Patents by Inventor Jun Maeda

Jun Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973417
    Abstract: A voltage drop Vzs is calculated based on an output current detection value Iac and a virtual synchronous impedance Zs or a corrected virtual synchronous impedance Zs?, and a value obtained by subtracting the voltage drop Vzs from an internal induced voltage Ef is output as a grid voltage command value Vac*. Zs calculation unit 7 limits an output current phase ? so that the output current phase ? is within an effective range by a phase limiter 12a, and calculates the corrected virtual synchronous impedance Zs? based on a limited output current phase ?, the internal induced voltage Ef, a grid voltage detection value Vac and a current limit value Ilim. Accordingly, in grid interconnection power conversion device that controls a virtual synchronous generator, it is possible to continue operation while suppressing an overcurrent and possess a synchronizing power generated by action or working of a virtual synchronous impedance.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: April 30, 2024
    Assignees: TOKYO ELECTRIC POWER COMPANY HOLDINGS, INCORPORATED, MEIDENSHA CORPORATION
    Inventors: Kenichi Suzuki, Jun Takami, Ryota Samejima, Hideki Noda, Naoto Maeda, Toshiya Inoue, Kazu Shoji
  • Patent number: 11949705
    Abstract: An anomaly detection server is provided. The anomaly detection server is a server for counteracting an anomalous frame transmitted on an on-board network of a single vehicle. The anomaly detection server acquires information about multiple frames received on one or multiple on-board networks of one or multiple vehicles, including the single vehicle. The anomaly detection server, acting as an assessment unit that, based on the information about the multiple frames and information about a frame received on the on-board network of the single vehicle after the acquisition of the information about the multiple frames, assesses an anomaly level of the frame received on the on-board network of the single vehicle.
    Type: Grant
    Filed: January 6, 2023
    Date of Patent: April 2, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Tomoyuki Haga, Hideki Matsushima, Manabu Maeda, Yoshihiro Ujiie, Takeshi Kishikawa, Junichi Tsurumi, Jun Anzai
  • Patent number: 11942353
    Abstract: An adhesive tape for semiconductor processing, which includes a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23° C. and a rupture energy of 1-9 MJ/m3; and the Young's modulus of the base material at 23° C. is higher than the above-mentioned Young's modulus of the buffer layer.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: March 26, 2024
    Assignee: Lintec Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Publication number: 20240019347
    Abstract: An evaporative concentration mechanism is achieved, which accurately evaporates and concentrates a small quantity of a sample liquid for a short period of time, regardless of the composition of the sample liquid or the surrounding environmental conditions. The evaporative concentration mechanism includes a container that accommodates a sample liquid; a heating unit that heats the container; a liquid level sensor that detects a liquid level height of the sample liquid accommodated in the container; and a control unit that controls a temperature of the heating unit, in which the control unit controls the temperature of the heating unit based on a liquid level of the sample liquid detected by the liquid level sensor. Accordingly, a small quantity of a sample liquid can be accurately evaporated and concentrated for a short period of time, regardless of the composition of the sample liquid or the surrounding environmental conditions.
    Type: Application
    Filed: December 6, 2021
    Publication date: January 18, 2024
    Inventors: Sho IWASA, Jun MAEDA
  • Patent number: 11842916
    Abstract: A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m3.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: December 12, 2023
    Assignee: Lintec Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Publication number: 20230294046
    Abstract: A membrane treatment apparatus (1) comprising: a plurality of flat membrane elements (2) which are immersed in a liquid to be treated, disposed side by side in the first direction so that membrane surfaces face each other; a supporting member (8) for holding the flat membrane element (2) provided at an end part of the flat membrane element on a first side in the second direction; and an aeration means (10) provided below the flat membrane element (2); wherein a lower edge of the flat membrane element (2) is formed to extend upward from the first side to a second side in the second direction, or to extend upward and horizontally from the first side to the second side in the second direction.
    Type: Application
    Filed: October 11, 2021
    Publication date: September 21, 2023
    Inventors: Yasuhiro OKAWA, Yoichi OKUMURA, Hiroki TOMITA, Jun MAEDA, Hiroyuki KOBAYASHI
  • Publication number: 20230091683
    Abstract: The present invention relates to a liquid feeding apparatus capable of feeding a liquid with high accuracy. The liquid feeding apparatus includes a liquid feeder having a downstream side, a plunger, and a cylinder that is configured for aspirating and discharging a solvent when a plunger slides. The liquid feeding apparatus further includes a pressure sensor for the solvent to be discharged, a selector valve configured to switch between a plurality of solvents to be aspirated and discharged, and a controller configured to control the liquid feeder and the selector valve. The controller controls the selector valve in synchronization with an aspiration operation of the plunger so that a mixing ratio of the solvents changes, controls the plunger to cause the plunger to operate at first and second accelerations that are different from each other, and suppresses a fluctuation of the solvent to be aspirated by the plunger.
    Type: Application
    Filed: March 5, 2021
    Publication date: March 23, 2023
    Applicant: HITACHI HIGH-TECH CORPORATION
    Inventors: Daisuke Akieda, Nobuhiro Tsukada, Yusuke Yota, Yuichiro Hashimoto, Jun Maeda
  • Patent number: 11573729
    Abstract: A storage device communicably coupled to a host device and another storage device includes a memory and a processor coupled to the memory and configured to: write, in a case where an area release command of a transaction volume is issued from the host device while data backup processing is performed with the another storage device using a generation-managed transmission buffer, the area release command in a first generation of the transmission buffer; and switch, in a case where a range of data write processing requested by the host device overlaps a range specified by the area release command written in the first generation, a generation of the transmission buffer from the first generation to a second generation.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: February 7, 2023
    Assignee: FUJITSU LIMITED
    Inventor: Jun Maeda
  • Patent number: 11413585
    Abstract: A membrane element includes a filtration membrane and a flowpath member joined thereto. The flowpath member is made of yarn arranged into a three-dimensional structure, and includes inner spaces through which a permeated liquid permeated through the filtration membrane flows, and an outer bonding surface joined to the filtration membrane. At least part of the yarn forming the outer bonding surface is a low-melting point yarn having a softening point lower than that of a material forming the filtration membrane, or the yarn forming the outer bonding surface is formed by twisting a plurality of constituent yarns, and at least one of the constituent yarns is a low-melting point yarn having a softening point lower than that of the material forming the filtration membrane.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: August 16, 2022
    Assignee: KUBOTA CORPORATION
    Inventors: Shigeyuki Mori, Yoshio Matsuzaki, Jun Maeda, Yasuhiro Okawa
  • Patent number: 11322385
    Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: May 3, 2022
    Assignee: LINTEC Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Publication number: 20220091746
    Abstract: A storage device communicably coupled to a host device and another storage device includes a memory and a processor coupled to the memory and configured to: write, in a case where an area release command of a transaction volume is issued from the host device while data backup processing is performed with the another storage device using a generation-managed transmission buffer, the area release command in a first generation of the transmission buffer; and switch, in a case where a range of data write processing requested by the host device overlaps a range specified by the area release command written in the first generation, a generation of the transmission buffer from the first generation to a second generation.
    Type: Application
    Filed: July 9, 2021
    Publication date: March 24, 2022
    Applicant: FUJITSU LIMITED
    Inventor: Jun Maeda
  • Patent number: 11183416
    Abstract: The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E60) of 20-1000 MPa at 60° C.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: November 23, 2021
    Assignee: LINTEC Corporation
    Inventors: Kazuto Aizawa, Jun Maeda, Katsuhiko Horigome
  • Publication number: 20210270707
    Abstract: This chemical analysis device is provided with: a plurality of ultrasonic elements; a waveform generator which generates an ultrasonic waveform; a determiner which determines the positions and the number of ultrasonic elements to be driven from among the plurality of ultrasonic elements; a variable matching circuit which, on the basis of the determination result, matches impedance between the waveform generator and each of the ultrasonic elements to be driven; and a switch which selects the ultrasonic elements to be driven from among the plurality of the ultrasonic elements.
    Type: Application
    Filed: May 13, 2019
    Publication date: September 2, 2021
    Inventors: Yuusuke KOURAI, Kota SASAKI, Jun MAEDA, Azusa YAMADA, Tetsuyoshi ONO
  • Publication number: 20210265193
    Abstract: A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m3.
    Type: Application
    Filed: June 4, 2019
    Publication date: August 26, 2021
    Applicant: Lintec Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Publication number: 20210210372
    Abstract: An adhesive tape for semiconductor processing, which includes a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23° C. and a rupture energy of 1-9 MJ/m3; and the Young's modulus of the base material at 23° C. is higher than the above-mentioned Young's modulus of the buffer layer.
    Type: Application
    Filed: June 4, 2019
    Publication date: July 8, 2021
    Applicant: Lintec Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Publication number: 20210043492
    Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.
    Type: Application
    Filed: October 29, 2020
    Publication date: February 11, 2021
    Applicant: LINTEC Corporation
    Inventors: Kazuto AIZAWA, Jun MAEDA
  • Patent number: 10875492
    Abstract: A hinge base member (5) and a hinge upper member (15) of a hinge (1) for an engine hood (3) are provided with main bodies (5, 17) each having a laterally facing major plane, and link members (9, 10) are connected between the main bodies of the hinge base member and the hinge upper member and overlies the main bodies of the hinge base member and the hinge upper member from a first lateral side. The hinge upper member is provided with an extension (17) fixedly attached to the side part of the hood and extending forward from the main body of the hinge upper member with an offset to a second lateral side opposite to the first lateral side with respect to the main body of the hinge base member.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: December 29, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Jun Maeda, Osamu Ito
  • Patent number: 10854495
    Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: December 1, 2020
    Assignee: LINTEC Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Publication number: 20200324251
    Abstract: A membrane element includes a filtration membrane and a flowpath member joined thereto. The flowpath member is made of yarn arranged into a three-dimensional structure, and includes inner spaces through which a permeated liquid permeated through the filtration membrane flows, and an outer bonding surface joined to the filtration membrane. At least part of the yarn forming the outer bonding surface is a low-melting point yarn having a softening point lower than that of a material forming the filtration membrane, or the yarn forming the outer bonding surface is formed by twisting a plurality of constituent yarns, and at least one of the constituent yarns is a low-melting point yarn having a softening point lower than that of the material forming the filtration membrane.
    Type: Application
    Filed: June 25, 2020
    Publication date: October 15, 2020
    Inventors: Shigeyuki MORI, Yoshio MATSUZAKI, Jun MAEDA, Yasuhiro OKAWA
  • Patent number: RE49111
    Abstract: [Problem] To provide a compound which is useful as an active ingredient for a pharmaceutical composition for preventing or treating urine storage dysfunction, voiding dysfunction, lower urinary tract dysfunction, and the like. [Means for Solution] The present inventors have found that a thiazole derivative substituted with pyrazinylcarbonylamino at the 2-position is an excellent muscarinic M3 receptor-positive allosteric modulator and is expected as an agent for preventing or treating bladder/urinary tract diseases associated with bladder contractions via a muscarinic M3 receptor, thereby completing the present invention. 2-Acylaminothiazole derivative or a salt thereof of the present invention is expected as an agent for preventing or treating bladder/urinary tract diseases associated with bladder contractions via a muscarinic M3 receptor, for example voiding dysfunction such as underactive bladder.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: June 21, 2022
    Assignee: ASTELLAS PHARMA INC.
    Inventors: Taisuke Takahashi, Takanori Koike, Kenji Negoro, Hiroaki Tanaka, Jun Maeda, Kazuhiro Yokoyama, Hajime Takamatsu