Abstract: Electronic Devices Incorporating Flexible Component Layers with Interlocking Devices At least some aspects of the present disclosure directs to an electronic device 100 comprising a rigid member 100A, 100B, a flexible component layer 130, and an interlocking device 110A, HOB disposed between the flexible component layer and the rigid member. The flexible component layer has at least two sections when the flexible component layer is flexed. The interlocking device comprises a first interlocking component attached to or integrated with the flexible component layer, and a second interlocking component attached to or integrated with the rigid member configured to engage with the first interlocking component, such that the engagement prevents the separation of the flexible component layer from the rigid member along a direction generally perpendicular to a surface of the rigid member.

Abstract: A takeoff and landing assist apparatus for a flight vehicle with rotor blades causes the flight vehicle to take off from or be landed on a target point. The takeoff and landing assist apparatus includes a plurality of guide rods in parallel to each other, the plurality of guide rods being provided to one of the flight vehicle and the target point; and a plurality of guide rings into which the plurality of guide rods are insertable, the plurality of guide rings being provided to the other of the flight vehicle and the target point. A center-to-center distance between the plurality of guide rods and a center-to-center distance between the plurality of guide rings are set to be same.

Abstract: An injection instrument set includes a tubular injection instrument in which an injection liquid is contained, and a guide member disposed on a surface of an injection target of the injection liquid. The injection instrument includes an injection needle which is inserted into the injection target to inject the injection liquid into the injection target. The guide member includes a guide passage which is disposed at a predetermined angle with respect to a surface of the guide member which comes into contact with the injection target and which allows the injection needle to be inserted and guides the injection needle onto the surface of the injection target, and an anti-slip portion disposed at a portion at which the guide member comes into contact with the surface of the injection target.

Abstract: A semiconductor device having high reliability is obtained. A semiconductor device includes a semiconductor substrate, a first gate interconnection, a second gate interconnection, a first metal portion, an insulating member, and a second metal portion. The first gate interconnection and the second gate interconnection are disposed on a main surface of the semiconductor substrate with an interval therebetween. The first metal portion is formed on the first gate interconnection and the second gate interconnection. The first metal portion has a top surface located opposite to the semiconductor substrate at a region between the first gate interconnection and the second gate interconnection. A recess is formed in the top surface. The insulating member fills at least a portion of the recess. The second metal portion extends from an upper surface of the insulating member onto the top surface of the first metal portion.

Abstract: An object is to provide a technique capable of suppressing a corrosion of a first electrode and a second electrode. A semiconductor element includes a semiconductor substrate, an Al electrode, a polyimide member selectively disposed on the Al electrode, and an Ni electrode. The polyimide member includes a protruding part which protrudes in a plane direction of an upper surface of the Al electrode and which has a lower portion having contact with the Al electrode in a cross-sectional view, in at least part of a peripheral part of the polyimide member in a top view. The Ni electrode is disposed on the Al electrode and the protruding part.

Abstract: A semiconductor device is provided that can minimize the occurrence of poor joining between a copper electrode and a copper wire. The semiconductor device includes a semiconductor substrate; a copper electrode layer formed on the semiconductor substrate; a metallic thin-film layer formed on the copper electrode layer for preventing oxidation of the copper electrode layer, the metallic thin-film layer having an opening through which the copper electrode layer is exposed, the opening being located on an inner side relative to an outer periphery of the metallic thin-film layer; and an interconnection member containing copper as a main component, the interconnection member including a joining region covering the opening, the interconnection member being joined to the metallic thin-film layer and joined to the copper electrode layer in the opening.

Abstract: A method of forming Cu plating of the present invention includes: a first step of forming a Cu seed layer on one of surfaces of a substrate such that an average grain size is 50 nm or more and 300 nm or less; a second step of forming an oxide film on a surface of the Cu seed layer in an oxygen atmosphere; a third step of removing a part of the oxide film; and a fourth step of feeding power to the Cu seed layer to form Cu plating on a surface of the oxide film on the Cu seed layer by electrolytic plating.

Abstract: An industrial machinery includes: a drive mechanism driving a control target that moves work or a tool; a motor; a first sensor detecting a position of the control target; a second sensor detecting a position of the motor; a current controller controlling a supply current to the motor; a servo controller outputting a torque instruction to the current controller; and a numerical controller calculating a processing force of the control target to the work based on position information on the control target acquired from the first sensor, position information on the motor acquired from the second sensor, and the torque instruction, the numerical controller determining that the tool is in failure if an absolute value of a first component of the processing force becomes equal to or larger than a first threshold value while processing the work, the first component having a frequency lower than a predetermined frequency.

Abstract: There is provided an aqueous emulsion derived from a blend comprising an acrylic polymer, wherein the pH of the dispersion medium is less than 7.0, and a water-in-oil emulsion containing a nonionic water-soluble polymer, which aqueous emulsion has viscosity of 1,000 to 15,000 mPa s at 25° C. There are also provided adhesive compositions made using the aqueous emulsion and methods for manufacturing the aqueous emulsion.

Abstract: An industrial machinery includes: a drive mechanism driving a control target that moves work or a tool; a motor; a first sensor detecting a position of the control target; a second sensor detecting a position of the motor; a current controller controlling a supply current to the motor; a servo controller outputting a torque instruction to the current controller; and a numerical controller calculating a processing force of the control target to the work based on position information on the control target acquired from the first sensor, position information on the motor acquired from the second sensor, and the torque instruction, the numerical controller determining that the tool is in failure if an absolute value of a first component of the processing force becomes equal to or larger than a first threshold value while processing the work, the first component having a frequency lower than a predetermined frequency.

Abstract: Media which contain 4-tryptophan or an L-tryptophan derivative at a concentration of not less than 176 ?M are useful for culturing pluripotent stem cells.

Abstract: A semiconductor device includes a semiconductor substrate, an insulating film, and an electrode. The semiconductor substrate includes a first surface. The insulating film is provided on the first surface of the semiconductor substrate and includes a second surface opposite to the first surface. The electrode is connected to the second surface of the insulating film and includes a side surface, a first face in contact with the insulating film, and a second face opposite to the first face. An outer periphery of the second face of the electrode is formed on an inner side of an outer periphery of the first face.

Abstract: A semiconductor device having high reliability is obtained. A semiconductor device includes a semiconductor substrate, a first gate interconnection, a second gate interconnection, a first metal portion, an insulating member, and a second metal portion. The first gate interconnection and the second gate interconnection are disposed on a main surface of the semiconductor substrate with an interval therebetween. The first metal portion is formed on the first gate interconnection and the second gate interconnection. The first metal portion has a top surface located opposite to the semiconductor substrate at a region between the first gate interconnection and the second gate interconnection. A recess is formed in the top surface. The insulating member fills at least a portion of the recess. The second metal portion extends from an upper surface of the insulating member onto the top surface of the first metal portion.

Abstract: Electronic Devices Incorporating Flexible Component Layers with Interlocking Devices At least some aspects of the present disclosure directs to an electronic device 100 comprising a rigid member 100A, 100B, a flexible component layer 130, and an interlocking device 110A, HOB disposed between the flexible component layer and the rigid member. The flexible component layer has at least two sections when the flexible component layer is flexed. The interlocking device comprises a first interlocking component attached to or integrated with the flexible component layer, and a second interlocking component attached to or integrated with the rigid member configured to engage with the first interlocking component, such that the engagement prevents the separation of the flexible component layer from the rigid member along a direction generally perpendicular to a surface of the rigid member.

Abstract: An undifferentiated stem cell-removing agent which contains at least one kind selected from the group consisting of a fatty acid synthesis inhibitor, a fatty acid utilization inhibitor, and a cholesterol synthesis inhibitor; a method for removing undifferentiated stem cells which includes culturing a cell mixture that contains an undifferentiated stem cell and a differentiated cell in the presence of the undifferentiated stem cell-removing agent; and a production method of cells for transplantation which includes the following steps (i) and (ii): a step (i) of inducing a desired differentiated cell from an undifferentiated stem cell, and a step (ii) of culturing the cell mixture obtained in the step (i) in the presence of the undifferentiated stem cell-removing agent are provided.

Abstract: An inspection robot for inspecting a nuclear reactor that includes a hull and an on-board control mechanism that controls the operation of the inspection robot. The on-board control mechanism controls one or more sensors used to inspect one or more structures in the nuclear reactor as well as the movement by the inspection robot. A gimbal mechanism rotates the inspection robot hull by shifting the center-of-mass so that gravity and buoyancy forces generate a moment to rotate the hull in a desired direction. A camera is coupled to the gimbal mechanism for providing visual display of the one or more structures in the nuclear reactor. The camera is allowed to rotate about an axis using the gimbal mechanism. The inspection robot communicates its findings with respect to the inspection tasks using the wireless communication link.

Abstract: Described herein is a composition, article and method thereof, wherein the composition comprises (i) a fluoropolymer and (ii) an ionic liquid.

Abstract: A method of curing a curable composition includes contacting the free-radically curable composition with the solid primer layer thereby causing at least partial curing of the curable composition. The solid primer layer includes a binder material, optional beta-dicarbonyl compound, and an organic peroxide. The curable composition includes at least one free-radically polymerizable compound, a polyvalent metal compound, and a quaternary ammonium halide. The method can be used for adhesive bonding of substrates and preparation of various articles.

Abstract: A semiconductor device includes a semiconductor substrate, an insulating film, and an electrode. The semiconductor substrate includes a first surface. The insulating film is provided on the first surface of the semiconductor substrate and includes a second surface opposite to the first surface. The electrode is connected to the second surface of the insulating film and includes a side surface, a first face in contact with the insulating film, and a second face opposite to the first face. An outer periphery of the second face of the electrode is formed on an inner side of an outer periphery of the first face.

Abstract: A method of forming Cu plating of the present invention includes: a first step of forming a Cu seed layer on one of surfaces of a substrate such that an average grain size is 50 nm or more and 300 nm or less; a second step of forming an oxide film on a surface of the Cu seed layer in an oxygen atmosphere; a third step of removing a part of the oxide film; and a fourth step of feeding power to the Cu seed layer to form Cu plating on a surface of the oxide film on the Cu seed layer by electrolytic plating.