Patents by Inventor Jun Kamada
Jun Kamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11859110Abstract: A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(?O)OX groups in a molecule, in which from one to six of the three or more —C(?O)OX groups are —C(?O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group.Type: GrantFiled: April 24, 2018Date of Patent: January 2, 2024Assignee: MITSUI CHEMICALS, INC.Inventors: Jun Kamada, Kazuo Kohmura, Yasuhisa Kayaba
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Publication number: 20230275057Abstract: A composition includes: a compound (A), having an Si—O bond and a cationic functional group that includes at least one selected from the group consisting of a primary nitrogen atom and a secondary nitrogen atom; a compound (B), having at least three —C(?O)OX groups, wherein X is a hydrogen atom or an alkyl group with a carbon number of from 1 to 6, and from one to six of the —C(?O)OX groups is a —C(?O)OH group; and a compound (C), having a cyclic structure and at least one primary nitrogen atom that is directly bonded to the cyclic structure, the composition having a percentage of the primary and the secondary nitrogen atoms in the compound (A), with respect to a total amount of the primary and the secondary nitrogen atoms in the compound (A) and the primary nitrogen atom in the compound (C), of from 3 mol % to 95 mol %.Type: ApplicationFiled: September 8, 2021Publication date: August 31, 2023Applicant: MITSUI CHEMICALS, INC.Inventors: Yuzo NAKAMURA, Yasuhisa KAYABA, Jun KAMADA
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Patent number: 11581197Abstract: This method for producing a semiconductor device comprises: a first step wherein a plurality of semiconductor chips are affixed onto a supporting substrate such that circuit surfaces of the semiconductor chips face the supporting substrate; a second step wherein a plurality of sealed layers are formed at intervals by applying the sealing resin onto the semiconductor chips by three-dimensional modeling method, each sealed layer containing one or more semiconductor chips embedded in a sealing resin; a third step wherein the sealed layers are cured or solidified; and a fourth step wherein sealed bodies are obtained by separating the cured or solidified sealed layers from the supporting substrate.Type: GrantFiled: May 10, 2018Date of Patent: February 14, 2023Assignee: MITSUI CHEMICALS, INC.Inventors: Jun Kamada, Kaichiro Haruta, Yasuhisa Kayaba, Kazuo Kohmura, Yoichi Kodama
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Patent number: 11550962Abstract: The instruction code including an instruction code stored in the area where the encrypted instruction code is stored in a non-rewritable format is authenticated using a specific key which is specific to the core where the instruction code is executed or an authenticated key by a specific key to perform an encryption processing for the input and output data between the core and the outside.Type: GrantFiled: May 6, 2020Date of Patent: January 10, 2023Assignee: SOCIONEXT INC.Inventors: Seiji Goto, Jun Kamada, Taiji Tamiya
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Patent number: 11462482Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer, an unevenness-absorptive resin layer, and an adhesive resin layer in this order and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component such that the circuit forming surface is protected; and a step of forming an electromagnetic wave-shielding layer on the electronic component in a state of being attached to the adhesive laminated film.Type: GrantFiled: July 9, 2018Date of Patent: October 4, 2022Assignee: MITSUI CHEMICALS TEHCELLO, INC.Inventors: Takashi Unezaki, Jun Kamada, Akimitsu Morimoto, Jin Kinoshita
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Patent number: 11421135Abstract: A curable composition includes a blocked isocyanate in which an NCO group of an isocyanate compound having a H6XDI skeleton is blocked by a blocking agent having an O?C—CH—C?O skeleton, a curable functional group-containing fluorine polymer, and an alkoxysilane having a functional group including at least one element of a group 15 element to a group 16 element of the periodic table (excluding oxygen). In the curable composition allowing a titanium oxide to be contained, the molar ratio of the curable functional group to the NCO group is 0.5 to 10; the content ratio of the alkoxysilane with respect to 100 pans by mass of the total amount of the blocked isocyanate and the fluorine polymer is 0.2 to 8 parts by mass; and the content ratio of the titanium oxide with respect to 100 parts by mass of the fluorine polymer is 0 to 200 parts by mass.Type: GrantFiled: May 18, 2017Date of Patent: August 23, 2022Assignee: MITSUI CHEMICALS, INC.Inventors: Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Hideaki Otsuka, Shinji Tachibana
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Patent number: 11398389Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer and an adhesive resin layer and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component; a step of back-grinding a surface of the electronic component opposite to the circuit forming surface in a state of being attached to the adhesive laminated film; a step of dicing the electronic component in a state of being attached to the adhesive laminated film; and a step of forming an electromagnetic wave-shielding layer on the separated electronic components in a state of being attached to the adhesive laminated film, in this order.Type: GrantFiled: July 9, 2018Date of Patent: July 26, 2022Assignee: MITSUI CHEMICALS TOHCELLO, INC.Inventors: Takashi Unezaki, Jun Kamada, Akimitsu Morimoto, Jin Kinoshita
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Patent number: 11332643Abstract: Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.Type: GrantFiled: July 10, 2018Date of Patent: May 17, 2022Assignee: MITSUI CHEMICALS, INC.Inventors: Jun Kamada, Tomoya Matayoshi, Michio Eriguchi, Kaichiro Haruta, Kenichi Fujii, Takashi Unezaki, Kazuo Kohmura
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Publication number: 20210391292Abstract: A method of manufacturing a substrate layered body includes: a step of applying a bonding material to the surface of at least one of a first substrate or a second substrate; a step of curing the bonding material applied on the surface to form a bonding layer having a reduced modulus at 23° C. of 10 GPa or less; and a step of bonding the first substrate and the second substrate via the bonding layer formed.Type: ApplicationFiled: October 17, 2019Publication date: December 16, 2021Applicant: MITSUI CHEMICALS, INC.Inventors: Yasuhisa KAYABA, Jun KAMADA, Yuzo NAKAMURA
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Patent number: 11072678Abstract: The blocked isocyanate is a blocked isocyanate containing a latent isocyanate group, which is an isocyanate group blocked with a blocking agent, wherein the blocked isocyanate includes a first latent isocyanate group that is an isocyanate group blocked with a first blocking agent and a second latent isocyanate group that is an isocyanate group blocked with a second blocking agent; and the first blocking agent is represented by general formula (1) below, and has a higher catalysis activity that activates the isocyanate group than that of the second blocking agent. (where R1 to R3 represent a hydrocarbon group having 1 to 12 carbon atoms or a hydrogen atom, and at least one of R1 to R3 represents a hydrogen atom, and R1 and R3 may be bonded to each other to form a heterocycle.Type: GrantFiled: June 28, 2019Date of Patent: July 27, 2021Assignee: Mitsui Chemicals, Inc.Inventors: Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Masakazu Masui, Shinji Tachibana, Hirokazu Mizuma, Kenichi Fujii
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Patent number: 11058660Abstract: A method of healing an external wound involves applying an external wound-healing agent to an external wound, or bringing the external wound-healing agent applied to a substrate into contact with an external wound, wherein the external wound-healing agent includes, as an active ingredient, at least one compound of a glycerol alkyl ester represented by defined Formula (I) or a diglycerol alkyl ester represented by defined Formula (II). In a further embodiment, the method involves bringing a fiber aggregate or a film into contact with an external wound, wherein the fiber aggregate or the film each includes a thermoplastic resin and at least one compound of the glycerol alkyl ester or the diglycerol alkyl ester.Type: GrantFiled: December 31, 2018Date of Patent: July 13, 2021Assignee: MITSUI CHEMICALS, INC.Inventors: Naosuke Kunimoto, Kenichi Suzuki, Kouya Kojima, Akira Hasegawa, Yasufumi Tsuchiya, Jun Kamada, Satoshi Yamasaki, Goro Kuwamura, Daisuke Hasegawa
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Patent number: 10988647Abstract: The purpose of the present invention is to provide a semiconductor substrate manufacturing method, which prevents detachment of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding the semiconductor wafer; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and an aliphatic structure, wherein an amine equivalent weight is 4000 to 20000.Type: GrantFiled: April 19, 2018Date of Patent: April 27, 2021Assignee: MITSUI CHEMICALS, INC.Inventors: Jun Kamada, Kaichiro Haruta, Takashi Unezaki, Kiyomi Imagawa, Kenichi Fujii, Yasuhisa Kayaba, Kazuo Kohmura
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Publication number: 20200377772Abstract: The purpose of the present invention is to provide a semiconductor substrate manufacturing method, which prevents detachment of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding the semiconductor wafer; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and an aliphatic structure, wherein an amine equivalent weight is 4000 to 20000.Type: ApplicationFiled: April 19, 2018Publication date: December 3, 2020Applicant: Mitsui Chemicals, Inc.Inventors: Jun KAMADA, Kaichiro HARUTA, Takashi UNEZAKI, Kiyomi IMAGAWA, Kenichi FUJII, Yasuhisa KAYABA, Kazuo KOHMURA
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Publication number: 20200265169Abstract: The instruction code including an instruction code stored in the area where the encrypted instruction code is stored in a non-rewritable format is authenticated using a specific key which is specific to the core where the instruction code is executed or an authenticated key by a specific key to perform an encryption processing for the input and output data between the core and the outside.Type: ApplicationFiled: May 6, 2020Publication date: August 20, 2020Applicant: SOCIONEXT INC.Inventors: Seiji GOTO, Jun KAMADA, Taiji TAMIYA
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Publication number: 20200219823Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer, an unevenness-absorptive resin layer, and an adhesive resin layer in this order and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component such that the circuit forming surface is protected; and a step of forming an electromagnetic wave-shielding layer on the electronic component in a state of being attached to the adhesive laminated film.Type: ApplicationFiled: July 9, 2018Publication date: July 9, 2020Applicant: MITSUI CHEMICALS TOHCELLO, INC.Inventors: Takashi UNEZAKI, Jun KAMADA, Akimitsu MORIMOTO, Jin KINOSHITA
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Publication number: 20200219734Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer and an adhesive resin layer and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component; a step of back-grinding a surface of the electronic component opposite to the circuit forming surface in a state of being attached to the adhesive laminated film; a step of dicing the electronic component in a state of being attached to the adhesive laminated film; and a step of forming an electromagnetic wave-shielding layer on the separated electronic components in a state of being attached to the adhesive laminated film, in this order.Type: ApplicationFiled: July 9, 2018Publication date: July 9, 2020Applicant: MITSUI CHEMICALS TOHCELLO, INC.Inventors: Takashi UNEZAKI, Jun KAMADA, Akimitsu MORIMOTO, Jin KINOSHITA
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Patent number: 10685145Abstract: The instruction code including an instruction code stored in the area where the encrypted instruction code is stored in a non-rewritable format is authenticated using a specific key which is specific to the core where the instruction code is executed or an authenticated key by a specific key to perform an encryption processing for the input and output data between the core and the outside.Type: GrantFiled: April 12, 2019Date of Patent: June 16, 2020Assignee: SOCIONEXT INC.Inventors: Seiji Goto, Jun Kamada, Taiji Tamiya
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Publication number: 20200181457Abstract: Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.Type: ApplicationFiled: July 10, 2018Publication date: June 11, 2020Applicant: MITSUI CHEMICALS, INC.Inventors: Jun KAMADA, Tomoya MATAYOSHI, Michio ERIGUCHI, Kaichiro HARUTA, Kenichi FUJII, Takashi UNEZAKI, Kazuo KOHMURA
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Publication number: 20200168476Abstract: This method for producing a semiconductor device comprises: a first step wherein a plurality of semiconductor chips are affixed onto a supporting substrate such that circuit surfaces of the semiconductor chips face the supporting substrate; a second step wherein a plurality of sealed layers are formed at intervals by applying the sealing resin onto the semiconductor chips by three-dimensional modeling method, each sealed layer containing one or more semiconductor chips embedded in a sealing resin; a third step wherein the sealed layers are cured or solidified; and a fourth step wherein sealed bodies are obtained by separating the cured or solidified sealed layers from the supporting substrate.Type: ApplicationFiled: May 10, 2018Publication date: May 28, 2020Applicant: Mitsui Chemicals, Inc.Inventors: Jun KAMADA, Kaichiro HARUTA, Yasuhisa KAYABA, Kazuo KOHMURA, Yoichi KODAMA
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Publication number: 20200048515Abstract: A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(?O)OX groups in a molecule, in which from one to six of the three or more —C(?O)OX groups are —C(?O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group.Type: ApplicationFiled: April 24, 2018Publication date: February 13, 2020Applicant: Mitsui Chemicals, Inc.Inventors: Jun KAMADA, Kazuo KOHMURA, Yasuhisa KAYABA