Abstract: The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.

Abstract: The present invention provides a white film comprising a thermoplastic resin composition containing 25-100 parts by mass of an inorganic filler based on 100 parts by mass of a thermoplastic resin, wherein the average reflectance at a wavelength of 400-800 nm is 70% or more, the average linear expansion coefficient in the machine direction and the transverse direction is 35×10?6/° C. or less, and the decreasing rate in reflectance at a wavelength of 470 nm after thermal treatment at 200° C. for 4 hours is 10% or less; and the invention provides a metal laminated body. These exhibit high thermal resistance, high reflectance within visual light range, and small decrease in reflectance under a high heat load environment, but also be applicable for a large sized printed circuit boards for mounting LEDs.

Abstract: A device includes: a providing unit that provides a driving electric current to a semiconductor laser, the electric current being superimposed a first alternating current signal having a first frequency at a low side of an operational range of the semiconductor laser and a second alternating current signal having a second frequency at a high side of the operational range; a first filter that extracts a first component corresponding to the first frequency from a voltage to be applied to the semiconductor laser; a second filter that extracts a second component corresponding to the second frequency from the voltage to be applied to the semiconductor laser; and a judge circuit that judges a state of the semiconductor laser based on a first differential resistance obtained from the result of the extracting by the first filter and a second differential resistance obtained from the result of the extracting by the second filter.

Abstract: An optical connector includes a fiber-support block configured to couple cores of a plurality of optical fibers, and a lens-support block including a contact surface provided with a plurality of openings, the contact surface contacted to a contact surface of the fiber-support block, the cores of the optical fibers projecting from the contact surface of the fiber-support block insertable into the respective openings, the lens-support block having pairs of collimate lenses and convex lenses in the respective openings, each of the collimate lenses and a corresponding one of the convex lenses being spaced apart from each other in an optical-axis direction, the collimate lenses being movable in the optical-axis direction and being pressed by elastically deformable members, respectively, in the optical-axis direction and toward the contact surface of the fiber-support block.

Abstract: A piston for an internal combustion engine including: a piston head located at an uppermost section of the piston; a land located on a circumference of the piston head; a skirt located below the land; and a pair of pin bosses located on the lower section of the piston head. The piston head has a first cavity on the bottom of the piston head. Each of the pair of pin bosses has a second cavity in an outer upper section of the pin boss. The pin boss has a through hole that communicably connects the first cavity with the second cavity.

Abstract: A first wiring board, which is a flexible printed-circuit board, is bonded to a second wiring board. A plurality of protruding member are formed on the surface of the second wiring board. An adhesive is deposited on the surface of the second wiring board such that there is a thinner layer of the adhesive on the protruding member than in other areas. Subsequently, the first wiring board is placed on the second wiring board so that a portion of the first wiring board to be used for the wire-bonding is positioned above at least one of the protruding members. The first wiring board gets bonded to the second wiring board due to the adhesive.

Abstract: A housing of the present invention can house an electronic device therein and is provided with a cable housing capable of housing a part of a cable. The cable housing is formed of a depression and a protrusion extending out from a part of a first sidewall of the depression toward a fourth sidewall of the depression along a second sidewall, a third sidewall, and a bottom wall of the depression. At a boundary portion between a housing area and a passing area, a distance between the second sidewall and the third sidewall in the housing area is longer than a distance between the second sidewall and the third sidewall in the passing area.

Abstract: The release mechanism includes a guide body adapted to support a guide wall of the electronic device unit, and a locking mechanism adapted to lock the electronic device unit supported on the guide body. The locking mechanism includes an elastic piece projecting in cantilever fashion from an end of the guide body, an operating projection that projects from the elastic piece, and an engaging protrusion that protrudes from the elastic piece and that is adapted to intrude into a screw hole in the electronic device unit to thereby restrict sliding of the electronic device unit. The operating projection is formed with larger size than the engaging protrusion so that under conditions of induced flexure of the elastic piece the engaging protrusion disengages from the screw hole, and during sliding of the electronic device unit does not contact the guide wall.

Abstract: The present invention provides a multilayer wiring substrate comprising: a plurality of wiring substrate laminated each other; and a cavity portion. In the multilayer wiring substrate, a wiring substrate 1 being arranged along the bottom face of the cavity portion and a wiring substrate 2 being arranged at an upper layer side of the wiring substrate 1, the wiring substrate 1 and/or the wiring substrate 2 respectively comprising an insulating base material having a predetermined properties, the wiring substrate 2 being provided with a cavity hole. Thus, it is possible to provide a multilayer wiring substrate having a cavity portion and even a function of reflector.

Abstract: Electrical connection is established by bringing solder bumps formed as electrical connecting terminals of an electronic part and spiral contactors formed as electrical contactors of a circuit substrate into contact with each other. The solder bumps are formed such that heights thereof relative to a surface on which the solder bumps are formed are different from each other.

Abstract: In a structure of mounting an electronic device into a housing according to the present invention, the electronic device has the following structure. First and second storage devices are connected to respective connecting parts provided on a substrate. Convex portions provided on a first supporting member are fitted from above into a gap between the first storage device and the substrate and a gap between the second storage device and the substrate, respectively. Convex portions provided on a second supporting member are fitted from below into the gap between the first storage device and the substrate and the gap between the second storage device and the substrate, respectively. The electronic device into which the first and second supporting members are fitted is inserted into the housing from an opening thereof, and fixed within the housing by the housing and a cover.

Abstract: The present invention provides a white film comprising a thermoplastic resin composition containing 25-100 parts by mass of an inorganic filler based on 100 parts by mass of a thermoplastic resin, wherein the average reflectance at a wavelength of 400-800 nm is 70% or more, the average linear expansion coefficient in the machine direction and the transverse direction is 35×10?6/° C. or less, and the decreasing rate in reflectance at a wavelength of 470 nm after thermal treatment at 200° C. for 4 hours is 10% or less; and the invention provides a metal laminated body. These exhibit high thermal resistance, high reflectance within visual light range, and small decrease in reflectance under a high heat load environment, but also be applicable for a large sized printed circuit boards for mounting LEDs.

Abstract: An optical module according to the present invention comprises an electric wiring substrate, a first optical element mounted on the electric wiring substrate so that a heat generation section of the first optical element is positioned relatively close to a substrate surface of the electric wiring substrate and a heat sink mounted on the same plane as the mounting plane of the first optical element on the electric wiring substrate, the heat sink being mounted on the electric wiring substrate so that an area of electric wiring on the electric wiring substrate overlaps the heat sink. This improves the efficiency of heat radiation of the optical module.

Abstract: A housing of the present invention can house an electronic device therein and is provided with a cable housing capable of housing a part of a cable. The cable housing is formed of a depression and a protrusion extending out from a part of a first sidewall of the depression toward a fourth sidewall of the depression along a second sidewall, a third sidewall, and a bottom wall of the depression. At a boundary portion between a housing area and a passing area, a distance between the second sidewall and the third sidewall in the housing area is longer than a distance between the second sidewall and the third sidewall in the passing area.

Abstract: In a structure of mounting an electronic device into a housing according to the present invention, the electronic device has the following structure. First and second storage devices are connected to respective connecting parts provided on a substrate. Convex portions provided on a first supporting member are fitted from above into a gap between the first storage device and the substrate and a gap between the second storage device and the substrate, respectively. Convex portions provided on a second supporting member are fitted from below into the gap between the first storage device and the substrate and the gap between the second storage device and the substrate, respectively. The electronic device into which the first and second supporting members are fitted is inserted into the housing from an opening thereof, and fixed within the housing by the housing and a cover.

Abstract: An optical module includes a photoelectric element that performs a conversion between an optical signal and an electric signal; a body having a first surface and a second surface, the first surface and the second surface being continued and adjacent to each other; and an electric circuit board that is mounted on the body, the electric circuit board having a bending portion that is bent along the first surface and the second surface. The photoelectric element is mounted on one portion arranged on the first surface bordering on the bending portion. An electric wiring board on which a wiring unit for an external connection is formed is mounted on other portion arranged on the second surface.

Abstract: A piston (10) for an internal combustion engine including: a piston head (11) located at an uppermost section of the piston; a land (12) located on a circumference of the piston head (11); a skirt (13) located below the land (12); and a pair of pin bosses (14) located on the lower section of the piston head (11). The piston head (11) has a first cavity (24) on the bottom of the piston bead (11). Each of the pair of pin bosses (14) has a second cavity (20) in an outer upper section of the pin boss (14). The pin boss (14) has a through hole (21) that communicably connects the first cavity (24) with the second cavity (20).

Abstract: The present invention provides substrate 10, capable of transmitting lights in thickness direction for enhancing usefulness of the substrate. Its object is to provide a substrate adapted for interconnecting optical elements, allowing reduction of number of components leading to miniaturization and low cost, and high-efficient and stable optical coupling leading to low electric power dissipation. To accomplish the object the substrate comprises substrate body, wherein it is comprised of electric wiring layer disposed on first substrate body surface in such a manner as to be capable of electrically connecting first optical element mounted on the side of first substrate body surface; and optical transmission path, propagating lights being transmitted and received between first optical element electrically connected at electric wiring layer and second optical element disposed on the side of second substrate body surface different from first substrate body surface in substrate body.

Abstract: The present invention is to present a sample analyzer which is capable of separate and dispose of the reaction container and the reaction liquid respectively even when magnetic particles are included in a reagent. The sample analyzer 1 comprises: a detector 16 for detecting the target substance by using a cuvette 300 which contains the target substance captured by the magnetic particle; an adsorption section 183 for magnetically adsorbing the magnetic particle in the cuvette 300; a liquid aspiration section 18 for aspirating a liquid in the cuvette 300 in a state in which the magnetic particle in the cuvette 300 is magnetically adsorbed by the adsorption section 183; and a disposal section 19 for accommodating the cuvette 300.