Patents by Inventor Jun-Kyu Lee

Jun-Kyu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132436
    Abstract: Proposed is a compound represented by Formula 1, where R1 is an alkyl group having 9 to 30 carbon atoms, an alkenyl group having 9 to 30 carbon atoms, or an alkynyl group having 9 to 30 carbon atoms, R2 is hydrogen, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an alkynyl group having 2 to 10 carbon atoms, and R3 to R5 are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an alkynyl group having 2 to 10 carbon atoms. Alternatively, at least two of R3 to R5 are bonded together to form a hydrocarbon ring having 5 or 6 carbon atoms. In addition, proposed are a lube base oil and a lubricant composition comprising the compound.
    Type: Application
    Filed: August 9, 2023
    Publication date: April 25, 2024
    Inventors: Jun Soo SON, Nam Kyu BANG, Seung Eon LEE, Ji Su JEONG
  • Publication number: 20240118182
    Abstract: A glass stress test method includes breaking a glass, analyzing a shape of a crack of a broken portion of the glass in a plan view, finding a breakage origin of the glass based on the shape of the crack in the plan view, analyzing a cross-section of the breakage origin, and calculating a stress of the glass based on a cross-sectional analysis result of the breakage origin. The stress of the glass is calculated as a value proportional to a floor constant defined by a condition of a floor surface disposed when the glass is broken.
    Type: Application
    Filed: September 6, 2023
    Publication date: April 11, 2024
    Inventors: Min Ki KIM, Ji Hyun KO, Yong Kyu KANG, Jinsu NAM, Hyun Seung SEO, JUN HO LEE
  • Patent number: 11939334
    Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound having a structure according to Formula I, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: March 26, 2024
    Assignee: UPPTHERA, INC.
    Inventors: Soo Hee Ryu, Im Suk Min, Han Kyu Lee, Seong Hoon Kim, Hye Guk Ryu, Keum Young Kang, Sang Youn Kim, So Hyun Chung, Jun Kyu Lee, Gibbeum Lee
  • Publication number: 20240097218
    Abstract: Methods and systems for executing tracking and monitoring manufacturing data of a battery are disclosed. One method includes: receiving, by a server system, sensing data of the battery from a sensing system; generating, by the server system, mapping data based on the sensing data; generating, by the server system, identification data of the battery based on the sensing data; generating, by the server system, monitoring data of the battery based on the sensing data, the identification data, and the mapping data; and generating, by the server system, display data for displaying a simulated electrode of the battery on a graphical user interface based on the monitoring data of the battery.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: Min Kyu Sim, Jong Seok Park, Min Su Kim, Jae Hwan Lee, Ki Deok Han, Eun Ji Jo, Su Wan Park, Gi Yeong Jeon, June Hee Kim, Wi Dae Park, Dong Min Seo, Seol Hee Kim, Dong Yeop Lee, Jun Hyo Su, Byoung Eun Han, Seung Huh
  • Publication number: 20240092484
    Abstract: A tilt prop aircraft is provided, including a first longeron and a second longeron capable of tilting relatively to each other, a tilt actuator disposed on the second longeron, a first power transmission member rotated by the tilt actuator, a second power transmission member fixed to the first longeron and coupled to the first power transmission member to transmit a rotational movement of the first power transmission member by turning 90 degrees in different planes, a crank fixed to the second longeron and extending through a slot in the first longeron and protruding inwardly from the first longeron, and a connecting rod connected to the crank so as to be relatively rotatable to the crank, and connected to the pitch control rod.
    Type: Application
    Filed: August 15, 2023
    Publication date: March 21, 2024
    Applicant: KOREA AEROSPACE RESEARCH INSTITUTE
    Inventors: Jun Ho CHO, Myeong Kyu LEE, Seong Wook CHOI
  • Publication number: 20240075456
    Abstract: Provided is a method of preparing a superabsorbent polymer. More particularly, provided is a method of preparing a superabsorbent polymer, in which variations in centrifugal retention capacity of superabsorbent polymer particles to be prepared are reduced by controlling heat treatment temperature conditions in a surface crosslinking step, thereby improving absorption properties of the superabsorbent polymer finally prepared.
    Type: Application
    Filed: December 9, 2022
    Publication date: March 7, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Jin Woo Lee, Jun Kyu Kim, Changhun Kim
  • Patent number: 11918978
    Abstract: Provided is a method of preparing a superabsorbent polymer. More specifically, provided is a method of preparing a superabsorbent polymer capable of exhibiting improved initial absorbency and a rapid absorption rate by polymerizing monomers having acidic groups, of which part is neutralized with a basic material including potassium hydroxide, in the presence of an encapsulated foaming agent.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: March 5, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Seul Ah Lee, Gicheul Kim, Dae Woo Nam, Ki Hyun Kim, Jun Kyu Kim, Young Jae Hur
  • Patent number: 11911152
    Abstract: An apparatus for estimating a concentration of an analyte includes an optical sensor configured to emit light toward an object and receive light reflected from the object; and a processor configured to obtain a ratio of an absorption coefficient to a scattering coefficient based on the received light, obtain a first absorption spectrum of the object based on the obtained ratio, obtain a second absorption spectrum by eliminating a scattering correction spectrum from the first absorption spectrum, the scattering correction spectrum corresponding to a nonlinear change in the scattering coefficient according to a wavelength of the emitted light, and estimate a concentration of an analyte based on the second absorption spectrum.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun Ho Lee, Sang Kyu Kim
  • Patent number: 11912710
    Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound having a structure according to Formula I, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: February 27, 2024
    Assignee: UPPTHERA, INC.
    Inventors: Soo Hee Ryu, Im Suk Min, Han Kyu Lee, Seong Hoon Kim, Hye Guk Ryu, Keum Young Kang, Sang Youn Kim, So Hyun Chung, Jun Kyu Lee, Gibbeum Lee
  • Patent number: 11898188
    Abstract: The present disclosure relates to a mutant microorganism in which a glycerol catabolic pathway and a 1,3-PDO biosynthetic pathway are introduced into a microorganism incapable of using glycerol as a carbon source, and a method of producing 1,3-PDO using the same. According to the present disclosure, it is possible to produce 1,3-PDO while growing a mutant microorganism having 1,3-PDO production ability by using the inexpensive raw material glycerol as a single carbon source. Thus, the present disclosure is useful for the economical production of 1,3-PDO.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: February 13, 2024
    Assignees: HANWHA SOLUTIONS CORPORATION, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sang Yup Lee, Jae Sung Cho, Je Woong Kim, Yoo Sung Ko, Cindy Pricilia Surya Prabowo, Taehee Han, Euiduk Kim, Jae Won Choi, Changhee Cho, Jun Kyu Lee
  • Publication number: 20240038563
    Abstract: A substrate transfer device includes a housing accommodating a carrier for storing a substrate, a carrier lifter moving the carrier in a vertical direction relative to an upper surface of the housing, a vertical stabilization unit connected to a lower part of the carrier lifter and reducing a vertical vibration of the carrier, a rotation stabilization unit connected to a lower part of the vertical stabilization unit and reducing rotation of the carrier, and a carrier holder connected to a lower part of the rotation stabilization unit. The carrier holder holds the carrier. The vertical stabilization unit includes an upper plate connected to the carrier lifter, a lower plate connected to the rotation stabilization unit, and a buffer disposed between the upper plate and the lower plate. The buffer contracts or relaxes to reduce the vertical vibration of the carrier.
    Type: Application
    Filed: April 25, 2023
    Publication date: February 1, 2024
    Inventors: Jun Kyu LEE, Hongjin KIM, Jeongjae BANG
  • Patent number: 11825599
    Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) accommodated in a case, and more particularly, to an air-pocket prevention PCB, an air-pocket prevention PCB module, an electrical device including the same, and a manufacturing method of an electrical device including the same with improved fluidity of a resin material so that air pockets that may occur when the case is filled with the resin material are easily discharged and the resin material may be evenly filled inside the case.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: November 21, 2023
    Assignee: SOLUM CO., LTD.
    Inventors: Jun Kyu Lee, Jeong Man Han, Su Young Kim, Yong Woo Kang, Sang Keun Ji, Dong Kyun Ryu
  • Patent number: 11783989
    Abstract: A transformer includes: an upper primary substrate (110) which is formed by stacking a plurality of dielectric substrates, each substrate being provided with spiral conductive patterns; a lower secondary substrate (120) which is formed by stacking a plurality of dielectric substrates, each substrate being provided with spiral conductive patterns, in which the lower secondary substrate is positioned below the upper primary substrate (110) in such a way that the lower secondary substrate comes into contact with the upper primary substrate (110) or is spaced apart from the upper primary substrate (110); and a secondary coil element (200) of a planar shape to produce an induced current by a current applied to the upper primary substrate (110) and the lower primary substrate (120).
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: October 10, 2023
    Assignees: SOLUM CO., LTD., ATUM CO., LTD.
    Inventors: Eun Sik Kim, Jun Kyu Lee, Changyong Kwon, Dong-kyun Ryu, Sang-keun Ji, Taeksoo Han, Jung Soo Lee
  • Publication number: 20230242541
    Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.
    Type: Application
    Filed: August 10, 2022
    Publication date: August 3, 2023
    Applicant: UPPTHERA, INC.
    Inventors: Soo Hee Ryu, Im Suk Min, Han Kyu Lee, Seong Hoon Kim, Hye Guk Ryu, Keum Young Kang, Sang Youn Kim, So Hyun Chung, Jun Kyu Lee, Gibbeum Lee
  • Publication number: 20230219966
    Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.
    Type: Application
    Filed: August 10, 2022
    Publication date: July 13, 2023
    Applicant: UPPTHERA, INC.
    Inventors: Soo Hee Ryu, Im Suk Min, Han Kyu Lee, Seong Hoon Kim, Hye Guk Ryu, Keum Young Kang, Sang Youn Kim, So Hyun Chung, Jun Kyu Lee, Gibbeum Lee
  • Publication number: 20230078961
    Abstract: The present invention relates HMG-CoA reductase degradation inducing compounds. Specifically, the present invention relates a bifunctional compound in which a HMG-CoA reductase binding moiety and an E3 ubiquitin ligase-binding moiety are linked by a chemical linker. The present invention also relates a method for preparing the compounds, and a method for degradation of HMG-CoA reductase using the compounds, as well as use for prevention or treatment of HMG-CoA reductase related diseases using the compounds.
    Type: Application
    Filed: March 30, 2021
    Publication date: March 16, 2023
    Inventors: Si Woo CHOI, Soo Hee RYU, Ji Hoon RYU, San Ha SON, Hwa Jin LEE, Seong Hoon KIM, Eun Bin LEE, Hye Guk RYU, Im Suk MIN, Jun Kyu LEE
  • Patent number: 11476211
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a lower structure including a semiconductor chip having a chip terminal; an external connection terminal connecting the semiconductor chip to an external device; and an intermediate connection structure including an upper surface and a lower surface opposite to the upper surface, and positioned between the lower structure and the external connection terminal.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: October 18, 2022
    Assignee: NEPES CO., LTD.
    Inventors: Jun Kyu Lee, Su Yun Kim, Dong Hoon Oh, Yong Tae Kwon, Ju Hyun Nam
  • Patent number: 11450535
    Abstract: A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: September 20, 2022
    Assignee: NEPES CO., LTD.
    Inventors: Yong-Tae Kwon, Jun-Kyu Lee, Si Woo Lim, Dong-Hoon Oh, Jun-Sung Ma, Tae-Won Kim
  • Publication number: 20220278053
    Abstract: A technical idea of the present disclosure provides a semiconductor package, as a semiconductor package mounted on a circuit board, including: a body portion including a semiconductor chip, and a first surface and a second surface opposite to each other; and a structure including n insulating layers stacked on at least one of the first surface and the second surface of the body portion, wherein the semiconductor package has a predetermined target coefficient of thermal expansion (CTE), and the n insulating layers and the body portion have a thickness and a CTE satisfying a condition that an effective CTE of the semiconductor package becomes equal to the predetermined target CTE.
    Type: Application
    Filed: March 24, 2020
    Publication date: September 1, 2022
    Applicant: NEPES CO., LTD.
    Inventors: Ju Hyun NAM, Jun Kyu LEE, Yong Tae KWON, Su Yun KIM, Dong Hoon OH
  • Publication number: 20220183161
    Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.
    Type: Application
    Filed: August 10, 2021
    Publication date: June 9, 2022
    Inventors: Jun Kyu Lee, Jeong Man Han, Su Young Kim, Yong Woo Kang, Sang Keun Ji, Dong Kyun Ryu