Patents by Inventor Jun Furuichi

Jun Furuichi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160020163
    Abstract: A wiring substrate includes a first wiring structure and a second wiring structure. The first wiring structure includes a first insulating layer, which covers a first wiring layer, and a via wiring. A first through hole of the first insulating layer is filled with the via wiring. The second wiring structure includes a second wiring layer and a second insulating layer. The second wiring layer is formed on an upper surface of the first insulating layer and an upper end surface of the via wiring. The second wiring layer partially includes a roughened surface. The second insulating layer is stacked on the upper surface of the first insulating layer and covers the second wiring layer. The second wiring structure has a higher wiring density than the first wiring structure. The roughened surface of the second wiring layer has a smaller surface roughness than the first wiring layer.
    Type: Application
    Filed: July 6, 2015
    Publication date: January 21, 2016
    Inventors: Noriyoshi SHIMIZU, Yusuke GOZU, Jun FURUICHI, Akio ROKUGAWA, Takashi Ito
  • Publication number: 20150364405
    Abstract: A wiring substrate includes a first wiring layer including a first wiring part having a first wiring interval and a second wiring part having a second wiring interval wider than the first wiring interval, a metal plane layer formed on a portion of a first insulation layer formed on the first wiring layer, the first wiring part being located below the portion, a second insulation layer formed on the first insulation layer and the metal plane layer and having a first via hole and a second via hole, a second wiring layer formed on the second insulation layer and connected to the first wiring layer via a first via conductor formed in the first via hole, and a third wiring layer formed on the second insulation layer and connected to the metal plane layer via a second via conductor formed in the second via hole.
    Type: Application
    Filed: June 9, 2015
    Publication date: December 17, 2015
    Inventors: Yuji Kunimoto, Jun Furuichi, Noriyoshi Shimizu, Naoyuki Koizumi
  • Publication number: 20150292572
    Abstract: The invention provides a clutch seal which can enhance a durability of a membrane portion which is a constituting part of a seal and is constructed by a rubber-like elastic body, and can inhibit a working fluid from standing in a concave surface of the membrane portion. The clutch seal of the invention is an annular seal interposed between a clutch plate in a dry clutch and a piston pressing the clutch plate, has a middle ring fixed to the piston between an outer ring and an inner ring which are fixed to a clutch housing, and has membrane portions constructed by a rubber-like elastic body respectively between the outer ring and the middle ring and between the inner ring and the middle ring, wherein the middle ring is arranged at an intermediate position of a stroke in an initial shape of the membrane portion.
    Type: Application
    Filed: October 8, 2013
    Publication date: October 15, 2015
    Inventors: Koji Tsukamoto, Kuniaki Miyake, Toshihiro Mukaida, Hitoshi Okabe, Atsushi Yokota, Tatsuya Osone, Yuuzo Akasaka, Hiroki Uehara, Jun Furuichi
  • Patent number: 9159648
    Abstract: A wiring substrate includes: a core substrate made of glass and having: a first surface; a second surface opposite to the first surface; and a side surface between the first surface and the second surface; and an insulating layer and a wiring layer, which are formed on at least one of the first surface and the second surface of the core substrate. A plurality of concave portions are formed in the side surface of the core substrate to extend from the first surface to the second surface, and a resin is filled in the respective concave portions.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: October 13, 2015
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Naoyuki Koizumi, Jun Furuichi, Yasuyoshi Horikawa
  • Patent number: 9078384
    Abstract: A wiring substrate includes a structure in which a plurality of wiring layers are stacked through insulating layers intervening therebetween, and which has a first surface side and a second surface side, the first surface side where a semiconductor element is to be mounted, the second surface side being located at an opposite side to the first surface side, an interposer buried in an outermost one of the insulating layers located at the first surface side, and electrically connected to the semiconductor element to be mounted, and a sheet-shaped member buried in an outermost one of the insulating layers located at the second surface side, wherein, the interposer and the sheet-shaped member are disposed at symmetrical positions symmetrical each other.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: July 7, 2015
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Jun Furuichi, Akihiko Tateiwa, Naoyuki Koizumi
  • Patent number: 8941230
    Abstract: A metal plate covers an opening on the upper surface of a core substrate and exposes an outer edge of the upper surface of the core substrate. A conductive layer covers the lower surface of the core substrate. A semiconductor chip bonded to a first surface of the metal plate is exposed through the opening. A first insulating layer covers the upper and side surface of the metal plate and the outer edge of the upper surface of the core substrate. A second insulating layer fills the openings of the metal plate and the conductive layer and covers the outer edge of the lower surface of the core substrate, the conductive layer, and the semiconductor chip. The metal plate is thinner than the semiconductor chip. Total thickness of the conductive layer and the core substrate is equal to or larger than the thickness of the semiconductor chip.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: January 27, 2015
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Masahiro Kyozuka, Akihiko Tateiwa, Yuji Kunimoto, Jun Furuichi
  • Patent number: 8747279
    Abstract: A hybrid driving force transmission device is provided with a multiple-plate dry clutch, a piston, a piston arm, a return spring, bellows elastic seal components and an arm fixing plate. The return spring applies biasing force to the piston arm in the release direction of the clutch, during the release period of the multiple-plate dry clutch. The bellows elastic seal member is secured or maintained in a position on the side wall of a clutch drum and seals a through hole and arm distal end from the clutch chamber, and undergoes an elastic deformation following the stroke movement of the arm distal end. The arm fixing plate is integrally provided with the bellows elastic seal member, is fixed to the arm distal end, and when the multiple-plate dry clutch is engaged, is configured to contact the clutch plate for transferring the clutch engagement force.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: June 10, 2014
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Jun Furuichi, Kuniaki Miyake
  • Publication number: 20140070396
    Abstract: A metal plate covers an opening on the upper surface of a core substrate and exposes an outer edge of the upper surface of the core substrate. A conductive layer covers the lower surface of the core substrate. A semiconductor chip bonded to a first surface of the metal plate is exposed through the opening. A first insulating layer covers the upper and side surface of the metal plate and the outer edge of the upper surface of the core substrate. A second insulating layer fills the openings of the metal plate and the conductive layer and covers the outer edge of the lower surface of the core substrate, the conductive layer, and the semiconductor chip. The metal plate is thinner than the semiconductor chip. Total thickness of the conductive layer and the core substrate is equal to or larger than the thickness of the semiconductor chip.
    Type: Application
    Filed: August 26, 2013
    Publication date: March 13, 2014
    Applicant: Shinko Electric Industries Co., LTD.
    Inventors: Masahiro Kyozuka, Akihiko Tateiwa, Jun Furuichi
  • Publication number: 20140015121
    Abstract: A wiring substrate includes: a core substrate made of glass and having: a first surface; a second surface opposite to the first surface; and a side surface between the first surface and the second surface; and an insulating layer and a wiring layer, which are formed on at least one of the first surface and the second surface of the core substrate. A plurality of concave portions are formed in the side surface of the core substrate to extend from the first surface to the second surface, and a resin is filled in the respective concave portions.
    Type: Application
    Filed: July 11, 2013
    Publication date: January 16, 2014
    Inventors: Naoyuki Koizumi, Jun Furuichi, Yasuyoshi Horikawa
  • Publication number: 20130264101
    Abstract: There is provided a wiring substrate including: a core substrate including: a first core substrate including: a plate-shaped first glass substrate; and a first through electrode formed through the first glass substrate; a second core substrate including: a plate-shaped second glass substrate; and a second through electrode formed through the second glass substrate, wherein a diameter of the second through electrode is different from that of the first through electrode; and an insulating member encapsulating the first and second core substrates, and a wiring layer formed on at least one surface of the core substrate. The first and second core substrates are arranged to be separated from each other when viewed from a top.
    Type: Application
    Filed: April 3, 2013
    Publication date: October 10, 2013
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Jun FURUICHI, Akihiko TATEIWA, Naoyuki KOIZUMI
  • Publication number: 20130168197
    Abstract: A hybrid driving force transmission device is provided with a multiple-plate dry clutch, a piston, a piston arm, a return spring, bellows elastic seal components and an arm fixing plate. The return spring applies biasing force to the piston arm in the release direction of the clutch, during the release period of the multiple-plate dry clutch. The bellows elastic seal member is secured or maintained in a position on the side wall of a clutch drum and seals a through hole and arm distal end from the clutch chamber, and undergoes an elastic deformation following the stroke movement of the arm distal end. The arm fixing plate is integrally provided with the bellows elastic seal member, is fixed to the arm distal end, and when the multiple-plate dry clutch is engaged, is configured to contact the clutch plate for transferring the clutch engagement force.
    Type: Application
    Filed: July 26, 2011
    Publication date: July 4, 2013
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Jun Furuichi, Kuniaki Miyake
  • Publication number: 20120234589
    Abstract: A wiring substrate includes a structure in which a plurality of wiring layers are stacked through insulating layers intervening therebetween, and which has a first surface side and a second surface side, the first surface side where a semiconductor element is to be mounted, the second surface side being located at an opposite side to the first surface side, an interposer buried in an outermost one of the insulating layers located at the first surface side, and electrically connected to the semiconductor element to be mounted, and a sheet-shaped member buried in an outermost one of the insulating layers located at the second surface side, wherein, the interposer and the sheet-shaped member are disposed at symmetrical positions symmetrical each other.
    Type: Application
    Filed: March 12, 2012
    Publication date: September 20, 2012
    Applicant: SHINKO ELECTRIC INDUSTRIES., LTD.
    Inventors: Jun FURUICHI, Akihiko TATEIWA, Naoyuki KOIZUMI
  • Patent number: 7350631
    Abstract: An automatic transmission includes a clutch drum formed, by press forming, with splines including recessed portions and raised portions, and engaging with clutch plates; and a rotational speed measuring device configured to measure a rotational speed of the clutch drum, and including a surface sensing device disposed outside an outer surface of the clutch drum, and configured to sense movement of the recessed portions and the raised portions of the splines. The clutch drum includes first openings each formed in one of the recessed portions recessed radially inwards, and each confronting the clutch plates radially.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: April 1, 2008
    Assignee: Jatco Ltd
    Inventor: Jun Furuichi
  • Publication number: 20060049017
    Abstract: An automatic transmission includes a clutch drum formed, by press forming, with splines including recessed portions and raised portions, and engaging with clutch plates; and a rotational speed measuring device configured to measure a rotational speed of the clutch drum, and including a surface sensing device disposed outside an outer surface of the clutch drum, and configured to sense movement of the recessed portions and the raised portions of the splines. The clutch drum includes first openings each formed in one of the recessed portions recessed radially inwards, and each confronting the clutch plates radially.
    Type: Application
    Filed: September 2, 2005
    Publication date: March 9, 2006
    Inventor: Jun Furuichi