Patents by Inventor Jun Ichihara

Jun Ichihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10374217
    Abstract: A production apparatus for producing an electricity storage material is provided. The electricity storage material includes at least a thickener and an active material. The production apparatus includes a solution production device and a mixture-kneading device. The solution production device produces a surfactant-containing solution of the thickener. The mixture-kneading device kneads the solution together with a powder of the active material.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: August 6, 2019
    Assignee: JTEKT CORPORATION
    Inventors: Takumi Mio, Koji Nishi, Sachiko Kubota, Jun Ando, Yutaka Ichihara
  • Publication number: 20190196245
    Abstract: An object of the present invention is to provide a decorative sheet exhibiting high lustrousness even when observed from a direction deviated from a specular reflection of illumination light, and a liquid crystal display device and an automobile interior material each using the decorative sheet. The object is achieved by a decorative sheet including a cholesteric liquid crystal layer having wavelength-selective reflectivity and satisfying Expression (1), R[?45,20](?1)/R[?45,20](?2)?5??Expression (1).
    Type: Application
    Filed: February 28, 2019
    Publication date: June 27, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Nobuhiko Ichihara, Yujiro Yanai, Rikio Inoue, Michio Nagai, Jun Takeda
  • Publication number: 20190137740
    Abstract: To provide an aspheric cemented lens which is easy to design and manufacture and has less aberration by using an inexpensive material such as a resin material. The aspheric cemented lens has at least three interfaces, when three interfaces are defined as a third interface, a second interface and a first interface in order from a light exit surface, chromatic aberration is corrected at the first interface and the second interface. The third interface is a hyperboloid or a surface close to a hyperboloid. When light is incident on the first interface parallel to the optical axis, the exit light from the third interface is converged to almost a single point. In order to correct chromatic aberration, the first interface and the second interface are curved surfaces.
    Type: Application
    Filed: July 3, 2018
    Publication date: May 9, 2019
    Inventor: Jun ICHIHARA
  • Publication number: 20100289103
    Abstract: Among photodiodes used in an optical system for applying light to the entire chip, the conventional PIN photodiode has a problem that light should be applied only to a light reception surface in order to prevent degradation of light response and that positioning of the optical system is difficult. Moreover, in the mesa type PIN photodiode not requiring positioning of an optical system, disconnection failure is often caused by the mesa step. The present invention is made to solve the aforementioned problems, and its object is to provide a PIN photodiode having an improved light response and causing less disconnection failure of metal wiring and a light reception device using the PIN photodiode. The PIN photodiode of the present invention has a structure that the light reception surface is surrounded by a groove of a predetermined depth.
    Type: Application
    Filed: December 13, 2006
    Publication date: November 18, 2010
    Applicant: ROHM CO., LTD.
    Inventors: Masashi Yamamoto, Jun Ichihara
  • Publication number: 20090301211
    Abstract: A capacitance-type pressure sensor for measuring a change in a physical volume of a medium to be measured, by measuring two capacitances wherein the capacitances vary differently from each other in accordance with a change in the physical volume of the medium to be measured, provided with a function for measuring independent values for each capacitance and determining that there is an disconnect failure when at least one of these capacitance values falls below a capacitance value that indicates the normal operating range of the capacitance-type pressure sensor, to thereby provide a pressure sensor with higher reliability through performing the disconnect detection robustly.
    Type: Application
    Filed: June 11, 2007
    Publication date: December 10, 2009
    Applicant: YAMATAKE CORPORATION
    Inventors: Yasuhide Yoshikawa, Jun Ichihara
  • Publication number: 20090103583
    Abstract: On an n-type GaN buffer layer serving as a common semiconductor layer, mesa regions are formed. The mesa region is formed of a semiconductor stack formed of an n-type GaN layer, an active layer and a p-type GaN layer. A current blocking region is not formed in the mesa region, and the mesa diameter of the mesa region is formed to be not more than 15 ?m. The mesa region is formed by selective growth. The mesa region without a surface damage allows sufficient constriction of current and an induced radiation of laser with low current.
    Type: Application
    Filed: August 28, 2008
    Publication date: April 23, 2009
    Applicant: ROHM CO., LTD.
    Inventors: Yoshinori Tanaka, Jun Ichihara
  • Patent number: 7492025
    Abstract: A photo coupler includes a semiconductor laser, a semiconductor light-receiver, a resin protector, a reflective film, a light pipe, and electrodes. The light pipe is made of resin, has a rectangular parallelepiped shape, and is provided so as to surround an outer circumferential portion of the semiconductor light-receiver. On a center portion of an upper surface of the light pipe, a recessed portion shaped in a frustum of quadrangular pyramid tapered toward the semiconductor light-receiver is formed. The reflective film is shaped in a frustum surface of pyramid tapered toward the semiconductor light-receiver, and is formed on side surfaces of the recessed portion.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: February 17, 2009
    Assignee: ROHM Co., Ltd.
    Inventors: Tomohiro Yamazaki, Jun Ichihara
  • Patent number: 7376312
    Abstract: An optical element and an optical transmission member are fixedly secured onto a substrate so as to be coupled to each other. In this substrate, a through hole is formed between an optical element secured portion and an optical transmission member secured portion. In an attempt to assemble these optical transmission member and optical element so as to make the coupling at an optimal position, first, the position of the optical transmission member is adjusted to an optimal position, and after measuring the position by a laser micrometer, the optical transmission member is fixedly secured thereto by using a soldering material. Thus, measurements are again carried out by the laser micrometer to detect an amount of deviation from the measured value before the securing process, and the secured portion is again fused so that the optical transmission member is shifted based on the amount of deviation, and again fixedly secured thereon.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: May 20, 2008
    Assignee: Rohm Co., Ltd.
    Inventors: Shuichi Nawae, Jun Ichihara
  • Publication number: 20080069574
    Abstract: An inventive optical communication module includes a substrate, a light receiving element disposed on one surface of the substrate for receiving light emitted from a transmission-side optical communication module, a block-shaped resin package which seals the one surface of the substrate and the light receiving element, and a lens disposed on a light incidence surface of the resin package opposite from a surface of the resin package contacting the substrate for converging the light emitted from the transmission-side optical communication module on the light receiving element. The resin package has a groove provided in a side face thereof intersecting the light incidence surface thereof.
    Type: Application
    Filed: April 20, 2007
    Publication date: March 20, 2008
    Applicant: ROHM CO., LTD.
    Inventors: Tomohiro Yamazaki, Jun Ichihara
  • Publication number: 20070241343
    Abstract: A photo coupler includes a semiconductor laser, a semiconductor light-receiver, a resin protector, a reflective film, a light pipe, and electrodes. The light pipe is made of resin, has a rectangular parallelepiped shape, and is provided so as to surround an outer circumferential portion of the semiconductor light-receiver. On a center portion of an upper surface of the light pipe, a recessed portion shaped in a frustum of quadrangular pyramid tapered toward the semiconductor light-receiver is formed. The reflective film is shaped in a frustum surface of pyramid tapered toward the semiconductor light-receiver, and is formed on side surfaces of the recessed portion.
    Type: Application
    Filed: March 22, 2007
    Publication date: October 18, 2007
    Inventors: Tomohiro Yamazaki, Jun Ichihara
  • Publication number: 20070030676
    Abstract: A light-emitting module includes a substrate, multiple light-emitting devices arranged thereon, and a package enclosing the multiple light-emitting devices. The package has multiple optical devices corresponding to the multiple light-emitting devices that converge and emit rays of light emitted from each of the light-emitting devices. When the outgoing rays of light emitted from the light-emitting device is extended toward the substrate, the package has virtual light-emitting regions spaced farther from the optical devices than the respective light-emitting devices, and the virtual light-emitting regions are located almost at the same position.
    Type: Application
    Filed: August 4, 2006
    Publication date: February 8, 2007
    Applicant: ROHM CO., LTD.
    Inventor: Jun ICHIHARA
  • Patent number: 6856635
    Abstract: A lower multilayer reflection film (2), a light emitting layer forming portion (6) and an upper multilayer reflection film (8) are sequentially formed on a substrate (1) to form a semiconductor laminated portion (9), and a current injection region A is formed at a part of the semiconductor laminated portion so as to emit light from the surface in the center thereof. And, according to the present invention, the current injection region A is formed so as to be deflected from a center of the substrate. As a result, there is provided a surface light emitting type semiconductor laser capable of monitoring a light emitting power correctly and controlling it automatically in order to achieve the constant light emitting power in a case where the surface light emitting type laser chip is used as a light source for a pickup or the like.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: February 15, 2005
    Assignee: Rohm Co., Ltd.
    Inventors: Hironobu Sai, Jun Ichihara
  • Patent number: 6775310
    Abstract: On a semiconductor substrate (1), a double hetero structure portion (6) in which an active layer (4) having smaller band gap is sandwiched between semiconductor layers (3, 5) having larger band gap than that of the active layer (4) is formed. A light reflection film (9) is formed at least a part of side walls of the double hetero structure portion (6). As a result, a semiconductor light emitting device that light which leaks from side wall of light emitting area in a chip is reduced and emission light can be outputted efficiently can be obtained.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: August 10, 2004
    Assignee: Rohm Co., Ltd.
    Inventors: Hironobu Sai, Jun Ichihara
  • Publication number: 20040091217
    Abstract: An optical element and an optical transmission member are fixedly secured onto a substrate so as to be coupled to each other. In this substrate, a through hole is formed between an optical element secured portion and an optical transmission member secured portion. In an attempt to assemble these optical transmission member and optical element so as to make the coupling at an optimal position, first, the position of the optical transmission member is adjusted to an optimal position, and after measuring the position by a laser micrometer, the optical transmission member is fixedly secured thereto by using a soldering material. Thus, measurements are again carried out by the laser micrometer to detect an amount of deviation from the measured value before the securing process, and the secured portion is again fused so that the optical transmission member is shifted based on the amount of deviation, and again fixedly secured thereon.
    Type: Application
    Filed: November 5, 2003
    Publication date: May 13, 2004
    Inventors: Shuichi Nawae, Jun Ichihara
  • Patent number: 6711198
    Abstract: A light source device for a laser beam printer in which a semiconductor laser is driven with a pulse current having a minimum pulse width at the ON time on the order of milliseconds or less is provided, wherein the semiconductor laser is formed so that either the rate of change at the rise portion of the pulse current becomes ±8% or less or the semiconductor laser is excited in a multiple mode in the vicinity of the threshold value of the oscillation, and the semiconductor laser oscillates in a single mode at a current separated from the threshold value, by adjusting of at least one of the width w of a stripe groove (7a) of the current block layer, the composition of clad layers (5), the distance d between the current block layer (7) and the active layer (4), the composition of the current block layer (7) and the formation of a light absorption layer into the current block layer (7).
    Type: Grant
    Filed: April 14, 2000
    Date of Patent: March 23, 2004
    Assignee: Rohm Co. Ltd.
    Inventors: Jun Ichihara, Hisayoshi Kitajima, Tetsuhiro Tanabe, Ken Nakahara, Haruo Tanaka
  • Publication number: 20030076864
    Abstract: A lower multilayer reflection film (2), a light emitting layer forming portion (6) and an upper multilayer reflection film (8) are sequentially formed on a substrate (1) to form a semiconductor laminated portion (9), and a current injection region A is formed at a part of the semiconductor laminated portion so as to emit light from the surface in the center thereof. And, according to the present invention, the current injection region A is formed so as to be deflected from a center of the substrate. As a result, there is provided a surface light emitting type semiconductor laser capable of monitoring a light emitting power correctly and controlling it automatically in order to achieve the constant light emitting power in a case where the surface light emitting type laser chip is used as a light source for a pickup or the like.
    Type: Application
    Filed: October 22, 2002
    Publication date: April 24, 2003
    Inventors: Hironobu Sai, Jun Ichihara
  • Publication number: 20020176475
    Abstract: On a semiconductor substrate (1), a double hetero structure portion (6) in which an active layer (4) having smaller band gap is sandwiched between semiconductor layers (3, 5) having larger band gap than that of the active layer (4) is formed. A light reflection film (9) is formed at least a part of side walls of the double hetero structure portion (6). As a result, a semiconductor light emitting device that light which leaks from side wall of light emitting area in a chip is reduced and emission light can be outputted efficiently can be obtained.
    Type: Application
    Filed: May 23, 2002
    Publication date: November 28, 2002
    Inventors: Hironobu Sai, Jun Ichihara
  • Publication number: 20020146857
    Abstract: First, an active layer (3) of quantum well structure made of a semiconductor material is sandwiched by n-type and p-type clad layers (2, 4) made of a semiconductor material larger in band gap than the semiconductor of active layer, and a semiconductor laminate wafer (10) is formed so as to compose a laser resonator. The wafer is cleaved into bar form so as to expose end faces of the resonator. Further a thin film (11) containing a dopant is formed on at least one of the end faces of the resonator, and then end face coat films (12, 13) are formed. Thereafter it is heated to diffuse the dopant on the end face of the resonator. As a result, the band gap can be increased only on the resonator end face securely, and therefore this manufacturing method realizes a semiconductor laser having a window structure so as not to absorb light at the end face and capable of preventing deterioration of end face due to surface re-bonding.
    Type: Application
    Filed: April 5, 2002
    Publication date: October 10, 2002
    Inventor: Jun Ichihara
  • Patent number: 6353491
    Abstract: An optical communication module comprises a light emitting element for generating the transmission signal, a condenser lens for connecting the transmission signal light from the light emitting element to the light transmission line, a light receiving element for receiving the receiving signal light from the light transmission line, and a package that covers the light emitting element and the light receiving element, and uses the condenser lens as an opening window, wherein the wavelength selective film for allowing the required waveband light to transmit and the unwanted waveband light to reflect is coated on the transparent member installed on or in the vicinity of the convex surface of the condenser lens. As a result, a bi-directional optical communication module of an inexpensive construction can be obtained, which can receive the desired waveband light only without using a special component such as a wave separator and does not return the unwanted waveband light to the light transmission line.
    Type: Grant
    Filed: August 20, 1998
    Date of Patent: March 5, 2002
    Assignee: Rohm Co., Ltd.
    Inventors: Haruo Tanaka, Jun Ichihara
  • Publication number: 20020020493
    Abstract: In order to provide a low-cost and high-reliable method of coupling a first member and a second member with each other, the method comprises the steps of: performing positioning between the first and second members and then bonding the first and second members to each other by a first adhesive bonding treatment to make short-time fixation possible; and bonding the first and second members to each other by a second adhesive bonding treatment requiring a longer fixation time than that required for the first adhesive bonding treatment.
    Type: Application
    Filed: October 26, 2001
    Publication date: February 21, 2002
    Applicant: ROHM CO., LTD.
    Inventor: Jun Ichihara