Abstract: An optical module according to the present invention comprises an electric wiring substrate, a first optical element mounted on the electric wiring substrate so that a heat generation section of the first optical element is positioned relatively close to a substrate surface of the electric wiring substrate and a heat sink mounted on the same plane as the mounting plane of the first optical element on the electric wiring substrate, the heat sink being mounted on the electric wiring substrate so that an area of electric wiring on the electric wiring substrate overlaps the heat sink. This improves the efficiency of heat radiation of the optical module.

Abstract: A multiplexer-demultiplexer includes a first lens, a multilayer filter, and a second lens. The first lens is positioned to collimate a multi-wavelength light having various wavelengths. The multilayer filter includes multiple filter films each arranged at a different angle, is positioned such that collimated multi-wavelength light enters and/or exits at an angle, separates the collimated multi-wavelength light into single-wavelength light according to wavelength, and reflects each of the single-wavelength light. The second lens is positioned to converge each of the single-wavelength lights separated by the multilayer filter at a different position.

Abstract: Electrical connection is established by bringing solder bumps formed as electrical connecting terminals of an electronic part and spiral contactors formed as electrical contactors of a circuit substrate into contact with each other. The solder bumps are formed such that heights thereof relative to a surface on which the solder bumps are formed are different from each other.

Abstract: A first wiring board, which is a flexible printed-circuit board, is bonded to a second wiring board. A plurality of protruding member are formed on the surface of the second wiring board. An adhesive is deposited on the surface of the second wiring board such that there is a thinner layer of the adhesive on the protruding member than in other areas. Subsequently, the first wiring board is placed on the second wiring board so that a portion of the first wiring board to be used for the wire-bonding is positioned above at least one of the protruding members. The first wiring board gets bonded to the second wiring board due to the adhesive.

Abstract: A method for manufacturing a device where an improvement of etching accuracy and curtailing of manufacturing costs are realized when a device is manufactured attended with etching, such as RIE, in which a device; i.e., an object of etching, evolves heat. The method includes a coating step of applying over the surface of a device a photosensitive resin containing a phenol-based resin as a main ingredient; a transfer step of transferring a desired pattern on a device surface coated with the photosensitive resin by means of exposing the device surface coated with the photosensitive resin to light with the desired pattern; a development step of subjecting to development treatment the device having the pattern transferred thereon; and an etching step of etching the device surface while the pattern of the photosensitive resin developed through the development treatment is taken as a mask pattern.

Abstract: An optical module includes a photoelectric element that performs a conversion between an optical signal and an electric signal; a body having a first surface and a second surface, the first surface and the second surface being continued and adjacent to each other; and an electric circuit board that is mounted on the body, the electric circuit board having a bending portion that is bent along the first surface and the second surface. The photoelectric element is mounted on one portion arranged on the first surface bordering on the bending portion. An electric wiring board on which a wiring unit for an external connection is formed is mounted on other portion arranged on the second surface.

Abstract: The present invention provides substrate 10, capable of transmitting lights in thickness direction for enhancing usefulness of the substrate. Its object is to provide a substrate adapted for interconnecting optical elements, allowing reduction of number of components leading to miniaturization and low cost, and high-efficient and stable optical coupling leading to low electric power dissipation. To accomplish the object the substrate comprises substrate body, wherein it is comprised of electric wiring layer disposed on first substrate body surface in such a manner as to be capable of electrically connecting first optical element mounted on the side of first substrate body surface; and optical transmission path, propagating lights being transmitted and received between first optical element electrically connected at electric wiring layer and second optical element disposed on the side of second substrate body surface different from first substrate body surface in substrate body.

Abstract: According to the present invention, there is provided an optical module made up of an optical element, a protective component for protecting an optical transmission medium to be optically coupled to the optical element and an electric wiring formed on the protective component in conjunction with the optical element. This can reduce the number of principal components constituting the optical module, which realizes a small-size and low-cost optical module.

Abstract: A method for manufacturing a device where an improvement of etching accuracy and curtailing of manufacturing costs are realized when a device is manufactured attended with etching, such as RIE, in which a device; i.e., an object of etching, evolves heat. The method includes a coating step of applying over the surface of a device a photosensitive resin containing a phenol-based resin as a main ingredient; a transfer step of transferring a desired pattern on a device surface coated with the photosensitive resin by means of exposing the device surface coated with the photosensitive resin to light with the desired pattern; a development step of subjecting to development treatment the device having the pattern transferred thereon; and an etching step of etching the device surface while the pattern of the photosensitive resin developed through the development treatment is taken as a mask pattern.

Abstract: A mask 11 has a plurality of holes formed at positions corresponding to positions of a plurality of electrode portions 10a on one surface of an object to be processed 10 to mount thereon conductive particles 13, and the plurality of holes are opposite to the plurality of electrode portions 10a formed on the object to be processed. A table 12 has a plurality of holes 12a for sucking the object to be processed 10 from the other surface of the object to be processed 10, and for sucking the particles 13 through the plurality of holes 11a in the mask 11 so that the particles 13 may be mounted on the electrode portions 10a formed on the object to be processed 10. A hopper 14 contains therein the plurality of conductive particles 13, prevents the plurality of conductive particles 13 from adhering to each other, and has a slit portion 17 for dropping the plurality of conductive particles 13 by the self-weight.

Abstract: A mask 11 has a plurality of holes formed at positions corresponding to positions of a plurality of electrode portions 10a on one surface of an object to be processed 10 to mount thereon conductive particles 13, and the plurality of holes are opposite to the plurality of electrode portions 10a formed on the object to be processed. A table 12 has a plurality of holes 12a for sucking the object to be processed 10 from the other surface of the object to be processed 10, and for sucking the particles 13 through the plurality of holes 11a in the mask 11 so that the particles 13 may be mounted on the electrode portions 10a formed on the object to be processed 10. A hopper 14 contains therein the plurality of conductive particles 13, prevents the plurality of conductive particles 13 from adhering to each other, and has a slit portion 17 for dropping the plurality of conductive particles 13 by the self-weight.

Abstract: A method for evaluating an artificial receptor includes subjecting a functional monomer and a crosslinker in the presence of a template substance in a vessel into polymerization, thereby forming a resultant polymer with the template substance usually in the form of a thin film, dissociating the template substance from the polymer and removing it from the vessel by washing an inside of the vessel, thereby to prepare an artificial receptor, feeding a solution of the same or different template substance into the vessel to associate the template substance with the resulting polymer; then determining the amount of the template substance remaining in the vessel, and evaluating the artificial receptor on the basis of a determination result.