang, Yongxing Gao, Jun Chen
  • Patent number: 11758729
    Abstract: Embodiments of three-dimensional (3D) memory devices having a shielding layer and methods for forming the 3D memory devices are disclosed. In an example, a method for forming a 3D memory device is disclosed. A peripheral device is formed on a first substrate. A first interconnect layer including first interconnect structures are formed above the peripheral device on the first substrate. A shielding layer including a conduction region is formed above the first interconnect layer on the first substrate. The conduction region of the shielding layer covers substantially an area of the first interconnect structures in the first interconnect layer. An alternating conductor/dielectric stack and memory strings each extending vertically through the alternating conductor/dielectric stack are formed on a second substrate. A second interconnect layer including second interconnect structures is formed above the plurality of memory strings on the second substrate.
    Type: Grant
    Filed: November 21, 2020
    Date of Patent: September 12, 2023
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Zongliang Huo, Zhiliang Xia, Li Hong Xiao, Jun Chen
  • Patent number: 11758731
    Abstract: A three-dimensional (3D) memory device includes a peripheral device, a plurality of memory strings, a layer between the peripheral device and the plurality of memory strings, and a contact. The layer includes a conduction region and an isolation region. The contact extends through the isolation region of the layer.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: September 12, 2023
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Zongliang Huo, Zhiliang Xia, Li Hong Xiao, Jun Chen