Patents by Inventor Jun Furuichi
Jun Furuichi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160020163Abstract: A wiring substrate includes a first wiring structure and a second wiring structure. The first wiring structure includes a first insulating layer, which covers a first wiring layer, and a via wiring. A first through hole of the first insulating layer is filled with the via wiring. The second wiring structure includes a second wiring layer and a second insulating layer. The second wiring layer is formed on an upper surface of the first insulating layer and an upper end surface of the via wiring. The second wiring layer partially includes a roughened surface. The second insulating layer is stacked on the upper surface of the first insulating layer and covers the second wiring layer. The second wiring structure has a higher wiring density than the first wiring structure. The roughened surface of the second wiring layer has a smaller surface roughness than the first wiring layer.Type: ApplicationFiled: July 6, 2015Publication date: January 21, 2016Inventors: Noriyoshi SHIMIZU, Yusuke GOZU, Jun FURUICHI, Akio ROKUGAWA, Takashi Ito
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Publication number: 20150364405Abstract: A wiring substrate includes a first wiring layer including a first wiring part having a first wiring interval and a second wiring part having a second wiring interval wider than the first wiring interval, a metal plane layer formed on a portion of a first insulation layer formed on the first wiring layer, the first wiring part being located below the portion, a second insulation layer formed on the first insulation layer and the metal plane layer and having a first via hole and a second via hole, a second wiring layer formed on the second insulation layer and connected to the first wiring layer via a first via conductor formed in the first via hole, and a third wiring layer formed on the second insulation layer and connected to the metal plane layer via a second via conductor formed in the second via hole.Type: ApplicationFiled: June 9, 2015Publication date: December 17, 2015Inventors: Yuji Kunimoto, Jun Furuichi, Noriyoshi Shimizu, Naoyuki Koizumi
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Publication number: 20150292572Abstract: The invention provides a clutch seal which can enhance a durability of a membrane portion which is a constituting part of a seal and is constructed by a rubber-like elastic body, and can inhibit a working fluid from standing in a concave surface of the membrane portion. The clutch seal of the invention is an annular seal interposed between a clutch plate in a dry clutch and a piston pressing the clutch plate, has a middle ring fixed to the piston between an outer ring and an inner ring which are fixed to a clutch housing, and has membrane portions constructed by a rubber-like elastic body respectively between the outer ring and the middle ring and between the inner ring and the middle ring, wherein the middle ring is arranged at an intermediate position of a stroke in an initial shape of the membrane portion.Type: ApplicationFiled: October 8, 2013Publication date: October 15, 2015Inventors: Koji Tsukamoto, Kuniaki Miyake, Toshihiro Mukaida, Hitoshi Okabe, Atsushi Yokota, Tatsuya Osone, Yuuzo Akasaka, Hiroki Uehara, Jun Furuichi
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Patent number: 9159648Abstract: A wiring substrate includes: a core substrate made of glass and having: a first surface; a second surface opposite to the first surface; and a side surface between the first surface and the second surface; and an insulating layer and a wiring layer, which are formed on at least one of the first surface and the second surface of the core substrate. A plurality of concave portions are formed in the side surface of the core substrate to extend from the first surface to the second surface, and a resin is filled in the respective concave portions.Type: GrantFiled: July 11, 2013Date of Patent: October 13, 2015Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Naoyuki Koizumi, Jun Furuichi, Yasuyoshi Horikawa
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Patent number: 9078384Abstract: A wiring substrate includes a structure in which a plurality of wiring layers are stacked through insulating layers intervening therebetween, and which has a first surface side and a second surface side, the first surface side where a semiconductor element is to be mounted, the second surface side being located at an opposite side to the first surface side, an interposer buried in an outermost one of the insulating layers located at the first surface side, and electrically connected to the semiconductor element to be mounted, and a sheet-shaped member buried in an outermost one of the insulating layers located at the second surface side, wherein, the interposer and the sheet-shaped member are disposed at symmetrical positions symmetrical each other.Type: GrantFiled: March 12, 2012Date of Patent: July 7, 2015Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Jun Furuichi, Akihiko Tateiwa, Naoyuki Koizumi
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Patent number: 8941230Abstract: A metal plate covers an opening on the upper surface of a core substrate and exposes an outer edge of the upper surface of the core substrate. A conductive layer covers the lower surface of the core substrate. A semiconductor chip bonded to a first surface of the metal plate is exposed through the opening. A first insulating layer covers the upper and side surface of the metal plate and the outer edge of the upper surface of the core substrate. A second insulating layer fills the openings of the metal plate and the conductive layer and covers the outer edge of the lower surface of the core substrate, the conductive layer, and the semiconductor chip. The metal plate is thinner than the semiconductor chip. Total thickness of the conductive layer and the core substrate is equal to or larger than the thickness of the semiconductor chip.Type: GrantFiled: August 26, 2013Date of Patent: January 27, 2015Assignee: Shinko Electric Industries Co., Ltd.Inventors: Masahiro Kyozuka, Akihiko Tateiwa, Yuji Kunimoto, Jun Furuichi
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Patent number: 8747279Abstract: A hybrid driving force transmission device is provided with a multiple-plate dry clutch, a piston, a piston arm, a return spring, bellows elastic seal components and an arm fixing plate. The return spring applies biasing force to the piston arm in the release direction of the clutch, during the release period of the multiple-plate dry clutch. The bellows elastic seal member is secured or maintained in a position on the side wall of a clutch drum and seals a through hole and arm distal end from the clutch chamber, and undergoes an elastic deformation following the stroke movement of the arm distal end. The arm fixing plate is integrally provided with the bellows elastic seal member, is fixed to the arm distal end, and when the multiple-plate dry clutch is engaged, is configured to contact the clutch plate for transferring the clutch engagement force.Type: GrantFiled: July 26, 2011Date of Patent: June 10, 2014Assignee: Nissan Motor Co., Ltd.Inventors: Jun Furuichi, Kuniaki Miyake
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Publication number: 20140070396Abstract: A metal plate covers an opening on the upper surface of a core substrate and exposes an outer edge of the upper surface of the core substrate. A conductive layer covers the lower surface of the core substrate. A semiconductor chip bonded to a first surface of the metal plate is exposed through the opening. A first insulating layer covers the upper and side surface of the metal plate and the outer edge of the upper surface of the core substrate. A second insulating layer fills the openings of the metal plate and the conductive layer and covers the outer edge of the lower surface of the core substrate, the conductive layer, and the semiconductor chip. The metal plate is thinner than the semiconductor chip. Total thickness of the conductive layer and the core substrate is equal to or larger than the thickness of the semiconductor chip.Type: ApplicationFiled: August 26, 2013Publication date: March 13, 2014Applicant: Shinko Electric Industries Co., LTD.Inventors: Masahiro Kyozuka, Akihiko Tateiwa, Jun Furuichi
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Publication number: 20140015121Abstract: A wiring substrate includes: a core substrate made of glass and having: a first surface; a second surface opposite to the first surface; and a side surface between the first surface and the second surface; and an insulating layer and a wiring layer, which are formed on at least one of the first surface and the second surface of the core substrate. A plurality of concave portions are formed in the side surface of the core substrate to extend from the first surface to the second surface, and a resin is filled in the respective concave portions.Type: ApplicationFiled: July 11, 2013Publication date: January 16, 2014Inventors: Naoyuki Koizumi, Jun Furuichi, Yasuyoshi Horikawa
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Publication number: 20130264101Abstract: There is provided a wiring substrate including: a core substrate including: a first core substrate including: a plate-shaped first glass substrate; and a first through electrode formed through the first glass substrate; a second core substrate including: a plate-shaped second glass substrate; and a second through electrode formed through the second glass substrate, wherein a diameter of the second through electrode is different from that of the first through electrode; and an insulating member encapsulating the first and second core substrates, and a wiring layer formed on at least one surface of the core substrate. The first and second core substrates are arranged to be separated from each other when viewed from a top.Type: ApplicationFiled: April 3, 2013Publication date: October 10, 2013Applicant: Shinko Electric Industries Co., Ltd.Inventors: Jun FURUICHI, Akihiko TATEIWA, Naoyuki KOIZUMI
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Publication number: 20130168197Abstract: A hybrid driving force transmission device is provided with a multiple-plate dry clutch, a piston, a piston arm, a return spring, bellows elastic seal components and an arm fixing plate. The return spring applies biasing force to the piston arm in the release direction of the clutch, during the release period of the multiple-plate dry clutch. The bellows elastic seal member is secured or maintained in a position on the side wall of a clutch drum and seals a through hole and arm distal end from the clutch chamber, and undergoes an elastic deformation following the stroke movement of the arm distal end. The arm fixing plate is integrally provided with the bellows elastic seal member, is fixed to the arm distal end, and when the multiple-plate dry clutch is engaged, is configured to contact the clutch plate for transferring the clutch engagement force.Type: ApplicationFiled: July 26, 2011Publication date: July 4, 2013Applicant: NISSAN MOTOR CO., LTD.Inventors: Jun Furuichi, Kuniaki Miyake
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Publication number: 20120234589Abstract: A wiring substrate includes a structure in which a plurality of wiring layers are stacked through insulating layers intervening therebetween, and which has a first surface side and a second surface side, the first surface side where a semiconductor element is to be mounted, the second surface side being located at an opposite side to the first surface side, an interposer buried in an outermost one of the insulating layers located at the first surface side, and electrically connected to the semiconductor element to be mounted, and a sheet-shaped member buried in an outermost one of the insulating layers located at the second surface side, wherein, the interposer and the sheet-shaped member are disposed at symmetrical positions symmetrical each other.Type: ApplicationFiled: March 12, 2012Publication date: September 20, 2012Applicant: SHINKO ELECTRIC INDUSTRIES., LTD.Inventors: Jun FURUICHI, Akihiko TATEIWA, Naoyuki KOIZUMI
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Patent number: 7350631Abstract: An automatic transmission includes a clutch drum formed, by press forming, with splines including recessed portions and raised portions, and engaging with clutch plates; and a rotational speed measuring device configured to measure a rotational speed of the clutch drum, and including a surface sensing device disposed outside an outer surface of the clutch drum, and configured to sense movement of the recessed portions and the raised portions of the splines. The clutch drum includes first openings each formed in one of the recessed portions recessed radially inwards, and each confronting the clutch plates radially.Type: GrantFiled: September 2, 2005Date of Patent: April 1, 2008Assignee: Jatco LtdInventor: Jun Furuichi
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Publication number: 20060049017Abstract: An automatic transmission includes a clutch drum formed, by press forming, with splines including recessed portions and raised portions, and engaging with clutch plates; and a rotational speed measuring device configured to measure a rotational speed of the clutch drum, and including a surface sensing device disposed outside an outer surface of the clutch drum, and configured to sense movement of the recessed portions and the raised portions of the splines. The clutch drum includes first openings each formed in one of the recessed portions recessed radially inwards, and each confronting the clutch plates radially.Type: ApplicationFiled: September 2, 2005Publication date: March 9, 2006Inventor: Jun Furuichi