Patents by Inventor Jun Fujita

Jun Fujita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220194450
    Abstract: A trolley includes a trolley body which in turn includes a wheel that is freely movable on a floor, and a first support that supports a component of a substrate processing apparatus that slides in a lateral direction and is pulled out to an outside of the substrate processing apparatus. The trolley also includes a second support that is connected to the trolley body so as to be freely movable between a first position where a width of the trolley in the lateral direction is a first length and a second position where the width in the lateral direction is a second length longer than the first length, and configured to support the component at the second position together with the first support.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 23, 2022
    Inventors: Yuto FUJITA, Jun FUJIHARA
  • Patent number: 11364707
    Abstract: To solve the problem about the difference in temperature increasing rate between an overlapped part and a one-sheet part so as to further improve the corrosion resistance of plating after hot stamping.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: June 21, 2022
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Soshi Fujita, Yuki Suzuki, Masahiro Fuda, Jun Maki, Hideaki Irikawa, Masahiro Nakata
  • Publication number: 20220157784
    Abstract: A memory device includes a first memory cell array, a second memory cell array disposed in a first direction with respect to the first memory cell array, a first contact plug extending in the first direction through the first memory cell array, and a second contact plug extending in the first direction through the second memory cell array. The first memory cell array includes first electrode layers stacked in a first direction, and a first semiconductor pillar extending through the first electrode layers in the first direction. The second memory cell array including second electrode layers stacked in the first direction, and a second semiconductor pillar extending in the first direction through the second electrode layers. The first contact plug is electrically connected to the first semiconductor pillar, and the second contact plug is electrically connected to the second semiconductor pillar and the first contact plug.
    Type: Application
    Filed: February 1, 2022
    Publication date: May 19, 2022
    Applicant: KIOXIA CORPORATION
    Inventors: Masayoshi TAGAMI, Ryota KATSUMATA, Jun IIJIMA, Tetsuya SHIMIZU, Takamasa USUI, Genki FUJITA
  • Publication number: 20220108969
    Abstract: A power semiconductor module includes a circuit substrate, a power semiconductor device including a semiconductor substrate, and at least one bonding portion. The at least one bonding portion includes a first metal member distal to the semiconductor substrate, a second metal member proximal to the semiconductor substrate, and a bonding layer that bonds the first metal member and the second metal member to each other. At an identical temperature, 0.2% offset yield strength of the first metal member is smaller than the 0.2% offset yield strength of the second metal member and is smaller than shear strength of the bonding layer.
    Type: Application
    Filed: April 9, 2019
    Publication date: April 7, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventor: Jun FUJITA
  • Publication number: 20220081599
    Abstract: Provided are curable adhesives, along with adhesive tapes, laminates, and laminated mirror buttons that include the curable adhesive. The curable adhesive includes a (meth)acrylate polymer, a curable oxetane compound, a polymer filler, and a photoinitiator for curable oxetane compounds. The curable adhesive, when cured, can provide excellent interfacial failure resistance.
    Type: Application
    Filed: December 20, 2019
    Publication date: March 17, 2022
    Inventors: Shinichi IRIE, Jun FUJITA
  • Publication number: 20220064504
    Abstract: An aqueous adhesive composition in an embodiment of the present disclosure includes a particulate polymer containing a (meth)acrylate polymer and a chlorinated polyolefin.
    Type: Application
    Filed: December 23, 2019
    Publication date: March 3, 2022
    Inventors: Jun Fujita, Takayuki Kojima
  • Patent number: 11264318
    Abstract: Provided is a semiconductor device free from chipping of a thin semiconductor element during transportation. The semiconductor device includes: a thin semiconductor element including a front-side electrode on the front side of the semiconductor element, and including a back-side electrode on the back side of the semiconductor element; a metallic member formed on at least one of the front-side electrode and the back-side electrode, the metallic member having a thickness equal to or greater than the thickness of the semiconductor element; and a resin member in contact with the lateral side of the metallic member and surrounding the periphery of the metallic member, with a part of the front side of the semiconductor element being exposed.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: March 1, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoshinori Yokoyama, Jun Fujita, Toshiaki Shinohara, Hiroshi Kobayashi
  • Patent number: 11256229
    Abstract: An industrial machinery includes: a drive mechanism driving a control target that moves work or a tool; a motor; a first sensor detecting a position of the control target; a second sensor detecting a position of the motor; a current controller controlling a supply current to the motor; a servo controller outputting a torque instruction to the current controller; and a numerical controller calculating a processing force of the control target to the work based on position information on the control target acquired from the first sensor, position information on the motor acquired from the second sensor, and the torque instruction, the numerical controller determining that the tool is in failure if an absolute value of a first component of the processing force becomes equal to or larger than a first threshold value while processing the work, the first component having a frequency lower than a predetermined frequency.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: February 22, 2022
    Assignee: Shibaura Machine Co., Ltd.
    Inventors: Takamichi Ito, Jun Fujita, Atsushi Tada, Hirohiko Matsuzaki
  • Publication number: 20210398950
    Abstract: An object is to provide technology that enables cost reduction or downsizing of semiconductor packages. The wiring element includes a second substrate, a plurality of first relay pads arranged on a surface of the second substrate opposite to the conductor substrate and connected to each of the control pads of the plurality of semiconductor elements by wires, a plurality of second relay pads arranged on the surface of the second substrate opposite to the conductor substrate, the number thereof being equal to or lower than the number of the plurality of first relay pads, and a plurality of wiring portions arranged on the surfaceof the second substrate opposite to the conductor substrate and selectively connecting the plurality of first relay pads and the plurality of second relay pads.
    Type: Application
    Filed: November 26, 2018
    Publication date: December 23, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yosuke NAKATA, Jun FUJITA
  • Patent number: 11193107
    Abstract: The invention provides a method for producing a substrate for supporting cells, including a humidification step of humidifying the periphery of a non-fluorine resin based substrate, and a UV irradiation step of irradiating the substrate with UV in an oxygen and/or ozone containing atmosphere during and/or after the humidification step. The invention also provides a substrate for supporting cells, which is a non-fluorine resin based substrate. The substrate has a cell supporting surface for supporting cells, containing a component capable of generating C7H5O+ molecules by beam irradiation of a time-of-flight secondary ion mass spectrometer, such that cells are supported on the cell-supporting surface.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: December 7, 2021
    Assignees: Ebara Jitsugyo Co., Ltd., Keio University
    Inventors: Shuichi Takahashi, Michio Ohira, Hideo Nakata, Shogo Miyata, Shugo Tohyama, Jun Fujita, Keiichi Fukuda
  • Patent number: 11195803
    Abstract: An object is to provide a technique capable of suppressing a corrosion of a first electrode and a second electrode. A semiconductor element includes a semiconductor substrate, an Al electrode, a polyimide member selectively disposed on the Al electrode, and an Ni electrode. The polyimide member includes a protruding part which protrudes in a plane direction of an upper surface of the Al electrode and which has a lower portion having contact with the Al electrode in a cross-sectional view, in at least part of a peripheral part of the polyimide member in a top view. The Ni electrode is disposed on the Al electrode and the protruding part.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: December 7, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Motoru Yoshida, Jun Fujita, Yuji Sato
  • Publication number: 20210296226
    Abstract: Provided is a semiconductor device free from chipping of a thin semiconductor element during transportation. The semiconductor device includes: a thin semiconductor element including a front-side electrode on the front side of the semiconductor element, and including a back-side electrode on the back side of the semiconductor element; a metallic member formed on at least one of the front-side electrode and the back-side electrode, the metallic member having a thickness equal to or greater than the thickness of the semiconductor element; and a resin member in contact with the lateral side of the metallic member and surrounding the periphery of the metallic member, with a part of the front side of the semiconductor element being exposed.
    Type: Application
    Filed: January 15, 2018
    Publication date: September 23, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yoshinori YOKOYAMA, Jun FUJITA, Toshiaki SHINOHARA, Hiroshi KOBAYASHI
  • Patent number: 11116090
    Abstract: Electronic Devices Incorporating Flexible Component Layers with Interlocking Devices At least some aspects of the present disclosure directs to an electronic device 100 comprising a rigid member 100A, 100B, a flexible component layer 130, and an interlocking device 110A, HOB disposed between the flexible component layer and the rigid member. The flexible component layer has at least two sections when the flexible component layer is flexed. The interlocking device comprises a first interlocking component attached to or integrated with the flexible component layer, and a second interlocking component attached to or integrated with the rigid member configured to engage with the first interlocking component, such that the engagement prevents the separation of the flexible component layer from the rigid member along a direction generally perpendicular to a surface of the rigid member.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: September 7, 2021
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Dylan T. Cosgrove, Catherine A. Leatherdale, Fay T. Salmon, Jun Fujita, Albert I. Everaerts
  • Patent number: 11046456
    Abstract: A takeoff and landing assist apparatus for a flight vehicle with rotor blades causes the flight vehicle to take off from or be landed on a target point. The takeoff and landing assist apparatus includes a plurality of guide rods in parallel to each other, the plurality of guide rods being provided to one of the flight vehicle and the target point; and a plurality of guide rings into which the plurality of guide rods are insertable, the plurality of guide rings being provided to the other of the flight vehicle and the target point. A center-to-center distance between the plurality of guide rods and a center-to-center distance between the plurality of guide rings are set to be same.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: June 29, 2021
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventor: Jun Fujita
  • Publication number: 20210170112
    Abstract: An injection instrument set includes a tubular injection instrument in which an injection liquid is contained, and a guide member disposed on a surface of an injection target of the injection liquid. The injection instrument includes an injection needle which is inserted into the injection target to inject the injection liquid into the injection target. The guide member includes a guide passage which is disposed at a predetermined angle with respect to a surface of the guide member which comes into contact with the injection target and which allows the injection needle to be inserted and guides the injection needle onto the surface of the injection target, and an anti-slip portion disposed at a portion at which the guide member comes into contact with the surface of the injection target.
    Type: Application
    Filed: July 8, 2019
    Publication date: June 10, 2021
    Inventors: Hideaki Kanazawa, Keiichi Fukuda, Jun Fujita
  • Patent number: 10998436
    Abstract: A semiconductor device having high reliability is obtained. A semiconductor device includes a semiconductor substrate, a first gate interconnection, a second gate interconnection, a first metal portion, an insulating member, and a second metal portion. The first gate interconnection and the second gate interconnection are disposed on a main surface of the semiconductor substrate with an interval therebetween. The first metal portion is formed on the first gate interconnection and the second gate interconnection. The first metal portion has a top surface located opposite to the semiconductor substrate at a region between the first gate interconnection and the second gate interconnection. A recess is formed in the top surface. The insulating member fills at least a portion of the recess. The second metal portion extends from an upper surface of the insulating member onto the top surface of the first metal portion.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: May 4, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Jun Fujita, Naoto Kaguchi, Fumio Wada
  • Publication number: 20200395314
    Abstract: An object is to provide a technique capable of suppressing a corrosion of a first electrode and a second electrode. A semiconductor element includes a semiconductor substrate, an Al electrode, a polyimide member selectively disposed on the Al electrode, and an Ni electrode. The polyimide member includes a protruding part which protrudes in a plane direction of an upper surface of the Al electrode and which has a lower portion having contact with the Al electrode in a cross-sectional view, in at least part of a peripheral part of the polyimide member in a top view. The Ni electrode is disposed on the Al electrode and the protruding part.
    Type: Application
    Filed: March 8, 2018
    Publication date: December 17, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Motoru YOSHIDA, Jun FUJITA, Yuji SATO
  • Publication number: 20200273716
    Abstract: A semiconductor device is provided that can minimize the occurrence of poor joining between a copper electrode and a copper wire. The semiconductor device includes a semiconductor substrate; a copper electrode layer formed on the semiconductor substrate; a metallic thin-film layer formed on the copper electrode layer for preventing oxidation of the copper electrode layer, the metallic thin-film layer having an opening through which the copper electrode layer is exposed, the opening being located on an inner side relative to an outer periphery of the metallic thin-film layer; and an interconnection member containing copper as a main component, the interconnection member including a joining region covering the opening, the interconnection member being joined to the metallic thin-film layer and joined to the copper electrode layer in the opening.
    Type: Application
    Filed: April 12, 2018
    Publication date: August 27, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuji SATO, Tsuyoshi URAJI, Jun FUJITA, Motoru YOSHIDA
  • Patent number: 10697078
    Abstract: A method of forming Cu plating of the present invention includes: a first step of forming a Cu seed layer on one of surfaces of a substrate such that an average grain size is 50 nm or more and 300 nm or less; a second step of forming an oxide film on a surface of the Cu seed layer in an oxygen atmosphere; a third step of removing a part of the oxide film; and a fourth step of feeding power to the Cu seed layer to form Cu plating on a surface of the oxide film on the Cu seed layer by electrolytic plating.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: June 30, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yuji Sato, Jun Fujita, Motoru Yoshida, Kazuyo Endo
  • Publication number: 20200150617
    Abstract: An industrial machinery includes: a drive mechanism driving a control target that moves work or a tool; a motor; a first sensor detecting a position of the control target; a second sensor detecting a position of the motor; a current controller controlling a supply current to the motor; a servo controller outputting a torque instruction to the current controller; and a numerical controller calculating a processing force of the control target to the work based on position information on the control target acquired from the first sensor, position information on the motor acquired from the second sensor, and the torque instruction, the numerical controller determining that the tool is in failure if an absolute value of a first component of the processing force becomes equal to or larger than a first threshold value while processing the work, the first component having a frequency lower than a predetermined frequency.
    Type: Application
    Filed: January 17, 2020
    Publication date: May 14, 2020
    Applicant: Toshiba Kikai Kabushiki Kaisha
    Inventors: Takamichi Ito, Jun Fujita, Atsushi Tada, Hirohiko Matsuzaki