Patents by Inventor Jun Maeda
Jun Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11973417Abstract: A voltage drop Vzs is calculated based on an output current detection value Iac and a virtual synchronous impedance Zs or a corrected virtual synchronous impedance Zs?, and a value obtained by subtracting the voltage drop Vzs from an internal induced voltage Ef is output as a grid voltage command value Vac*. Zs calculation unit 7 limits an output current phase ? so that the output current phase ? is within an effective range by a phase limiter 12a, and calculates the corrected virtual synchronous impedance Zs? based on a limited output current phase ?, the internal induced voltage Ef, a grid voltage detection value Vac and a current limit value Ilim. Accordingly, in grid interconnection power conversion device that controls a virtual synchronous generator, it is possible to continue operation while suppressing an overcurrent and possess a synchronizing power generated by action or working of a virtual synchronous impedance.Type: GrantFiled: August 6, 2020Date of Patent: April 30, 2024Assignees: TOKYO ELECTRIC POWER COMPANY HOLDINGS, INCORPORATED, MEIDENSHA CORPORATIONInventors: Kenichi Suzuki, Jun Takami, Ryota Samejima, Hideki Noda, Naoto Maeda, Toshiya Inoue, Kazu Shoji
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Patent number: 11949705Abstract: An anomaly detection server is provided. The anomaly detection server is a server for counteracting an anomalous frame transmitted on an on-board network of a single vehicle. The anomaly detection server acquires information about multiple frames received on one or multiple on-board networks of one or multiple vehicles, including the single vehicle. The anomaly detection server, acting as an assessment unit that, based on the information about the multiple frames and information about a frame received on the on-board network of the single vehicle after the acquisition of the information about the multiple frames, assesses an anomaly level of the frame received on the on-board network of the single vehicle.Type: GrantFiled: January 6, 2023Date of Patent: April 2, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICAInventors: Tomoyuki Haga, Hideki Matsushima, Manabu Maeda, Yoshihiro Ujiie, Takeshi Kishikawa, Junichi Tsurumi, Jun Anzai
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Patent number: 11942353Abstract: An adhesive tape for semiconductor processing, which includes a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23° C. and a rupture energy of 1-9 MJ/m3; and the Young's modulus of the base material at 23° C. is higher than the above-mentioned Young's modulus of the buffer layer.Type: GrantFiled: June 4, 2019Date of Patent: March 26, 2024Assignee: Lintec CorporationInventors: Kazuto Aizawa, Jun Maeda
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Publication number: 20240019347Abstract: An evaporative concentration mechanism is achieved, which accurately evaporates and concentrates a small quantity of a sample liquid for a short period of time, regardless of the composition of the sample liquid or the surrounding environmental conditions. The evaporative concentration mechanism includes a container that accommodates a sample liquid; a heating unit that heats the container; a liquid level sensor that detects a liquid level height of the sample liquid accommodated in the container; and a control unit that controls a temperature of the heating unit, in which the control unit controls the temperature of the heating unit based on a liquid level of the sample liquid detected by the liquid level sensor. Accordingly, a small quantity of a sample liquid can be accurately evaporated and concentrated for a short period of time, regardless of the composition of the sample liquid or the surrounding environmental conditions.Type: ApplicationFiled: December 6, 2021Publication date: January 18, 2024Inventors: Sho IWASA, Jun MAEDA
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Patent number: 11842916Abstract: A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m3.Type: GrantFiled: June 4, 2019Date of Patent: December 12, 2023Assignee: Lintec CorporationInventors: Kazuto Aizawa, Jun Maeda
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Publication number: 20230294046Abstract: A membrane treatment apparatus (1) comprising: a plurality of flat membrane elements (2) which are immersed in a liquid to be treated, disposed side by side in the first direction so that membrane surfaces face each other; a supporting member (8) for holding the flat membrane element (2) provided at an end part of the flat membrane element on a first side in the second direction; and an aeration means (10) provided below the flat membrane element (2); wherein a lower edge of the flat membrane element (2) is formed to extend upward from the first side to a second side in the second direction, or to extend upward and horizontally from the first side to the second side in the second direction.Type: ApplicationFiled: October 11, 2021Publication date: September 21, 2023Inventors: Yasuhiro OKAWA, Yoichi OKUMURA, Hiroki TOMITA, Jun MAEDA, Hiroyuki KOBAYASHI
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Publication number: 20230091683Abstract: The present invention relates to a liquid feeding apparatus capable of feeding a liquid with high accuracy. The liquid feeding apparatus includes a liquid feeder having a downstream side, a plunger, and a cylinder that is configured for aspirating and discharging a solvent when a plunger slides. The liquid feeding apparatus further includes a pressure sensor for the solvent to be discharged, a selector valve configured to switch between a plurality of solvents to be aspirated and discharged, and a controller configured to control the liquid feeder and the selector valve. The controller controls the selector valve in synchronization with an aspiration operation of the plunger so that a mixing ratio of the solvents changes, controls the plunger to cause the plunger to operate at first and second accelerations that are different from each other, and suppresses a fluctuation of the solvent to be aspirated by the plunger.Type: ApplicationFiled: March 5, 2021Publication date: March 23, 2023Applicant: HITACHI HIGH-TECH CORPORATIONInventors: Daisuke Akieda, Nobuhiro Tsukada, Yusuke Yota, Yuichiro Hashimoto, Jun Maeda
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Patent number: 11573729Abstract: A storage device communicably coupled to a host device and another storage device includes a memory and a processor coupled to the memory and configured to: write, in a case where an area release command of a transaction volume is issued from the host device while data backup processing is performed with the another storage device using a generation-managed transmission buffer, the area release command in a first generation of the transmission buffer; and switch, in a case where a range of data write processing requested by the host device overlaps a range specified by the area release command written in the first generation, a generation of the transmission buffer from the first generation to a second generation.Type: GrantFiled: July 9, 2021Date of Patent: February 7, 2023Assignee: FUJITSU LIMITEDInventor: Jun Maeda
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Patent number: 11413585Abstract: A membrane element includes a filtration membrane and a flowpath member joined thereto. The flowpath member is made of yarn arranged into a three-dimensional structure, and includes inner spaces through which a permeated liquid permeated through the filtration membrane flows, and an outer bonding surface joined to the filtration membrane. At least part of the yarn forming the outer bonding surface is a low-melting point yarn having a softening point lower than that of a material forming the filtration membrane, or the yarn forming the outer bonding surface is formed by twisting a plurality of constituent yarns, and at least one of the constituent yarns is a low-melting point yarn having a softening point lower than that of the material forming the filtration membrane.Type: GrantFiled: June 25, 2020Date of Patent: August 16, 2022Assignee: KUBOTA CORPORATIONInventors: Shigeyuki Mori, Yoshio Matsuzaki, Jun Maeda, Yasuhiro Okawa
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Patent number: 11322385Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.Type: GrantFiled: October 29, 2020Date of Patent: May 3, 2022Assignee: LINTEC CorporationInventors: Kazuto Aizawa, Jun Maeda
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Publication number: 20220091746Abstract: A storage device communicably coupled to a host device and another storage device includes a memory and a processor coupled to the memory and configured to: write, in a case where an area release command of a transaction volume is issued from the host device while data backup processing is performed with the another storage device using a generation-managed transmission buffer, the area release command in a first generation of the transmission buffer; and switch, in a case where a range of data write processing requested by the host device overlaps a range specified by the area release command written in the first generation, a generation of the transmission buffer from the first generation to a second generation.Type: ApplicationFiled: July 9, 2021Publication date: March 24, 2022Applicant: FUJITSU LIMITEDInventor: Jun Maeda
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Patent number: 11183416Abstract: The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E60) of 20-1000 MPa at 60° C.Type: GrantFiled: September 26, 2017Date of Patent: November 23, 2021Assignee: LINTEC CorporationInventors: Kazuto Aizawa, Jun Maeda, Katsuhiko Horigome
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Publication number: 20210270707Abstract: This chemical analysis device is provided with: a plurality of ultrasonic elements; a waveform generator which generates an ultrasonic waveform; a determiner which determines the positions and the number of ultrasonic elements to be driven from among the plurality of ultrasonic elements; a variable matching circuit which, on the basis of the determination result, matches impedance between the waveform generator and each of the ultrasonic elements to be driven; and a switch which selects the ultrasonic elements to be driven from among the plurality of the ultrasonic elements.Type: ApplicationFiled: May 13, 2019Publication date: September 2, 2021Inventors: Yuusuke KOURAI, Kota SASAKI, Jun MAEDA, Azusa YAMADA, Tetsuyoshi ONO
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Publication number: 20210265193Abstract: A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m3.Type: ApplicationFiled: June 4, 2019Publication date: August 26, 2021Applicant: Lintec CorporationInventors: Kazuto Aizawa, Jun Maeda
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Publication number: 20210210372Abstract: An adhesive tape for semiconductor processing, which includes a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23° C. and a rupture energy of 1-9 MJ/m3; and the Young's modulus of the base material at 23° C. is higher than the above-mentioned Young's modulus of the buffer layer.Type: ApplicationFiled: June 4, 2019Publication date: July 8, 2021Applicant: Lintec CorporationInventors: Kazuto Aizawa, Jun Maeda
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Publication number: 20210043492Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.Type: ApplicationFiled: October 29, 2020Publication date: February 11, 2021Applicant: LINTEC CorporationInventors: Kazuto AIZAWA, Jun MAEDA
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Patent number: 10875492Abstract: A hinge base member (5) and a hinge upper member (15) of a hinge (1) for an engine hood (3) are provided with main bodies (5, 17) each having a laterally facing major plane, and link members (9, 10) are connected between the main bodies of the hinge base member and the hinge upper member and overlies the main bodies of the hinge base member and the hinge upper member from a first lateral side. The hinge upper member is provided with an extension (17) fixedly attached to the side part of the hood and extending forward from the main body of the hinge upper member with an offset to a second lateral side opposite to the first lateral side with respect to the main body of the hinge base member.Type: GrantFiled: March 25, 2019Date of Patent: December 29, 2020Assignee: HONDA MOTOR CO., LTD.Inventors: Jun Maeda, Osamu Ito
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Patent number: 10854495Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.Type: GrantFiled: September 29, 2017Date of Patent: December 1, 2020Assignee: LINTEC CorporationInventors: Kazuto Aizawa, Jun Maeda
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Publication number: 20200324251Abstract: A membrane element includes a filtration membrane and a flowpath member joined thereto. The flowpath member is made of yarn arranged into a three-dimensional structure, and includes inner spaces through which a permeated liquid permeated through the filtration membrane flows, and an outer bonding surface joined to the filtration membrane. At least part of the yarn forming the outer bonding surface is a low-melting point yarn having a softening point lower than that of a material forming the filtration membrane, or the yarn forming the outer bonding surface is formed by twisting a plurality of constituent yarns, and at least one of the constituent yarns is a low-melting point yarn having a softening point lower than that of the material forming the filtration membrane.Type: ApplicationFiled: June 25, 2020Publication date: October 15, 2020Inventors: Shigeyuki MORI, Yoshio MATSUZAKI, Jun MAEDA, Yasuhiro OKAWA
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Patent number: RE49111Abstract: [Problem] To provide a compound which is useful as an active ingredient for a pharmaceutical composition for preventing or treating urine storage dysfunction, voiding dysfunction, lower urinary tract dysfunction, and the like. [Means for Solution] The present inventors have found that a thiazole derivative substituted with pyrazinylcarbonylamino at the 2-position is an excellent muscarinic M3 receptor-positive allosteric modulator and is expected as an agent for preventing or treating bladder/urinary tract diseases associated with bladder contractions via a muscarinic M3 receptor, thereby completing the present invention. 2-Acylaminothiazole derivative or a salt thereof of the present invention is expected as an agent for preventing or treating bladder/urinary tract diseases associated with bladder contractions via a muscarinic M3 receptor, for example voiding dysfunction such as underactive bladder.Type: GrantFiled: April 23, 2020Date of Patent: June 21, 2022Assignee: ASTELLAS PHARMA INC.Inventors: Taisuke Takahashi, Takanori Koike, Kenji Negoro, Hiroaki Tanaka, Jun Maeda, Kazuhiro Yokoyama, Hajime Takamatsu