Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.

Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.

Abstract: In some implementations, techniques may include at a plurality of times while a user of the first portable device is moving with the first portable device: performing ranging at a respective position with a second device to determine a respective distance, thereby determining a plurality of respective distances, where the second device is stationary; obtaining raw measurements from a motion sensor of the first portable device. In addition, the device may include using the raw measurements at the plurality of times to determine relative positions at the plurality of times, the relative position from an initial position. The techniques may include estimating a second position of the second device that optimizes a loss function that includes differences of the respective distances at the relative positions and the actual distance between the relative positions and the second position.

Abstract: The present invention relates to NLRP3 protein degradation inducing compounds. Specifically, the present invention provides a bifunctional compound in which an NLRP3 protein binding moiety and an E3 ubiquitin ligase binding moiety are connected by a chemical linker, a method for preparing the same, a method for degrading NLRP3 protein using the same, and the use for preventing or treating NLRP3 inflammasome-related diseases.

Abstract: A semiconductor package includes a semiconductor chip including a chip pad, a first insulating layer provided on the semiconductor chip and including a first via hole, a first wiring pattern provided on the first insulating layer and connected to the chip pad through the first via hole of the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring pattern and including a second via hole, and a second wiring pattern provided on the second insulating layer and connected to the first wiring pattern through the second via hole of the second insulating layer, wherein the first insulating layer includes a first upper surface in contact with the second insulating layer and a first lower surface opposite to the first upper surface, and the first upper surface of the first insulating layer has surface roughness greater that the first lower surface of the first insulating layer.

Abstract: A semiconductor package includes an upper structure including a semiconductor chip and a first molding layer for molding the semiconductor chip, a lower structure provided on the upper structure, the lower structure including a conductive post and a second molding layer for molding the conductive post, and a redistribution structure provided between the upper structure and the lower structure, the redistribution structure including a wiring pattern for electrically connecting a pad of the semiconductor chip to the conductive post, in which a thermal expansion coefficient of the second molding layer is different from a thermal expansion coefficient of the first molding layer.

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.

Abstract: The present invention relates to a novel compound that induces selective degradation of AURKA, and specifically provides a bifunctional compound in which an AURKA binding moiety and an E3 ubiquitin ligase binding moiety are linked by a chemical linker, a method for preparing same, and a use thereof. In addition, the compound according to the present invention can be effectively used for the prevention or treatment of AURKA-related diseases.

Abstract: An overhead hoist transport (OHT) device is provided.

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.

Abstract: Provided are an electric appliance and a method of manufacturing the same, the electric appliance having a smaller size and a reduced overall weight by preventing a fluid from flowing into a space unrelated to a heating component in a state where the fluid fills its case. The electric appliance includes: a case including a first space and a second space communicated to each other; a first component disposed in the first space; a second component disposed in the second space; a connection portion electrically connecting the first component and the second component to each other; and a potting pattern including a resin material and formed in the first space.

Abstract: Provided are an electric appliance and a method of manufacturing the same, the electric appliance having a smaller size and a reduced overall weight by preventing a fluid from flowing into a space unrelated to a heating component in a state where the fluid fills its case. The electric appliance includes: a case including a first space and a second space communicated to each other; a first component disposed in the first space; a second component disposed in the second space; a connection portion electrically connecting the first component and the second component to each other; and a potting pattern including a resin material and formed in the first space.

Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound having a structure according to Formula I, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.

Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound having a structure according to Formula I, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.

Abstract: The present disclosure relates to a mutant microorganism in which a glycerol catabolic pathway and a 1,3-PDO biosynthetic pathway are introduced into a microorganism incapable of using glycerol as a carbon source, and a method of producing 1,3-PDO using the same. According to the present disclosure, it is possible to produce 1,3-PDO while growing a mutant microorganism having 1,3-PDO production ability by using the inexpensive raw material glycerol as a single carbon source. Thus, the present disclosure is useful for the economical production of 1,3-PDO.

Abstract: A substrate transfer device includes a housing accommodating a carrier for storing a substrate, a carrier lifter moving the carrier in a vertical direction relative to an upper surface of the housing, a vertical stabilization unit connected to a lower part of the carrier lifter and reducing a vertical vibration of the carrier, a rotation stabilization unit connected to a lower part of the vertical stabilization unit and reducing rotation of the carrier, and a carrier holder connected to a lower part of the rotation stabilization unit. The carrier holder holds the carrier. The vertical stabilization unit includes an upper plate connected to the carrier lifter, a lower plate connected to the rotation stabilization unit, and a buffer disposed between the upper plate and the lower plate. The buffer contracts or relaxes to reduce the vertical vibration of the carrier.

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) accommodated in a case, and more particularly, to an air-pocket prevention PCB, an air-pocket prevention PCB module, an electrical device including the same, and a manufacturing method of an electrical device including the same with improved fluidity of a resin material so that air pockets that may occur when the case is filled with the resin material are easily discharged and the resin material may be evenly filled inside the case.

Abstract: A transformer includes: an upper primary substrate (110) which is formed by stacking a plurality of dielectric substrates, each substrate being provided with spiral conductive patterns; a lower secondary substrate (120) which is formed by stacking a plurality of dielectric substrates, each substrate being provided with spiral conductive patterns, in which the lower secondary substrate is positioned below the upper primary substrate (110) in such a way that the lower secondary substrate comes into contact with the upper primary substrate (110) or is spaced apart from the upper primary substrate (110); and a secondary coil element (200) of a planar shape to produce an induced current by a current applied to the upper primary substrate (110) and the lower primary substrate (120).

Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.

Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.